SLVAFI9 may 2023 TPS50601A-SP , TPS73801-SEP , TPS7H1101A-SP , TPS7H3301-SP , TPS7H3302-SEP , TPS7H4001-SP , TPS7H4002-SP , TPS7H4003-SEP , TPS7H4010-SEP , TPS7H5001-SP
PRODUCTION DATA
This application note provides a recommended space rated power design for the Microsemi® RTG4™ FPGA. The report outlines recommendations for the individual power rails and the benefits of rad-hard (-SP) and rad-tolerant (-SEP) devices. Then, example power block diagrams are provided for each of the different power design variations to include both 5 V and 12 V inputs.
RTG4™ is a trademark of Microchip.
Microsemi® is a registered trademark of Microsemi.
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Architectural advancements continue to be developed in FPGAs with the growing need for more on-board processing and re-programmability in space applications. As such, Microsemi's RTG4 FPGA has seen a wide use in different satellite payloads. As new FPGAs are developed, the power requirements have continued to evolve requiring the need for higher currents, and lower voltages. The designs that power the RTG4 must be able to meet these increased requirements and be resilient to withstand the harsh environment of space.
This application note reviews two product grades TI offers with proven radiation performance and provides a selection guide for comparing the different power management devices within each flow. The report also covers the value the space grade power management portfolio brings to the overall system, and provides example power maps for both rad-hard and rad-tolerant implementations.
TI has had a long history supporting the space industry by providing hermetically sealed QMLV (Qualified Manufacturer List, Class V) and RHA (Radiation Hardness Assured) components all in accordance with the MIL-PRF-38535 specification. In addition to the qualification standard, these devices are typically supported with extensive Total Ionizing Dose (TID) and Single Event Effects (SEE) radiation reports that are readily available in the product folder for each device. TI continues to support the highest-reliability space applications with ongoing and new development in hermetically sealed QMLV devices.
However, with the reduction in launch costs and stricter budgets, this has resulted in a different approach to satellite manufacturing for new commercial and government applications. To provide a design, TI has provided more cost-effective and smaller designs through a growing portfolio of devices in rad-tolerant Space Enhanced Plastic (denoted by -SEP) to meet the reduced assurance requirements for LEO and MEO constellations. Table 2-1 provides an overview between the differences of Space Enhanced Plastic and QMLV-RHA. For more information on TI's rad-tolerant flow, read how to Reduce the Risk in Low-Earth Orbit Missions with Space Enhanced Plastic Products.
Rad-tolerant (-SEP) | Rad-hard (-SP) | |
---|---|---|
Packaging | Plastic | Ceramic-Hermetic |
Single Controlled Baseline | Yes | Yes |
Meets DLA spec for less than 2% Sn | Au | Al |
Production Burn-in | No | Yes |
Typical Temperature Range | -55°C - 125°C | -55°C - 125°C |
Radiation: TID Characterization | 30 to 50 krad(Si) | 100 krad(Si) |
Radiation Lot Acceptance Testing (RLAT) | 20, 30 or 50 krad(Si) | 100 krad(Si) |
Radiation: SEE Characterization | 43MeV-cm2/mg | ≥75MeV-cm2/mg |
Outgassing tested per ASTM E595 | Yes | N/A |
Lot Level Temp Cycle | Yes | Yes |
Per tube, tray or reel single lot date code | Yes | Yes |
Life Test Per Wafer Lot | No | Yes |