TS5A6542
- Specified Break-Before-Make Switching
- Low ON-State Resistance (0.75 Max)
- Control Inputs Referenced to VIO
- Low Charge Injection
- Excellent ON-State Resistance Matching
- Low Total Harmonic Distortion (THD)
- 2.25-V to 5.5-V Power Supply (V+)
- 1.65-V to 1.95-V Logic Supply (VIO)
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 4000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 400-V Machine Model (A115-A)
- 4000-V Human-Body Model
- COM Port to GND
- 8000-V Human-Body Model
(A114-B, Class II) - ±15-kV Contact Discharge (IEC 61000-4-2)
- 8000-V Human-Body Model
- APPLICATIONS
- Cell Phones
- PDAs
- Portable Instrumentation
The TS5A6542 is a single-pole double-throw (SPDT) analog switch that is designed to operate from 2.25 V to 5.5 V. The device offers a low ON-state resistance with an excellent channel-to-channel ON-state resistance matching, and the break-before-make feature to prevent signal distorion during the transferring of a signal from one path to another. The device has excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications.
The TS5A6542 has a separate logic supply pin (VIO) that is characterized to operate from 1.65 V to 1.95 V. VIO powers the control circuitry, which allows the TS5A6542 to be controlled by 1.8-V signals.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TS5A6542 0.75-Ohm SPDT Analog Switch With Input Logic Translation datasheet (Rev. C) | 2009年 12月 11日 | |
Application note | High-Efficiency Charging for TWS Using a 2-Pin Interface Application Report (Rev. A) | PDF | HTML | 2023年 5月 16日 | |
Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022年 6月 2日 | |
Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021年 12月 1日 | |
Application note | Preventing Excess Power Consumption on Analog Switches | 2008年 7月 3日 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 |
設計與開發
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
DSBGA (YZP) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
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