TS3USB30
- VCC Operation at 3 V and 4.3 V
- 1.8-V Compatible Control-Pin Inputs
- IOFF Supports Partial Power-Down-Mode
Operation - Ron = 10 Ω Maximum
- ΔRon <0.35 Ω Typical
- Cio(ON) = 7 pF Typical
- Low Power Consumption (1 µA Maximum)
- ESD Performance Tested Per JESD 22
- 6000-V Human Body Model (HBM)
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 250-V Machine Model (A115-A)
- 6000-V Human Body Model (HBM)
- –3-dB Bandwidth = 955 MHz Typical
- Packaged in 10-pin UQFN (1.4 mm × 1.8 mm)
The TS3USB30 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (955 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | High-Speed USB 2.0 1:2 Multiplexer/Demultiplexer Switch With Single Enable* datasheet (Rev. F) | 2015年 8月 14日 | |
Application note | Passive Mux Selection Based On Bandwidth (Rev. A) | PDF | HTML | 2024年 7月 31日 | |
Application note | Crosspoint Switch with TS3USB30 Device | 2018年 8月 2日 | ||
Application note | High-Speed Layout Guidelines for Signal Conditioners and USB Hubs | 2018年 6月 14日 | ||
Application note | Preventing Excess Power Consumption on Analog Switches | 2008年 7月 3日 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 |
設計與開發
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
UQFN (RSW) | 10 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。