TLV2545
- Maximum Throughput . . . 140/200 KSPS
- Built-In Conversion Clock
- INL/DNL: ±1 LSB Max, SINAD: 72 dB,
SFDR: 85 dB, fi = 20 kHz - SPI/DSP-Compatible Serial Interface
- Single Supply: 2.7 Vdc to 5.5 Vdc
- Rail-to-Rail Analog Input With 500 kHz BW
- Three Options Available:
- TLV2541: Single Channel Input
- TLV2542: Dual Channels With Autosweep
- TLV2545: Single Channel With Pseudo-Differential Input
- Low Power With Autopower Down
- Operating Current: 1 mA at 2.7 V, 1.5 mA at 5 V
Autopower Down: 2 µA at 2.7 V, 5 µA at 5 V
- Operating Current: 1 mA at 2.7 V, 1.5 mA at 5 V
- Small 8-Pin MSOP and SOIC Packages
TMS320 is a trademark of Texas Instruments.
The TLV2541, TLV2542, and TLV2545 are a family of high performance, 12-bit, low power, miniature, CMOS analog-to-digital converters (ADC). The TLV254x family operates from a single 2.7-V to 5.5-V supply. Devices are available with single, dual, or single pseudo-differential inputs. Each device has a chip select (CS), serial clock (SCLK), and serial data output (SDO) that provides a direct 3-wire interface to the serial port of most popular host microprocessors (SPI interface). When interfaced with a TMS320™ DSP, a frame sync signal (FS) can be used to indicate the start of a serial data frame on CS for all devices or FS for the TLV2541.
TLV2541, TLV2542, and TLV2545 are designed to operate with very low power consumption. The power saving feature is further enhanced with an autopower-down mode. This product family features a high-speed serial link to modern host processors with SCLK up to 20 MHz. The maximum SCLK frequency is dependent upon the mode of operation (see Table 1). The TLV254x family uses the built-in oscillator as the conversion clock, providing a 3.5-µs conversion time.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 2.7 V to 5.5 V Low-Power 12-Bit 140/200 KSPS, Serial Analog-To-Digital Converter datasheet (Rev. E) | 2010年 4月 12日 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點