Detalles del producto

Configuration 16:1 Number of channels 1 Power supply voltage - single (V) 5 Protocols Analog Ron (typ) (Ω) 70 CON (typ) (pF) 50 Supply current (typ) (µA) 8 Bandwidth (MHz) 89 Operating temperature range (°C) -40 to 125 Features Break-before-make Input/output continuous current (max) (mA) 25 Rating Automotive Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
Configuration 16:1 Number of channels 1 Power supply voltage - single (V) 5 Protocols Analog Ron (typ) (Ω) 70 CON (typ) (pF) 50 Supply current (typ) (µA) 8 Bandwidth (MHz) 89 Operating temperature range (°C) -40 to 125 Features Break-before-make Input/output continuous current (max) (mA) 25 Rating Automotive Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
SOIC (DW) 24 159.65 mm² 15.5 x 10.3
  • Qualified for Automotive Applications
  • AEC-Q100 Test Guidance With the Following Results:
    • Device Temperature Grade 1: –40°C to 125°C
      Ambient Operating Temperature Range
    • Device HBM ESD Classification Level H1A
    • Device CDM ESD Classification Level C2
  • Wide Analog Input Voltage Range
  • Low ON Resistance
    • 70 Ω Typical (VCC = 4.5 V)
  • Fast Switching and Propagation Speeds
  • Break-Before-Make Switching
    • 6 ns Typical (VCC = 4.5 V)
  • Fanout (Over Temperature Range)
    • Standard Outputs: 10 LSTTL Loads
    • Bus Driver Outputs: 15 LSTTL Loads
  • Balanced Propagation Delay and Transition Times
  • Significant Power Reduction Compared to LSTTL Logic ICs
  • 4.5-V to 5.5-V Operation
  • Direct LSTTL Input Logic Compatibility:
    VIL = 0.8 V Max, VIH = 2 V Min
  • CMOS Input Compatibility: II ≤ 1 µA at
    VOL, VOH
  • Qualified for Automotive Applications
  • AEC-Q100 Test Guidance With the Following Results:
    • Device Temperature Grade 1: –40°C to 125°C
      Ambient Operating Temperature Range
    • Device HBM ESD Classification Level H1A
    • Device CDM ESD Classification Level C2
  • Wide Analog Input Voltage Range
  • Low ON Resistance
    • 70 Ω Typical (VCC = 4.5 V)
  • Fast Switching and Propagation Speeds
  • Break-Before-Make Switching
    • 6 ns Typical (VCC = 4.5 V)
  • Fanout (Over Temperature Range)
    • Standard Outputs: 10 LSTTL Loads
    • Bus Driver Outputs: 15 LSTTL Loads
  • Balanced Propagation Delay and Transition Times
  • Significant Power Reduction Compared to LSTTL Logic ICs
  • 4.5-V to 5.5-V Operation
  • Direct LSTTL Input Logic Compatibility:
    VIL = 0.8 V Max, VIH = 2 V Min
  • CMOS Input Compatibility: II ≤ 1 µA at
    VOL, VOH

The CD74HCT4067-Q1 device is a digitally controlled analog switch that utilizes silicon-gate CMOS technology to achieve operating speeds similar to LSTTL, with the low power consumption of standard CMOS integrated circuits.

This analog multiplexer and demultiplexer controls analog voltages that may vary across the voltage supply range. It is a bidirectional switch, thus allowing any analog input to be used as an output and vice-versa. The switch has low (on) resistance and low (off) leakages. In addition, the device has an enable control that, when high, disables all switches to their off state.

The CD74HCT4067-Q1 device is a digitally controlled analog switch that utilizes silicon-gate CMOS technology to achieve operating speeds similar to LSTTL, with the low power consumption of standard CMOS integrated circuits.

This analog multiplexer and demultiplexer controls analog voltages that may vary across the voltage supply range. It is a bidirectional switch, thus allowing any analog input to be used as an output and vice-versa. The switch has low (on) resistance and low (off) leakages. In addition, the device has an enable control that, when high, disables all switches to their off state.

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Documentación técnica

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Tipo Título Fecha
* Data sheet High-Speed CMOS Logic 16-Channel Analog Multiplexer and Demultiplexer datasheet (Rev. B) 23 jul 2012
Functional safety information CD74HCT4067-Q1 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA PDF | HTML 17 abr 2024
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 jun 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 dic 2021
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 jul 2021
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
More literature Automotive Logic Devices Brochure 27 ago 2014
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
User guide Signal Switch Data Book (Rev. A) 14 nov 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 jun 1997
Application note Designing With Logic (Rev. C) 01 jun 1997
Application note SN54/74HCT CMOS Logic Family Applications and Restrictions 01 may 1996
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 01 abr 1996

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

TMUXBQB-DYYEVM — Módulo de evaluación de TMUX genérico para paquetes BQB, DYY y PW de 16 pines

El TMUXBQB-DYYEVM permite la rápida creación de prototipos y la caracterización de CC de nuestra línea de productos TMUX que utilizan los encapsulado pequeños y delgados (TSSOP) de 16 pines (PW), WQFN (BQB) y SOT-23 THIN (DYY).

Guía del usuario: PDF | HTML
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
SOIC (DW) 24 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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