The LMV1015 is an audio amplifier series for small form factor electret microphones. This
2-wire portfolio is designed to replace the JFET amplifier. The LMV1015 series is ideally suited
for applications requiring high signal integrity in the presence of ambient or RF noise, such as in
cellular communications. The LMV1015 audio amplifiers are ensured to operate over a 2.2V to 5.0V
supply voltage range with fixed gains of 15.6 dB and 23.8 dB. The devices offer excellent THD, gain
accuracy and temperature stability as compared to a JFET microphone.
The LMV1015 series enables a two-pin electret microphone solution, which provides direct
pin-to-pin compatibility with the existing older JFET market.
Texas Instruments' built-in gain families are offered in extremely thin space saving
4-bump DSBGA packages (0.3 mm maximum). The LMV1015XR is designed for 1.0 mm ECM canisters and
thicker. These extremely miniature packages have the Large Dome Bump (LDB) technology. This DSBGA
technology is designed for microphone PCBs requiring 1 kg adhesion criteria.
The LMV1015 is an audio amplifier series for small form factor electret microphones. This
2-wire portfolio is designed to replace the JFET amplifier. The LMV1015 series is ideally suited
for applications requiring high signal integrity in the presence of ambient or RF noise, such as in
cellular communications. The LMV1015 audio amplifiers are ensured to operate over a 2.2V to 5.0V
supply voltage range with fixed gains of 15.6 dB and 23.8 dB. The devices offer excellent THD, gain
accuracy and temperature stability as compared to a JFET microphone.
The LMV1015 series enables a two-pin electret microphone solution, which provides direct
pin-to-pin compatibility with the existing older JFET market.
Texas Instruments' built-in gain families are offered in extremely thin space saving
4-bump DSBGA packages (0.3 mm maximum). The LMV1015XR is designed for 1.0 mm ECM canisters and
thicker. These extremely miniature packages have the Large Dome Bump (LDB) technology. This DSBGA
technology is designed for microphone PCBs requiring 1 kg adhesion criteria.