Detalles del producto

Protocols DDR3 Configuration 2:1 SPDT Number of channels 12 Bandwidth (MHz) 1675 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 8000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Supply current (typ) (µA) 300 ESD HBM (typ) (kV) 2 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -71 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 5.6 CON (typ) (pF) 2 Off isolation (typ) (dB) -42 OFF-state leakage current (max) (µA) 1 Propagation delay time (µs) 0.00004 Ron (max) (mΩ) 12000 Ron channel match (max) (Ω) 1 RON flatness (typ) (Ω) 1.5 Turnoff time (disable) (max) (ns) 5 Turnon time (enable) (max) (ns) 7 VIH (min) (V) 2 VIL (max) (V) 0.8
Protocols DDR3 Configuration 2:1 SPDT Number of channels 12 Bandwidth (MHz) 1675 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 8000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Supply current (typ) (µA) 300 ESD HBM (typ) (kV) 2 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -71 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 5.6 CON (typ) (pF) 2 Off isolation (typ) (dB) -42 OFF-state leakage current (max) (µA) 1 Propagation delay time (µs) 0.00004 Ron (max) (mΩ) 12000 Ron channel match (max) (Ω) 1 RON flatness (typ) (Ω) 1.5 Turnoff time (disable) (max) (ns) 5 Turnon time (enable) (max) (ns) 7 VIH (min) (V) 2 VIL (max) (V) 0.8
WQFN (RUA) 42 31.5 mm² 9 x 3.5
  • Compatible with DDR3 SDRAM Standard (JESD79-3D)
  • Wide Bandwidth of 1.675 GHz
  • Low Propagation Delay (tpd = 40 ps Typ)
  • Low Bit-to-Bit Skew (tsk(o) = 6 ps Typ)
  • Low and Flat ON-State Resistance
    (rON = 8 Ω Typ)
  • Low Input/Output Capacitance
    (CON = 5.6 pF Typ)
  • Low Crosstalk (XTALK = –43 dB,
    Typ at 250 MHz)
  • VCC Operating Range from 3 V to 3.6 V
  • Rail-to-Rail Switching on Data I/O Ports
    (0 to VCC)
  • Separate Switch Control Logic for Upper and Lower 6-Channels
  • Dedicated Enable Logic Supports Hi-Z Mode
  • IOFF Protection Prevents Current Leakage in Powered Down State (VCC = 0 V)
  • ESD Performance Tested Per JESD22
    • 2000 V Human Body Model
      (A114B, Class II)
    • 1000 V Charged Device Model (C101)
  • 42-pin RUA Package (9 × 3.5 mm, 0.5 mm Pitch)
  • Compatible with DDR3 SDRAM Standard (JESD79-3D)
  • Wide Bandwidth of 1.675 GHz
  • Low Propagation Delay (tpd = 40 ps Typ)
  • Low Bit-to-Bit Skew (tsk(o) = 6 ps Typ)
  • Low and Flat ON-State Resistance
    (rON = 8 Ω Typ)
  • Low Input/Output Capacitance
    (CON = 5.6 pF Typ)
  • Low Crosstalk (XTALK = –43 dB,
    Typ at 250 MHz)
  • VCC Operating Range from 3 V to 3.6 V
  • Rail-to-Rail Switching on Data I/O Ports
    (0 to VCC)
  • Separate Switch Control Logic for Upper and Lower 6-Channels
  • Dedicated Enable Logic Supports Hi-Z Mode
  • IOFF Protection Prevents Current Leakage in Powered Down State (VCC = 0 V)
  • ESD Performance Tested Per JESD22
    • 2000 V Human Body Model
      (A114B, Class II)
    • 1000 V Charged Device Model (C101)
  • 42-pin RUA Package (9 × 3.5 mm, 0.5 mm Pitch)

The TS3DDR3812 is a 12-channel, 1:2 multiplexer/demultiplexer switch designed for DDR3 applications. It operates from a 3 to 3.6 V supply and offers low and flat ON-state resistance as well as low I/O capacitance which allow it to achieve a typical bandwidth of 1.675 GHz.

Channels A0 through A11 are divided into two banks of six bits and are independently controlled via two digital inputs called SEL1 and SEL2. These select inputs control the switch position of each 6-bit DDR3 source and allow them to be routed to one of two end-points. Alternatively, the switch can be used to connect a single endpoint to one of two 6-bit DDR3 sources. For switching 12-bit DDR3 sources, simply connect SEL1 and SEL2 together externally and control all 12 channels with a single GPIO input. An EN input allows the entire chip to be placed into a high-impedance (Hi-Z) state while not in use.

These characteristics make the TS3DDR3812 an excellent choice for use in memory, analog/digital video, LAN, and other high-speed signal switching applications.

The TS3DDR3812 is a 12-channel, 1:2 multiplexer/demultiplexer switch designed for DDR3 applications. It operates from a 3 to 3.6 V supply and offers low and flat ON-state resistance as well as low I/O capacitance which allow it to achieve a typical bandwidth of 1.675 GHz.

Channels A0 through A11 are divided into two banks of six bits and are independently controlled via two digital inputs called SEL1 and SEL2. These select inputs control the switch position of each 6-bit DDR3 source and allow them to be routed to one of two end-points. Alternatively, the switch can be used to connect a single endpoint to one of two 6-bit DDR3 sources. For switching 12-bit DDR3 sources, simply connect SEL1 and SEL2 together externally and control all 12 channels with a single GPIO input. An EN input allows the entire chip to be placed into a high-impedance (Hi-Z) state while not in use.

These characteristics make the TS3DDR3812 an excellent choice for use in memory, analog/digital video, LAN, and other high-speed signal switching applications.

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Documentación técnica

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Tipo Título Fecha
* Data sheet 12-CHANNEL, 1:2 MUX/DEMUX SWITCH FOR DDR3 APPLICATIONS datasheet (Rev. B) 03 jun 2013
Application note Preventing Excess Power Consumption on Analog Switches 03 jul 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004

Diseño y desarrollo

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Placa de evaluación

LP-AM263 — Kit de desarrollo LaunchPad™ AM263x MCU de uso general basado en Arm®

LP-AM263 is a cost-optimized development board for Sitara™ high-performance microcontrollers (MCUs) from the AM263x series. This board is ideal for initial evaluation and prototyping as it provides a standardized and easy-to-use platform to develop your next application.

LP-AM263 is equipped with a (...)

Guía del usuario: PDF | HTML
Modelo de simulación

TS3DDR3812 HSpice Model

SCDM134.ZIP (113 KB) - HSpice Model
Modelo de simulación

TS3DDR3812 IBIS

SCDM135.ZIP (24 KB) - IBIS Model
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
WQFN (RUA) 42 Ultra Librarian

Pedidos y calidad

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  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
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  • Lugar de fabricación
  • Lugar de ensamblaje

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