TS5A23159
- Isolation in Power-Down Mode, VCC = 0
- Specified Break-Before-Make Switching
- Low ON-State Resistance (1 Ω)
- Control Inputs are 5.5-V Tolerant
- Low Charge Injection
- Excellent ON-State Resistance Matching
- Low Total Harmonic Distortion (THD)
- Supports Analog and Digital Signals
- 1.65-V to 5.5-V Single-Supply Operation
- Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II - ESD Performance Tested Per JESD 22
- 2000-V Human Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 2000-V Human Body Model
The TS5A23159 is a bidirectional 2-channel single-pole double-throw (SPDT) switch that is designed to operate from 1.65 V to 5.5 V. The device offers low ON-state resistance and excellent ON-state resistance matching with the break-before-make feature which prevents signal distortion during the transferring of a signal from one channel to another. The device has an excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for a wide variety of portable applications including cell phones, audio devices, and instrumentation.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TS5A23159 1-Ω 2-Channel SPDT Analog Switch 5-V / 3.3-V 2-Channel 2:1 Multiplexer / Demultiplexer datasheet (Rev. H) | PDF | HTML | 2015年 2月 26日 |
Product overview | How to Support Two Controllers on the I2C Bus, Avoid Bus Contention, and Prevent Controller Failures | PDF | HTML | 2024年 11月 27日 | |
Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022年 6月 2日 | |
Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021年 12月 1日 | |
Application brief | Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) | PDF | HTML | 2021年 1月 6日 | |
Application note | Preventing Excess Power Consumption on Analog Switches | 2008年 7月 3日 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 |
設計與開發
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LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
UQFN (RSE) | 10 | Ultra Librarian |
VSSOP (DGS) | 10 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。