Detalles del producto

Configuration 8:1 Number of channels 1 Power supply voltage - single (V) 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 250 CON (typ) (pF) 40 ON-state leakage current (max) (µA) 0.025 Supply current (typ) (µA) 250 Bandwidth (MHz) 80 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic, Overvoltage protection, Powered-off protection Input/output continuous current (max) (mA) 5 Rating Catalog Drain supply voltage (max) (V) 44 Supply voltage (max) (V) 44 Negative rail supply voltage (max) (V) -44
Configuration 8:1 Number of channels 1 Power supply voltage - single (V) 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 250 CON (typ) (pF) 40 ON-state leakage current (max) (µA) 0.025 Supply current (typ) (µA) 250 Bandwidth (MHz) 80 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic, Overvoltage protection, Powered-off protection Input/output continuous current (max) (mA) 5 Rating Catalog Drain supply voltage (max) (V) 44 Supply voltage (max) (V) 44 Negative rail supply voltage (max) (V) -44
TSSOP (PW) 16 32 mm² 5 x 6.4 WQFN (RRP) 16 16 mm² 4 x 4
  • Wide supply range:
    • Dual supply: ±5 V to ±22 V
    • Single supply: 8 V to 44 V
  • Integrated fault protection:
    • Overvoltage protection, source to supplies or source to drain: ±85 V
    • Overvoltage protection: ±60 V
    • Powered-off protection: ±60 V
    • Non-fault channels continue to operate
    • Known state without logic inputs present
    • Output clamped to the supply in overvoltage condition
  • Latch-up immune
  • 1.8-V Logic capable
  • Fail-safe logic: up to 44 V independent of supply
  • Integrated pull-down resistor on logic pins
  • Break-before-make switching
  • Industry standard TSSOP and smaller WQFN packages
  • Wide supply range:
    • Dual supply: ±5 V to ±22 V
    • Single supply: 8 V to 44 V
  • Integrated fault protection:
    • Overvoltage protection, source to supplies or source to drain: ±85 V
    • Overvoltage protection: ±60 V
    • Powered-off protection: ±60 V
    • Non-fault channels continue to operate
    • Known state without logic inputs present
    • Output clamped to the supply in overvoltage condition
  • Latch-up immune
  • 1.8-V Logic capable
  • Fail-safe logic: up to 44 V independent of supply
  • Integrated pull-down resistor on logic pins
  • Break-before-make switching
  • Industry standard TSSOP and smaller WQFN packages

The TMUX7308F and TMUX7309F are modern complementary metal-oxide semiconductor (CMOS) analog multiplexers in 8:1 (single ended) and 4:1 (differential) configurations. The devices work well with dual supplies (±5 V to ±22 V), a single supply (8 V to 44 V), or asymmetric supplies (such as V DD = 12 V, V SS = –5 V). The overvoltage protection is available in powered and powered-off conditions, making the TMUX7308F and TMUX7309F devices suitable for applications where power supply sequencing cannot be precisely controlled.

The device blocks fault voltage up to +60 V or –60 V relative to ground in both powered and powered-off conditions. When no power supplies are present, the switch channels remain in the OFF state regardless of switch input conditions and logic control status. Under normal operation conditions, if the analog input signal level on any Sx pin exceeds the supply voltage (V DD or V SS) by a threshold voltage (V T), the channel turns OFF and the Sx pin becomes high impedance. When the fault channel is selected, the drain pin (D or Dx) is pulled to the supply (V DD or V SS) that was exceeded.

The low capacitance, low charge injection, and integrated fault protection enables the TMUX7308F and TMUX7309F devices to be used in front end data acquisition applications where high performance and high robustness are both critical. The devices are available in a standard TSSOP package and smaller WQFN package (ideal if PCB space is limited).

The TMUX7308F and TMUX7309F are modern complementary metal-oxide semiconductor (CMOS) analog multiplexers in 8:1 (single ended) and 4:1 (differential) configurations. The devices work well with dual supplies (±5 V to ±22 V), a single supply (8 V to 44 V), or asymmetric supplies (such as V DD = 12 V, V SS = –5 V). The overvoltage protection is available in powered and powered-off conditions, making the TMUX7308F and TMUX7309F devices suitable for applications where power supply sequencing cannot be precisely controlled.

The device blocks fault voltage up to +60 V or –60 V relative to ground in both powered and powered-off conditions. When no power supplies are present, the switch channels remain in the OFF state regardless of switch input conditions and logic control status. Under normal operation conditions, if the analog input signal level on any Sx pin exceeds the supply voltage (V DD or V SS) by a threshold voltage (V T), the channel turns OFF and the Sx pin becomes high impedance. When the fault channel is selected, the drain pin (D or Dx) is pulled to the supply (V DD or V SS) that was exceeded.

The low capacitance, low charge injection, and integrated fault protection enables the TMUX7308F and TMUX7309F devices to be used in front end data acquisition applications where high performance and high robustness are both critical. The devices are available in a standard TSSOP package and smaller WQFN package (ideal if PCB space is limited).

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Documentación técnica

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

TMUX73XXF-EVM — Módulo de evaluación TMUX73XXF para encapsulado PW

Adaptador de interfaz

LEADED-ADAPTER1 — Adaptador de montaje superficial a conector macho DIP para pruebas rápidas de encapsulados con plomo

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Guía del usuario: PDF
Adaptador de interfaz

LEADLESS-ADAPTER1 — Adaptador de montaje superficial a conector macho DIP para pruebas de encapsulados sin plomo de 6, 8

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Guía del usuario: PDF
Modelo de simulación

TMUX7308F IBIS Model

SCDM281.ZIP (31 KB) - IBIS Model
Modelo de simulación

TMUX7308F PSPICE Model

SCDM297.ZIP (56 KB) - PSpice Model
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
TSSOP (PW) 16 Ultra Librarian
WQFN (RRP) 16 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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