TAS5602
- Supports Multiple Output Configurations
- 2×20-W into a 8-Ω BTL Load at 18 V
- 4×10-W into a 4-Ω SE Load at 18 V
- 2×10W (SE) + 1×20W (BTL) at 18 V
- Thermally Enhanced Package
- DCA (56-pin HTTSOP)
- Wide Voltage Range: 10V—26V
- No Separate Supply Required for Gate Drive
- Efficient Class-D Operation Eliminates Need for Heat Sinks
- Closed Loop Power Stage Architecture
- Improved PSRR Reduces Power Supply Performance Requirements
- High Damping Factor Provides for Tighter, More Accurate Sound With Improved Bass Response
- Constant Output Power Over Variation in Supply Voltage
- Single Ended Inputs
- Integrated Self-Protection Circuits Including Overvoltage, Undervoltage, Overtemperature, and Short Circuit With Error Reporting
- APPLICATIONS
- Flat-Panel, Rear-Projection, and CRT TV
- Consumer Audio Applications
The TAS5602 is a 20-W (per channel) efficient, stereo digital amplifier power stage for driving 4 single-ended speakers, 2 bridge-tied speakers, or combination of single and bridge-tied loads. The TAS5602 can drive a speaker with an impedance as low as 4Ω. The high efficiency of the TAS5602 eliminates the need for an external heat sink.
A simple interface to a digital audio PWM processor is shown below. The TAS5602 is fully protected against faults with short-circuit protection and thermal protection as well as overvoltage and undervoltage protection. Faults are reported back to the processor to prevent devices from being damaged during overload conditions.
技術文件
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檢視所有 2 類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 20W Stereo (BTL) Digital Amplifier Power Stage datasheet (Rev. B) | 2008年 10月 30日 | |
EVM User's guide | TAS5602EVM2 - User Guide | 2008年 8月 19日 |
設計與開發
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模擬工具
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HTSSOP (DCA) | 56 | Ultra Librarian |
訂購與品質
內含資訊:
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊:
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。