Detalles del producto

Function Single-ended Additive RMS jitter (typ) (fs) 40 Output frequency (max) (MHz) 200 Number of outputs 10 Output supply voltage (V) 2.5, 3.3 Core supply voltage (V) 2.5, 3.3 Output skew (ps) 100 Features Pin control Operating temperature range (°C) -40 to 85 Rating Catalog Output type LVTTL Input type LVTTL
Function Single-ended Additive RMS jitter (typ) (fs) 40 Output frequency (max) (MHz) 200 Number of outputs 10 Output supply voltage (V) 2.5, 3.3 Core supply voltage (V) 2.5, 3.3 Output skew (ps) 100 Features Pin control Operating temperature range (°C) -40 to 85 Rating Catalog Output type LVTTL Input type LVTTL
TSSOP (PW) 24 49.92 mm² 7.8 x 6.4
  • High-Performance 1:10 Clock Driver
  • Pin-to-Pin Skew < 100 ps at VDD 3.3 V
  • VDD Range = 2.3 V to 3.6 V
  • Input Clock Up To 200 MHz (See Figure 7)
  • Operating Temperature Range -40°C to 85°C
  • Output Enable Glitch Suppression
  • Distributes One Clock Input to Two Banks of Five Outputs
  • Packaged in 24-Pin TSSOP
  • Pin-to-Pin Compatible to the CDCVF2310,
    Except the R = 22- Series Damping
    Resistors at Yn
  • APPLICATIONS
    • General-Purpose Applications

  • High-Performance 1:10 Clock Driver
  • Pin-to-Pin Skew < 100 ps at VDD 3.3 V
  • VDD Range = 2.3 V to 3.6 V
  • Input Clock Up To 200 MHz (See Figure 7)
  • Operating Temperature Range -40°C to 85°C
  • Output Enable Glitch Suppression
  • Distributes One Clock Input to Two Banks of Five Outputs
  • Packaged in 24-Pin TSSOP
  • Pin-to-Pin Compatible to the CDCVF2310,
    Except the R = 22- Series Damping
    Resistors at Yn
  • APPLICATIONS
    • General-Purpose Applications

The CDCVF310 is a high-performance, low-skew clock buffer that operates up to 200 MHz. Two banks of five outputs each provide low-skew copies of CLK. After power up, the default state of the outputs is low regardless of the state of the control pins. For normal operation, the outputs of bank 1Y[0:4] or 2Y[0:4] can be placed in a low state when the control pins (1G or 2G, respectively) are held low and a negative clock edge is detected on the CLK input. The outputs of bank 1Y[0:4] or 2Y[0:4] can be switched into the buffer mode when the control pins (1G and 2G) are held high and a negative clock edge is detected on the CLK input. The device operates in a 2.5-V and 3.3-V environment. The built-in output enable glitch suppression ensures a synchronized output enable sequence to distribute full period clock signals.

The CDCVF310 is characterized for operation from -40°C to 85°C.

The CDCVF310 is a high-performance, low-skew clock buffer that operates up to 200 MHz. Two banks of five outputs each provide low-skew copies of CLK. After power up, the default state of the outputs is low regardless of the state of the control pins. For normal operation, the outputs of bank 1Y[0:4] or 2Y[0:4] can be placed in a low state when the control pins (1G or 2G, respectively) are held low and a negative clock edge is detected on the CLK input. The outputs of bank 1Y[0:4] or 2Y[0:4] can be switched into the buffer mode when the control pins (1G and 2G) are held high and a negative clock edge is detected on the CLK input. The device operates in a 2.5-V and 3.3-V environment. The built-in output enable glitch suppression ensures a synchronized output enable sequence to distribute full period clock signals.

The CDCVF310 is characterized for operation from -40°C to 85°C.

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Tipo Título Fecha
* Data sheet 2.5-V to 3.3-V High-Performance Clock Buffer datasheet (Rev. B) 22 ene 2008

Diseño y desarrollo

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Modelo de simulación

CDCVF310 IBIS Model (Rev. A)

SCAC058A.ZIP (22 KB) - IBIS Model
Herramienta de simulación

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TSSOP (PW) 24 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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