TS5A23157-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 1: –40°C to 125°C
- Device HBM ESD classification level H2
- Device CDM ESD classification level C4B
- Functional safety-capable
- Documentation available to aid functional safety system design
- Customer-specific configuration control can be supported along with major-change approval
- Specified break-before-make switching
- Low ON-state resistance (15 Ω)
- Control inputs are 5-V tolerant
- Low charge injection
- Excellent ON-resistance matching
- Low total harmonic distortion
- 1.8-V to 5.5-V single-supply operation
The TS5A23157-Q1 is a dual, single-pole, double-throw (SPDT) analog switch designed to operate from 1.65 V to 5.5 V. This device can handle both digital and analog signals. The device can transmit signals up to 5.5 V (peak) in either direction.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com.
技術文件
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檢視所有 7 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TS5A23157-Q1 Dual 15-Ω SPDT Analog Switch datasheet (Rev. B) | PDF | HTML | 2021年 6月 17日 |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022年 6月 2日 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021年 12月 1日 | |
| Functional safety information | TS5A23157-Q1 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA | PDF | HTML | 2021年 3月 29日 | |
| More literature | Automotive Logic Devices Brochure | 2014年 8月 27日 | ||
| Application note | Preventing Excess Power Consumption on Analog Switches | 2008年 7月 3日 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
介面轉接器
LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
使用指南: PDF
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| VSSOP (DGS) | 10 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。