TMUX6234
- Dual supply range: ±4.5V to ±18V
- Single supply range: 4.5V to 36V
- Low on-resistance: 3.6Ω
- Low crosstalk: –105dB
- Low propagation delay: 450ps
- High current support: 400mA (maximum)
- –40°C to +125°C operating temperature
- 1.8V logic compatible inputs
- Fail-safe logic
- Rail-to-rail operation
- Bidirectional signal path
- Break-before-make switching
The TMUX6234 is a multi-channel CMOS switch with low on-resistance. The TMUX6234 contains four independently controlled SPDT switches with an EN pin to enable or disable all four channels. The device supports single supply (4.5V to 36V), dual supplies (±4.5V to ±18V), or asymmetric supplies (such as VDD = 18V and VSS = –5V). The TMUX6234 supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from VSS to VDD.
All logic control input pins support logic levels from 1.8V to VDD, ensuring logic compatibility when operating with a wide range of logic voltages. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
The TMUX6234 is part of the precision switches and multiplexers family of devices. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TMUX6234 36V, Low Ron, 2:1, 4 Channel Precision Switches with 1.8V Logic datasheet (Rev. C) | PDF | HTML | 2024年 7月 11日 |
| Application note | Achieving Fast VGS Switching in RF Power Amplifiers in Aerospace and Defense Applications | PDF | HTML | 2023年 12月 13日 | |
| Application note | How to Handle High Voltage Common Mode Applications using Multiplexers | PDF | HTML | 2022年 10月 3日 |
設計與開發
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TMUXRTJ-RRQEVM — 適用於 20 針腳 RTJ 和 RRQ QFN 封裝的通用 TMUX 評估模組
TMUXRTJ-RRQEVM 可對 TI 的 TMUX 產品系列進行快速原型設計和 DC 特性分析，這些產品使用 20 接腳 RTJ 或 RRQ 封裝 (QFN)，並且額定用於高電壓操作。
LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| TSSOP (PW) | 20 | Ultra Librarian |
| WQFN (RRQ) | 20 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。