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Diodos de protección ESD

ESD122

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Diodo doble de protección contra ESD de 0.2 pF, ±3.6 V y ±17 kV para USB tipo C y HDMI 2.0

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ESD122

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Detalles del producto

Package name DFN-1006 (X1SON) Peak pulse power (8/20 μs) (max) (W) 20 Vrwm (V) 3.6 Bi-/uni-directional Bi-directional Number of channels 2 IO capacitance (typ) (pF) 0.2 IEC 61000-4-2 contact (±V) 17000 IEC 61000-4-5 (A) 2.5 Clamping voltage (V) 13.5 Dynamic resistance (typ) 0.5 Interface type HDMI 1.4/1.3, HDMI 2.0, SATA/PCIe, USB 2.0, USB 3.0, USB Type-C Breakdown voltage (min) (V) 5 IO leakage current (max) (nA) 10 Rating Catalog Operating temperature range (°C) -40 to 125
Package name DFN-1006 (X1SON) Peak pulse power (8/20 μs) (max) (W) 20 Vrwm (V) 3.6 Bi-/uni-directional Bi-directional Number of channels 2 IO capacitance (typ) (pF) 0.2 IEC 61000-4-2 contact (±V) 17000 IEC 61000-4-5 (A) 2.5 Clamping voltage (V) 13.5 Dynamic resistance (typ) 0.5 Interface type HDMI 1.4/1.3, HDMI 2.0, SATA/PCIe, USB 2.0, USB 3.0, USB Type-C Breakdown voltage (min) (V) 5 IO leakage current (max) (nA) 10 Rating Catalog Operating temperature range (°C) -40 to 125
X2SON (DMX) 3 0.6 mm² 1 x 0.6 X2SON (DMY) 3 0.78 mm² 1.3 x 0.6
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±17-kV Contact Discharge
    • ±17-kV Air Gap Discharge
  • Withstands over 10,000 ESD strikes per IEC 61000-4-2 Level 4 (Contact) without any performance degradation
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 2.5 A (8/20 µs)
  • Low IO Capacitance
    • 0.1 pF (Typical) between IOs
    • 0.2 pF (Typical) IO to GND
  • DC Breakdown Voltage: 5.1 V (Minimum)
  • Ultra Low Leakage Current: 10 nA (Maximum)
  • Low ESD Clamping Voltage: 8.4 V at 5-A TLP
  • Supports High Speed Interfaces that exceed 10 Gbps
  • Industrial Temperature Range: –40°C to +125°C
  • Type C Friendly Two Channel Flow-Through Routing Package
  • Pin-out to suit symmetric differential high-speed signal routing
  • Two Different Package Options
    • 0402 Package, 0.6 mm × 1 mm, 0.34-mm Pitch
    • 0502 Package, 0.6 mm × 1.32 mm, 0.5-mm Pitch
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±17-kV Contact Discharge
    • ±17-kV Air Gap Discharge
  • Withstands over 10,000 ESD strikes per IEC 61000-4-2 Level 4 (Contact) without any performance degradation
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 2.5 A (8/20 µs)
  • Low IO Capacitance
    • 0.1 pF (Typical) between IOs
    • 0.2 pF (Typical) IO to GND
  • DC Breakdown Voltage: 5.1 V (Minimum)
  • Ultra Low Leakage Current: 10 nA (Maximum)
  • Low ESD Clamping Voltage: 8.4 V at 5-A TLP
  • Supports High Speed Interfaces that exceed 10 Gbps
  • Industrial Temperature Range: –40°C to +125°C
  • Type C Friendly Two Channel Flow-Through Routing Package
  • Pin-out to suit symmetric differential high-speed signal routing
  • Two Different Package Options
    • 0402 Package, 0.6 mm × 1 mm, 0.34-mm Pitch
    • 0502 Package, 0.6 mm × 1.32 mm, 0.5-mm Pitch

The ESD122 is a bidirectional TVS ESD protection diode array for USB Type-C and HDMI 2.0 circuit protection. The ESD122 is rated to dissipate contact ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (17-kV Contact, 17-kV Air-gap).

This device features a low IO capacitance per channel and pin-out to suit symmetric differential high-speed signal routing making it ideal for protecting high-speed interfaces up to 10 Gbps such as USB 3.1 Gen2 and HDMI 2.0. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.

Additionally, the ESD122 is an ideal ESD solution for the USB Type-C Tx/Rx lines. Since the USB Type-C connector has two layers, using 4-channel ESD devices require VIAs which degrade the signal integrity. Using four ESD122 (2-Ch) devices minimize the number of VIAs and simply the board layout.

The ESD122 is offered in two easy routing flow through packages.

The ESD122 is a bidirectional TVS ESD protection diode array for USB Type-C and HDMI 2.0 circuit protection. The ESD122 is rated to dissipate contact ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (17-kV Contact, 17-kV Air-gap).

This device features a low IO capacitance per channel and pin-out to suit symmetric differential high-speed signal routing making it ideal for protecting high-speed interfaces up to 10 Gbps such as USB 3.1 Gen2 and HDMI 2.0. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.

Additionally, the ESD122 is an ideal ESD solution for the USB Type-C Tx/Rx lines. Since the USB Type-C connector has two layers, using 4-channel ESD devices require VIAs which degrade the signal integrity. Using four ESD122 (2-Ch) devices minimize the number of VIAs and simply the board layout.

The ESD122 is offered in two easy routing flow through packages.

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Documentación técnica

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* Data sheet ESD122 2-Channel ESD Protection Diode for USB Type-C and HDMI 2.0 datasheet (Rev. A) PDF | HTML 13 ago 2018
Application note ESD and Surge Protection for USB Interfaces (Rev. B) PDF | HTML 11 ene 2024
Application brief ESD Protection for HDMI Applications (Rev. A) PDF | HTML 01 nov 2023
Application note Capacitance Requirements for High Speed Signals (Rev. A) PDF | HTML 21 ago 2023
Selection guide System-Level ESD Protection Guide (Rev. D) 07 sep 2022
Application note ESD Packaging and Layout Guide (Rev. B) PDF | HTML 18 ago 2022
User guide Generic ESD Evaluation Module User's Guide (Rev. A) PDF | HTML 27 sep 2021
Technical article ESD fundamentals, part 4: ESD capacitance PDF | HTML 12 feb 2018
Technical article ESD fundamentals, part 3: clamping voltage PDF | HTML 06 dic 2017
Application note ESD224 HDMI 2.0 Compliance and Protection 30 nov 2017
Technical article Big USB Type-C™ protection for your small application PDF | HTML 31 jul 2017

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

ESDEVM — Módulo de evaluación de ESD

El módulo de evaluación (EVM) de dispositivos sensibles a las descargas electrostáticas (ESD) es una plataforma de desarrollo para la mayor parte de nuestra cartera de ESD. La placa viene con todas los espacios ESD tradicionales para probar muchos dispositivos. Los dispositivos se pueden soldar en (...)
Guía del usuario: PDF | HTML
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Modelo de simulación

ESD122 IBIS Model

SLVMC36.ZIP (2 KB) - IBIS Model
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Herramienta de simulación

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Diseños de referencia

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The USB Type-C® to DisplayPort Active Cable reference design is a framework that can enable DisplayPort video signaling over a USB Type-C connection. Traditionally, DisplayPort connectors transfer DisplayPort video but this connector can be large and are not ideal for small electronics. While a (...)
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Esquema: PDF
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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
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Pedidos y calidad

Información incluida:
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  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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