SLLA284G July 2022 – September 2023 ISO5451 , ISO5452 , ISO5851 , ISO5852S , ISO7142CC , ISO7142CC-Q1 , ISO721 , ISO721-Q1 , ISO721M , ISO721M-EP , ISO722 , ISO7220A , ISO7220M , ISO7221A , ISO7221B , ISO7221C , ISO7221M , ISO722M , ISO7230C , ISO7230M , ISO7231C , ISO7231M , ISO7240C , ISO7240CF , ISO7240M , ISO7241C , ISO7241M , ISO7242C , ISO7242M , ISO7310-Q1 , ISO7310C , ISO7340-Q1 , ISO7340C , ISO7340FC , ISO7341-Q1 , ISO7341C , ISO7341FC , ISO7342-Q1 , ISO7342C , ISO7342FC , ISO7740 , ISO7741 , ISO7742 , ISO7760 , ISO7761 , ISO7762 , ISO7810 , ISO7820 , ISO7821 , ISO7830 , ISO7831 , ISO7840 , ISO7841 , ISO7842
Isolation is a means of preventing dc and unwanted ac currents between two parts of a system, while allowing signal and power transfer between those two parts. Electronic devices and semiconductor ICs used for isolation are called isolators. In general, an isolator can be abstracted as comprising of a high-voltage isolation component or barrier, a transmitter (TX) to couple signal into one side of the isolation component, and a receiver (RX) to convert the signal available on the other side of the isolation component into digital levels.
TI's isolators use SiO2 (silicon dioxide) based, high-voltage capacitors to serve as the isolation component. For the TX and RX circuits, two different architectures are used: Edge based and On-Off Keying (OOK) based. These architectures are explained in Section 1.1 and Section 1.2.