Gehäuseinformationen
| Gehäuse | Pins SSOP (DWX) | 16 |
| Betriebstemperaturbereich (°C) -40 to 125 |
| Gehäusemenge | Träger 1.000 | LARGE T&R |
Merkmale von ISOUSB111
- Compliant to USB 2.0
- Supports low speed (1.5 Mbps) and full speed (12 Mbps) signaling
- Automatic speed and connection detection
- Supports L1 (sleep) and L2 (suspend) low-power states
- Supports automatic role reversal for USB On-The-Go (OTG) and Type-C® Dual Role Port (DRP) designs
- High CMTI: 100 kV/µs
- VBUS voltage range: 4.25 V to 5.5 V
- 3.3 V internal LDO
- Meets CISPR32 class B emissions limits
- Ambient temperature range: –40°C to +125°C
- 16-SOIC and 16-SSOP package options
- Safety-related certifications:
- 7071-VPK VIOTM and 2121-VPK VIORM (Reinforced) per DIN EN IEC 60747-17 (VDE 0884-17)
- 5000-VRMS isolation for 1 minute per UL 1577
- IEC 62368-1, IEC 60601-1 and IEC 61010-1 certifications
- CQC, TUV and CSA certifications
- 16-SOIC certifications complete; 16-SSOP certifications planned
Beschreibung von ISOUSB111
ISOUSB111 is a galvanically-isolated USB 2.0 compliant repeater supporting low speed (1.5 Mbps) and full speed (12 Mbps) signaling rates. The device supports automatic connect and speed detection, reflection of pull-ups/pull-downs, and link power management allowing drop-in USB hub, host, peripheral and cable isolation. The device also supports automatic role reversal - if after disconnect, a new connect is detected on the Upstream facing port, then the Upstream and Downstream port definitions are reversed. This feature enables the device to support USB On-The-Go (OTG) and Type-C Dual Role Port (DRP) implementations. This device uses a silicon dioxide (SiO2) insulation barrier with a withstand voltage of up to 5000 VRMS and a working voltage of 1500 VRMS. Used in conjunction with isolated power supplies, the device protects against high voltage, and prevents noise currents from the bus from entering the local ground. The ISOUSB111 device is available for reinforced isolation. It supports a wide ambient temperature range of –40°C to +125°C. The device is available in the standard SOIC-16 (16-DW) package and a smaller SSOP-16 (16-DWX) package.