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Interruptores y multiplexores
Interruptores y multiplexores para protocolos específicos

TS3L100

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Interruptor LAN de 4 canales y 3.3 V, 2:1 (SPDT)

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TS3L100

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Detalles del producto

Protocols 10 BASE-T, 100 BASE-T, LAN Configuration 2:1 SPDT Number of channels 4 Bandwidth (MHz) 350 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 10000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Supply current (typ) (µA) 0.1 ESD HBM (typ) (kV) 2 Operating temperature range (°C) 0 to 70 Crosstalk (dB) -68 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 10 CON (typ) (pF) 3 Off isolation (typ) (dB) -42 OFF-state leakage current (max) (µA) 1 Propagation delay time (µs) 0.0075 Ron (max) (mΩ) 15000 Ron channel match (max) (Ω) 1 RON flatness (typ) (Ω) 1 Turnoff time (disable) (max) (ns) 3.5 Turnon time (enable) (max) (ns) 7.5 VIH (min) (V) 2 VIL (max) (V) 0.8
Protocols 10 BASE-T, 100 BASE-T, LAN Configuration 2:1 SPDT Number of channels 4 Bandwidth (MHz) 350 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 10000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Supply current (typ) (µA) 0.1 ESD HBM (typ) (kV) 2 Operating temperature range (°C) 0 to 70 Crosstalk (dB) -68 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 10 CON (typ) (pF) 3 Off isolation (typ) (dB) -42 OFF-state leakage current (max) (µA) 1 Propagation delay time (µs) 0.0075 Ron (max) (mΩ) 15000 Ron channel match (max) (Ω) 1 RON flatness (typ) (Ω) 1 Turnoff time (disable) (max) (ns) 3.5 Turnon time (enable) (max) (ns) 7.5 VIH (min) (V) 2 VIL (max) (V) 0.8
SOIC (D) 16 59.4 mm² 9.9 x 6 SSOP (DBQ) 16 29.4 mm² 4.9 x 6 TSSOP (PW) 16 32 mm² 5 x 6.4 TVSOP (DGV) 16 23.04 mm² 3.6 x 6.4 VQFN (RGY) 16 14 mm² 4 x 3.5
  • Wide Bandwidth (BW = 350 MHz Min)
  • Low Differential Crosstalk (XTALK = –68 dB Typ)
  • Low Power Consumption (ICC = 10 µA Max)
  • Bidirectional Data Flow, With Near-Zero Propagation Delay
  • Low ON-State Resistance (ron = 5 Typ)
  • Rail-to-Rail Switching on Data I/O Ports (0 to VCC)
  • VCC Operating Range From 3 V to 3.6 V
  • Ioff Supports Partial-Power-Down Mode Operation
  • Data and Control Inputs Have Undershoot Clamp Diodes
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Suitable for Both 10 Base-T/100 Base-T Signaling
  • Wide Bandwidth (BW = 350 MHz Min)
  • Low Differential Crosstalk (XTALK = –68 dB Typ)
  • Low Power Consumption (ICC = 10 µA Max)
  • Bidirectional Data Flow, With Near-Zero Propagation Delay
  • Low ON-State Resistance (ron = 5 Typ)
  • Rail-to-Rail Switching on Data I/O Ports (0 to VCC)
  • VCC Operating Range From 3 V to 3.6 V
  • Ioff Supports Partial-Power-Down Mode Operation
  • Data and Control Inputs Have Undershoot Clamp Diodes
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Suitable for Both 10 Base-T/100 Base-T Signaling

The TI TS3L100 LAN switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (E)\ input. When E\ is low, the switch is enabled and the I port is connected to the Y port. When E\ is high, the switch is disabled and the high-impedance state exists between the I and Y ports. The select (S) input controls the data path of the multiplexer/demultiplexer.

This device can be used to replace mechanical relays in LAN applications. This device has low ron, wide bandwidth, and low differential crosstalk, making it suitable for 10 Base-T, 100 Base-T, and various other LAN applications.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, E\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The TI TS3L100 LAN switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (E)\ input. When E\ is low, the switch is enabled and the I port is connected to the Y port. When E\ is high, the switch is disabled and the high-impedance state exists between the I and Y ports. The select (S) input controls the data path of the multiplexer/demultiplexer.

This device can be used to replace mechanical relays in LAN applications. This device has low ron, wide bandwidth, and low differential crosstalk, making it suitable for 10 Base-T, 100 Base-T, and various other LAN applications.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, E\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
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Documentación técnica

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Tipo Título Fecha
* Data sheet TS3L100 datasheet (Rev. A) 12 oct 2004
Application note Preventing Excess Power Consumption on Analog Switches 03 jul 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
More literature TS5L100 and TS3L100 Application Clip 25 may 2004

Diseño y desarrollo

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The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

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Adaptador de interfaz

LEADLESS-ADAPTER1 — Adaptador de montaje superficial a conector macho DIP para pruebas de encapsulados sin plomo de 6, 8

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
SOIC (D) 16 Ultra Librarian
SSOP (DBQ) 16 Ultra Librarian
TSSOP (PW) 16 Ultra Librarian
TVSOP (DGV) 16 Ultra Librarian
VQFN (RGY) 16 Ultra Librarian
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