Detalles del producto

Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 12, 16, 20, 36, 44, 72, 100 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-36, +/-50 Protocols Analog Ron (typ) (Ω) 5 CON (typ) (pF) 14 ON-state leakage current (max) (µA) 0.07 Supply current (typ) (µA) 350 Bandwidth (MHz) 420 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Fail-safe logic, Integrated pulldown resistor on logic pin Input/output continuous current (max) (mA) 125 Rating Catalog Drain supply voltage (max) (V) 100 Supply voltage (max) (V) 100 Negative rail supply voltage (max) (V) -50
Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 12, 16, 20, 36, 44, 72, 100 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-36, +/-50 Protocols Analog Ron (typ) (Ω) 5 CON (typ) (pF) 14 ON-state leakage current (max) (µA) 0.07 Supply current (typ) (µA) 350 Bandwidth (MHz) 420 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Fail-safe logic, Integrated pulldown resistor on logic pin Input/output continuous current (max) (mA) 125 Rating Catalog Drain supply voltage (max) (V) 100 Supply voltage (max) (V) 100 Negative rail supply voltage (max) (V) -50
TSSOP (PW) 16 32 mm² 5 x 6.4 WQFN (RUM) 16 16 mm² 4 x 4
  • High supply voltage capable:
    • Dual supply: ±10 V to ±50 V
    • Single supply: 10 V to 100 V
    • Asymmetric dual supply operation
  • Consistent parametric across supply voltages

  • Latch-up immune
  • High continuous current: 200 mA

  • Low crosstalk: –110 dB
  • Low input leakage: 10 pA
  • Low On-Resistance flatness: 0.05 Ω
  • Low On-Resistance: 5 Ω
  • Low capacitance: 12 pF
  • Removes need for additional logic rail (V L)
  • 1.8-V Logic capable
  • Fail-safe logic: up to 48 V independent of supply
  • Integrated Pull-Down resistor on logic pins
  • Bidirectional signal path
  • Wide operating temperature T A: –40°C to 125°C
  • Industry-standard TSSOP and smaller WQFN packages
  • High supply voltage capable:
    • Dual supply: ±10 V to ±50 V
    • Single supply: 10 V to 100 V
    • Asymmetric dual supply operation
  • Consistent parametric across supply voltages

  • Latch-up immune
  • High continuous current: 200 mA

  • Low crosstalk: –110 dB
  • Low input leakage: 10 pA
  • Low On-Resistance flatness: 0.05 Ω
  • Low On-Resistance: 5 Ω
  • Low capacitance: 12 pF
  • Removes need for additional logic rail (V L)
  • 1.8-V Logic capable
  • Fail-safe logic: up to 48 V independent of supply
  • Integrated Pull-Down resistor on logic pins
  • Bidirectional signal path
  • Wide operating temperature T A: –40°C to 125°C
  • Industry-standard TSSOP and smaller WQFN packages

The TMUX8211, TMUX8212, and TMUX8213 are modern high voltage capable analog switches with Latch-Up immunity. Each device has four independently controllable 1:1, single-pole single-throw (SPST) switch channels. The devices work well with dual supplies, a single supply, or asymmetric supplies up to a maximum supply voltage of 100 V. The TMUX821x devices provide consistent analog parametric performance across the entire supply voltage range. The TMUX821x family supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins.

All logic inputs support logic levels of 1.8 V, 3.3 V, and 5 V and can be connected as high as 48 V, allowing for system flexibility with control signal voltage. Fail-safe logic circuitry allows voltages on the logic pins to be applied before the supply pin, protecting the device from potential damage.

The device family provides Latch-Up immunity, preventing undesirable high current events between parasitic structures within the device. A Latch-Up condition typically continues until the power supply rails are turned off and can lead to device failure. The Latch-Up immunity feature allows this family of multiplexers to be used in harsh environments.

The TMUX8211, TMUX8212, and TMUX8213 are modern high voltage capable analog switches with Latch-Up immunity. Each device has four independently controllable 1:1, single-pole single-throw (SPST) switch channels. The devices work well with dual supplies, a single supply, or asymmetric supplies up to a maximum supply voltage of 100 V. The TMUX821x devices provide consistent analog parametric performance across the entire supply voltage range. The TMUX821x family supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins.

All logic inputs support logic levels of 1.8 V, 3.3 V, and 5 V and can be connected as high as 48 V, allowing for system flexibility with control signal voltage. Fail-safe logic circuitry allows voltages on the logic pins to be applied before the supply pin, protecting the device from potential damage.

The device family provides Latch-Up immunity, preventing undesirable high current events between parasitic structures within the device. A Latch-Up condition typically continues until the power supply rails are turned off and can lead to device failure. The Latch-Up immunity feature allows this family of multiplexers to be used in harsh environments.

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Documentación técnica

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Tipo Título Fecha
* Data sheet TMUX821x 100-V, Flat Ron, 1:1 (SPST), 4-Channel Switches with Latch-Up Immunity and 1.8-V Logic datasheet (Rev. B) PDF | HTML 30 mar 2023

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

TMUXRUM-RRPEVM — Módulo de evaluación genérico TMUX para encapsulados de 16 pines RUM y RRP de cuádruple plano sin pl

El TMUXRUM-RRPEVM permite la rápida creación de prototipos y la caracterización de CC de la línea de productos TMUX de TI que utilizan encapsulados RUM o RRP (QFN) de 16 pines y está preparado para funcionar a alta tensión.

Guía del usuario: PDF | HTML
Adaptador de interfaz

LEADED-ADAPTER1 — Adaptador de montaje superficial a conector macho DIP para pruebas rápidas de encapsulados con plomo

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Guía del usuario: PDF
Modelo de simulación

TMUX8213 IBIS Model

SCDM284.ZIP (40 KB) - IBIS Model
Modelo de simulación

TMUX8213 PSpice Model

SCDM280.ZIP (48 KB) - PSpice Model
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
TSSOP (PW) 16 Ultra Librarian
WQFN (RUM) 16 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​

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