Detalles del producto

Configuration 4:1 Number of channels 2 Power supply voltage - single (V) 1.2, 1.8, 2.5, 3.3, 5 Power supply voltage - dual (V) +/-2.5 Protocols Analog Ron (typ) (Ω) 2.5 CON (typ) (pF) 35 ON-state leakage current (max) (µA) 0.003 Supply current (typ) (µA) 0.008 Bandwidth (MHz) 155 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (max) (mA) 30 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
Configuration 4:1 Number of channels 2 Power supply voltage - single (V) 1.2, 1.8, 2.5, 3.3, 5 Power supply voltage - dual (V) +/-2.5 Protocols Analog Ron (typ) (Ω) 2.5 CON (typ) (pF) 35 ON-state leakage current (max) (µA) 0.003 Supply current (typ) (µA) 0.008 Bandwidth (MHz) 155 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (max) (mA) 30 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
TSSOP (PW) 16 32 mm² 5 x 6.4 UQFN (RSV) 16 4.68 mm² 2.6 x 1.8
  • Single supply range: 1.08V to 5.5V
  • Dual supply range: ±2.75V
  • Low leakage current: 3pA
  • Low charge injection: 1pC
  • Low on-resistance: 1.8Ω
  • -40°C to +125°C operating temperature
  • 1.8V logic compatible
  • Fail-safe logic
  • Rail to rail operation
  • Bidirectional signal path
  • Break-before-make switching
  • ESD protection HBM: 2000V
  • Single supply range: 1.08V to 5.5V
  • Dual supply range: ±2.75V
  • Low leakage current: 3pA
  • Low charge injection: 1pC
  • Low on-resistance: 1.8Ω
  • -40°C to +125°C operating temperature
  • 1.8V logic compatible
  • Fail-safe logic
  • Rail to rail operation
  • Bidirectional signal path
  • Break-before-make switching
  • ESD protection HBM: 2000V

The TMUX1109 is a precision complementary metal-oxide semiconductor (CMOS) multiplexer (MUX). The TMUX1109 offers differential 4:1 or dual 4:1 single-ended channels. Wide operating supply of 1.08V to 5.5V allows for use in a broad array of applications from medical equipment to industrial systems. The device supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from GND to VDD. All logic inputs have 1.8V logic compatible thresholds, allowing for both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.

The TMUX1109 is part of the precision switches and multiplexers family of devices. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications. A low supply current of 8nA and small package options enable use in portable applications.

The TMUX1109 is a precision complementary metal-oxide semiconductor (CMOS) multiplexer (MUX). The TMUX1109 offers differential 4:1 or dual 4:1 single-ended channels. Wide operating supply of 1.08V to 5.5V allows for use in a broad array of applications from medical equipment to industrial systems. The device supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from GND to VDD. All logic inputs have 1.8V logic compatible thresholds, allowing for both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.

The TMUX1109 is part of the precision switches and multiplexers family of devices. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications. A low supply current of 8nA and small package options enable use in portable applications.

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Documentación técnica

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* Data sheet TMUX1109 5V, ±2.5V, Low-Leakage-Current, 4:1, 2-Channel Precision Multiplexer datasheet (Rev. A) PDF | HTML 07 feb 2024
Circuit design True differential, 4 × 2 MUX, analog front end, simultaneous-sampling ADC circui (Rev. B) PDF | HTML 20 sep 2024
Product overview How to Multiplex Multiple Loads to Scale Voltage and Current Measurement Ranges PDF | HTML 15 sep 2022
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 jun 2022
Application note Guarding in Multiplexer Applications PDF | HTML 13 may 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 dic 2021
Application note Choosing the Right Multiplexer for MCU Expansion PDF | HTML 19 nov 2020

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Adaptador de interfaz

LEADED-ADAPTER1 — Adaptador de montaje superficial a conector macho DIP para pruebas rápidas de encapsulados con plomo

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Guía del usuario: PDF
Adaptador de interfaz

LEADLESS-ADAPTER1 — Adaptador de montaje superficial a conector macho DIP para pruebas de encapsulados sin plomo de 6, 8

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Guía del usuario: PDF
Modelo de simulación

TMUX1109 IBIS Model (Rev. A)

SCDM224A.ZIP (47 KB) - IBIS Model
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
TSSOP (PW) 16 Ultra Librarian
UQFN (RSV) 16 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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