Gehäuseinformationen
| Gehäuse | Pins NFBGA (ZBX) | 260 |
| Betriebstemperaturbereich (°C) 0 to 70 |
| Gehäusemenge | Träger 120 | JEDEC TRAY (5+1) |
Merkmale von TX7332
- TX7332 supports:
- 32-channel three-level pulser and active transmit/receive (T/R) switch
- Very low power on-chip beamforming mode:
- In receive-only mode: 0.45 mW/ch
- In transmit-receive mode: 16.4 mW/ch
- In CW mode: 160 mW/ch
- In global power-down mode: 0.1 mW/ch
- Three-level pulser:
- Maximum output voltage: ±100 V
- Minimum output voltage: ±1 V
- Maximum output current: 1.2 A to 0.3 A
- Maximum clamp current: 0.5 A to 0.12 A
- Second harmonic : –45 dBc at 5 MHz
- CW mode jitter: 100 fs measured from 100 Hz to 20 kHz
- CW mode close-in phase noise: -154 dBc/Hz at 1 kHz offset for 5-MHz signal
- –3-dB bandwidth with 2-kΩ ||
120-pF load
- 20 MHz (for ±100-V supply)
- 25 MHz (for ±70-V supply)
- Active T/R switch with:
- ON, OFF control signals
- Bandwidth: 50 MHz
- HD2: –50 dBc
- Turnon resistance: 24 Ω
- Turnon time: 0.5 µs
- Turnoff time: 1.75 µs
- Transient glitch: 50 mVPP
- Off-chip beamformer with:
- Jitter cleaning using synchronization feature
- Maximum synchronization clock frequency: 200 MHz
- On-chip beamformer with:
- Delay resolution: one beamformer clock period
- Maximum delay: 213 beamformer clock period
- Maximum beamformer clock speed: 200 MHz
- On-chip RAM to store
- 16 delay profiles
- 32 pattern profiles
- High-speed (100 MHz maximum) 1.8-V and 2.5-V CMOS serial programming interface
- Automatic thermal shutdown
- No specific power sequencing requirement
- Small package: 260-pin NFBGA (17 mm × 11 mm) with 0.8-mm pitch
Beschreibung von TX7332
The TX7332 is a highly integrated, high-performance transmitter solution for ultrasound imaging system. The device has total 32 pulser circuits (PULS), 32 transmit/receive (T/R) switches, and supports both on-chip and off-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies.
The TX7332 has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that can be used to excite multiple channels of an ultrasound transducer. The device supports total 32 outputs. The maximum output current is configurable from 1.2 A to 0.3 A.
A T/R switch under OFF state protects the receiver circuit by providing high isolation between the high-voltage transmitter and the low-voltage receiver when the pulser is generating high-voltage pulses. When the transducer is receiving echo signals, the T/R switch turns ON and connects the transducer to the receiver. The ON/OFF operation of the T/R switch is either controlled by an external pin or controlled by on-chip beamforming engine in the device. The T/R switch offers 24-Ω impedance in the ON state.
Ultrasound transmission relies on the excitation of multiple transducer elements with the delay profile of the excitation across the different elements defining the direction of the transmission. Such an operation is referred to as transmit beamforming. The TX7332 supports staggered pulsing of the different channels, allowing for transmit beamforming. The device supports both off-chip and on-chip beamforming operation.
In the off-chip beamformer mode, the output transition of each pulser and TR switch ON/OFF operation is controlled by external control pins. To eliminate the effect of jitter from the external control signals, the device supports a synchronization feature. When the synchronization feature is enabled, the external control signals are latched using a low-jitter beamformer clock signal.
In the on-chip beamformer mode, the delay profile for the pulsing of the different channels is stored within the device. The device supports a transmit beamformer delay resolution of one beamformer clock period and a maximum delay of 213 beamformer clock periods. An internal pattern generator generates the output pulse patterns based on pattern profiles stored in a profile RAM. Up to 16 beamforming profiles and 32 pattern profiles can be stored in the profile RAM. On-chip beamforming mode reduces the number of control signals that must be routed from the FPGA to the device..
The TX7332 is available in a 17-mm × 11-mm 260-pin NFBGA package and is specified for operation from 0°C to 70°C.