SN74LVC1G175
- Available in the Texas Instruments
NanoFree™ Package - Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Supports Down Translation to VCC
- Max tpd of 4.3 ns at 3.3 V
- Low Power Consumption, 10-µA Max ICC
- ±24-mA Output Drive at 3.3 V
- Ioff Supports Live Insertion, Partial-Power-Down
Mode, and Back-Drive Protection - Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II - ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
This single D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G175 device has an asynchronous clear (CLR) input. When CLR is high, data from the input pin (D) is transferred to the output pin (Q) on the clock's (CLK) rising edge. When CLR is low, Q is forced into the low state, regardless of the clock edge or data on D.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
您可能會感興趣的類似產品
可直接投入的替代產品,相較於所比較的裝置,具備升級功能
技術文件
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
5-8-LOGIC-EVM — 適用於 5 針腳至 8 針腳 DCK、DCT、DCU、DRL 和 DBV 封裝的通用邏輯評估模組
TIDA-01081 — 機械視覺的 LED 照明控制參考設計
TIDA-01393 — 適合 Xilinx® Zynq® UltraScale+™ MPSoC 應用的電源參考設計
各種版本的 TPS65086x PMIC 允許此設計為裝置供電,從搭載雙核心 ARM® Cortex®-A53 應用處理器與雙核心 ARM Cortex R5 即時處理器的基本 ZU2CG 裝置,到高端 ZU7EV、ZU19EG 與 ZU21DR 裝置,其會新增其他元件至 MPSoC,例如圖形處理單元、視訊轉碼器單元和高達 16 個 16.3Gbps 收發器。
此設計包括許多可搭配 TPS65086x (...)
TIDA-00210 — 適用於雙極步進驅動的 75V/10A 受保護全橋式功率級參考設計
For applications which require higher torque and power, often voltages above 48VDC, (...)
TIDA-00365 — 適用於有刷 DC 驅動器的 75V/10A 受保護全橋式功率級參考設計
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
DSBGA (YZP) | 6 | Ultra Librarian |
SOT-23 (DBV) | 6 | Ultra Librarian |
SOT-SC70 (DCK) | 6 | Ultra Librarian |
USON (DRY) | 6 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點