TPA0103
- Desktop Computer Amplifier Solution
- 1.75-W Bridge Tied Load (BTL) Center Channel
- 500-mW L/R Single-Ended Channels
- Low Distortion Output
- < 0.05% THD+N at Full Power
- Full 3.3-V and 5-V Specifications
- Surface-Mount Power Package
24-Pin TSSOP - L/R Input MUX Feature
- Shutdown Control...IDD = 5 uA
PowerPAD is a trademark of Texas Instruments Incorporated.
The TPA0103 is a 3-channel audio power amplifier in a 24-pin TSSOP thermal package primarily targeted at desktop PC or notebook applications. The left/right (L/R) channel outputs are single ended (SE) and capable of delivering 500 mW of continuous RMS power per channel into 4- loads with a 3.3-V supply voltage.
Amplifier gain is externally configured by means of two resistors per input channel and does not require external compensation for settings of 1 to 10. A two channel input MUX circuit is integrated on the L/R channel inputs to allow two sets of stereo inputs to the amplifier. In the typical application, the center channel amplifier is driven from a mix of the L/R inputs to produce a monaural representation of the stereo signal. The center channel amplifier can be shut down independently of the L/R output for speaker muting in headphone applications. The TPA0103 also features a full shutdown function for power sensitive applications holding the bias current to 5 uA.
The PowerPAD package (PWP) delivers a level of thermal performance that was previously achievable only in TO-220-type packages. Thermal impedances of less than 35°C/W are readily realized in multilayer PCB applications. This allows the TPA0103 to operate at full power at ambient temperature of up to 85°C.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 3-Channel Audio Power Amplifier Stereo Single-Ended 500-mW and Mono BTL 1.75W datasheet (Rev. A) | 2000年 3月 15日 | |
Application note | PowerPAD™ Thermally Enhanced Package (Rev. H) | 2018年 7月 6日 | ||
User guide | TPA0103EVM - User Guide | 1998年 8月 18日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HTSSOP (PWP) | 24 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點