TS3A24157
- Specified Break-Before-Make Switching
- Low ON-State Resistance (0.65-Ω Maximum)
- Low Charge Injection
- Excellent ON-State Resistance Matching
- Low Total Harmonic Distortion
- 1.65-V to 3.6-V Single-Supply Operation
- Bidirectional Signal Paths
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
The TS3A24157 is a bidirectional, 2-channel, single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to 3.6 V. The device offers low ON-state resistance and excellent ON-state resistance matching with the break-before-make feature, to prevent signal distortion during the transfer of a signal from one channel to another. The device has excellent total harmonic distortion (THD) performance and consumes very-low power. These features make this device suitable for portable audio applications.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TS3A24157 0.65-Ω 2-Channel SPDT Analog Switch 2-Channel 2:1 Multiplexer and Demultiplexer datasheet (Rev. B) | PDF | HTML | 2016年 10月 12日 |
Application brief | 1.8-V Logic for Multiplexers and Signal Switches (Rev. C) | PDF | HTML | 2022年 7月 26日 | |
Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022年 6月 2日 | |
Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021年 12月 1日 | |
Application note | Preventing Excess Power Consumption on Analog Switches | 2008年 7月 3日 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 |
設計與開發
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DIP-ADAPTER-EVM — DIP 轉接器評估模組
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
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LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器
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訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。