Detalles del producto

Technology family HC Function Digital Multiplexer Configuration 2:1 Number of channels 4 Operating temperature range (°C) -55 to 125 Rating Military
Technology family HC Function Digital Multiplexer Configuration 2:1 Number of channels 4 Operating temperature range (°C) -55 to 125 Rating Military
CDIP (J) 16 135.3552 mm² 19.56 x 6.92 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • Wide Operating Voltage Range of 2 V to 6 V
  • High-Current Inverting Outputs Drive up to 15 LSTTL Loads
  • Low Power Consumption, 80-µA Max ICC
  • ’HC257 ...Typical tpd = 9 ns
  • ’HC258 ...Typical tpd = 12 ns
  • ±6-mA Output Drive at 5 V
  • Low Input Current of 1 µA Max
  • Provides Bus Interface from Multiple Sources in High-Performance Systems

  • Wide Operating Voltage Range of 2 V to 6 V
  • High-Current Inverting Outputs Drive up to 15 LSTTL Loads
  • Low Power Consumption, 80-µA Max ICC
  • ’HC257 ...Typical tpd = 9 ns
  • ’HC258 ...Typical tpd = 12 ns
  • ±6-mA Output Drive at 5 V
  • Low Input Current of 1 µA Max
  • Provides Bus Interface from Multiple Sources in High-Performance Systems

These devices are designed to multiplex signals from 4-bit data sources to 4-output data lines in bus-organized systems. The 3-state outputs do not load the data lines when the output-enable (G\) input is at a high logic level.

To ensure the high-impedance state during power up or power down, (G\) should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

These devices are designed to multiplex signals from 4-bit data sources to 4-output data lines in bus-organized systems. The 3-state outputs do not load the data lines when the output-enable (G\) input is at a high logic level.

To ensure the high-impedance state during power up or power down, (G\) should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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Documentación técnica

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Tipo Título Fecha
* Data sheet SN54HC257, SN54HC258, SN74HC257, SN74HC258 datasheet (Rev. B) 15 sep 2003
* SMD SN54HC257 SMD 85124012A 21 jun 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 jul 2021
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
User guide Signal Switch Data Book (Rev. A) 14 nov 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 jun 1997
Application note Designing With Logic (Rev. C) 01 jun 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 oct 1996
Application note Live Insertion 01 oct 1996
Application note SN54/74HCT CMOS Logic Family Applications and Restrictions 01 may 1996
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 01 abr 1996

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Encapsulado Pines Símbolos CAD, huellas y modelos 3D
CDIP (J) 16 Ultra Librarian
LCCC (FK) 20 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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