TPA6030A4
- 3 W Into 16 From 12-V Supply
- Volume Control for Speakers (BTL) and Headphones (SE)
- Differential Inputs
- Depop Circuitry
- 1 µA Shutdown Current
- Surface Mount Package
- APPLICATIONS
- LCD Monitors and LCD TVs
- Multimedia Speakers
- Notebook Computers
PowerPAD is a trademark of Texas Instruments.
The TPA6030A4 is designed to drive 3 W into 16- speakers using a surface-mount package without the need for an external heatsink. These features make it ideal for 15" 17" LCD monitors, small multimedia speakers, and notebook computers.
To simplify system design, the speaker volume level is adjusted by applying a dc voltage to the VOLUME terminal. The delta between speaker volume and headphone volume can be adjusted by applying a dc voltage to the SEDIFF terminal. To avoid an unexpected high volume level through the headphones, a third terminal, SEMAX, limits the headphone volume level when a dc voltage is applied. Integrated depop circuitry and the fully differential design minimize pops, clicks, and unwanted noise to provide a high level of audio performance.
The device is available in a 28-pin TSSOP PowerPAD package. The PowerPAD package is designed to transfer heat into the ground plane, eliminating the need for external heat sinksminimizing solution cost and size.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 3-W Stereo Audio Power Amplifier With Advanced DC Volume Control datasheet (Rev. B) | 2005年 1月 27日 | |
User guide | TPA6030A4EVM - User Guide (Rev. A) | 2002年 11月 4日 |
設計與開發
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TPA6030A4EVM — TPA6030A4 評估模組 (EVM)
The TPA6030A4 is a 3-W stereo audio power amplifier designed for 12V applications with a 16-Ohm minimum speaker impedance. Features including DC volume control and integrated stereo headphone drive make this device ideal for 15" to 17" audio enhanced flat panel displays.
Designers can quickly (...)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HTSSOP (PWP) | 28 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點