TS3A26746E
- Ultra Low RON for GND Switch (80-mΩ typical)
- RON for MIC Switch <10-Ω
- 3.0V to 3.6V V+ Operation
- Control Input is 1.8-V Logic Compatible
- 6-bump, 0.5mm pitch CSP Package (1.45mm × 0.95mm × 0.5mm)
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 500-V Charged-Device Model (C101)
- ESD Performance (SLEEVE, RING2)
- ±8-kV Contact Discharge (IEC 61000-4-2)
The TS3A26746E is a 2 × 2 cross-point switch that is used to interchange the Ground and MIC connections on a headphone connector. The Ground switch has an ultra low RON of <0.1Ω to minimize voltage drop across it, preventing undesired increases in headphone ground reference voltage. The switch state is controlled via the SEL input. When SEL=High, GND is connected to RING2 and MIC is connected to SLEEVE. When SEL=Low, GND is connected to SLEEVE and MIC is connected to RING2. An internal 100k pull-up resistor on the SEL input sets the default state of the switch.
技術文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 4 設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
介面轉接器
LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
使用指南: PDF
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
DSBGA (YZP) | 6 | Ultra Librarian |
訂購與品質
內含資訊:
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊:
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。