홈 마이크로컨트롤러(MCU) 및 프로세서 Arm 기반 프로세서
홈
마이크로컨트롤러(MCU) 및 프로세서
Arm 기반 프로세서

66AK2G12

활성

고성능 멀티코어 DSP+Arm -1x Arm A15 코어, 1x C66x DSP 코어

지금 주문
데이터 시트
사용자 가이드
정오표

66AK2G12

활성
데이터 시트 지금 주문

제품 상세 정보

Arm CPU 1 Arm Cortex-A15 Arm (max) (MHz) 600, 1000 Coprocessors C66x DSP CPU 32-bit Display type 1 LCD Ethernet MAC 1-Port 1Gb, 4-Port 10/100 PRU EMAC PCIe 1 PCIe Gen 2 Hardware accelerators PRU-ICSS, Security Accelerator Features Networking Operating system Linux, RTOS Security Cryptography, Memory protection, Secure boot Rating Catalog Operating temperature range (°C) -40 to 125
Arm CPU 1 Arm Cortex-A15 Arm (max) (MHz) 600, 1000 Coprocessors C66x DSP CPU 32-bit Display type 1 LCD Ethernet MAC 1-Port 1Gb, 4-Port 10/100 PRU EMAC PCIe 1 PCIe Gen 2 Hardware accelerators PRU-ICSS, Security Accelerator Features Networking Operating system Linux, RTOS Security Cryptography, Memory protection, Secure boot Rating Catalog Operating temperature range (°C) -40 to 125
FCCSP (ABY) 625 441 mm² 21 x 21
  • Processor cores:
  • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz
    • Supports full Implementation of Armv7-A architecture instruction set
    • Integrated SIMDv2 (Arm® Neon™ Technology) and VFPv4 (Vector Floating Point)
    • 32KB of L1 program memory
    • 32KB of L1 data memory
    • 512KB of L2 memory
    • Error Correction Code (ECC) protection for L1 data memory ECC for L2 memory
    • Parity protection for L1 program memory
    • Global Timebase Counter (GTC)
      • 64-Bit free-running counter that provides timebase for Arm A15 internal timers
      • Compliant to Armv7 MPCore Architecture for Generic Timers
  • C66x fixed- and floating-point VLIW DSP subsystem at up to 1000 MHz
    • Fully object-code compatible With C67x+ and C64x+ cores
    • 32KB of L1 program memory
    • 32KB of L1 data memory
    • 1024KB of L2 configurable as L2 RAM or cache
    • Error detection for L1 program memory
    • ECC for L1 data memory
    • ECC for L2 data memory
  • Industrial subsystem:
  • Up to Two Programmable Real-Time Unit and Industrial Communication Subsystems (PRU-ICSS), each supports:
    • Two Programmable Real-Time Units (PRUs) with enhanced multiplier and accumulator, each PRU supports:
      • 16KB of program memory With ECC
      • 8KB of data memory With ECC
      • CRC32 and CRC16 hardware accelerator
      • 20 × enhanced GPIO
      • Serial Capture Unit (SCU), supporting direct connection, 16-bit parallel capture, 28-bit shift, MII_RT, EnDat 2.2 protocol and Sigma-Delta demodulation
      • Scratch pad and XFR direct connect
    • 64KB of general-purpose memory With ECC
    • One Ethernet MII_RT module with two MII ports configurable for connection with each PRU; supports multiple industrial communication protocols
    • Industrial Ethernet Peripheral (IEP) to manage and generate industrial Ethernet functions
    • Built-In Universal Asynchronous Receiver and Transmitter (UART) 16550, with a dedicated 192-MHz clock to support 12-Mbps PROFIBUS®
    • Built-In industrial Ethernet 64-Bit timer
    • Built-In enhanced capture module (eCAP)
  • Memory subsystem:
  • Multicore Shared Memory Controller (MSMC) with 1024KB of shared L2 RAM
    • Provides high-performance interconnect to internal shared SRAM and DDR EMIF for both Arm A15 and C66x Access
    • Supports Arm I/O coherency where Arm A15 is cache coherent to other system masters accessing the MSMC-SRAM or DDR EMIF
    • Supports ECC on SRAM
  • Up to 36-Bit DDR External Memory Interface (EMIF)
    • Supports DDR3L at up to 1066 MT/s
    • Supports 4-GB memory address range
    • Supports 32-Bit SDRAM data bus with 4-bit ECC
    • Supports 16-Bit and 32-Bit SDRAM data bus without ECC
  • General-Purpose Memory Controller (GPMC)
    • Flexible 8- and 16-Bit asynchronous memory interface with up to four chip selects
    • Supports NOR, Muxed-NOR, SRAM
    • Supports general-purpose memory-port expansion with the following modes:
      • Asynchronous read and write access
      • Asynchronous read page access (4-, 8-, 16-Word16)
      • Synchronous read and write access
      • Synchronous read burst access without wrap capability (4-, 8-, 16-Word16)
  • Network Subsystem (NSS):
  • Ethernet MAC (EMAC) subsystem
    • One-port Gigabit Ethernet: RMII, MII, RGMII
    • Supports 10-, 100-, 1000-Mbps full duplex
    • Supports 10-, 100-Mbps half duplex
    • Supports Ethernet Audio Video Bridging (eAVB)
    • Maximum frame size 2016 Bytes (2020 Bytes with VLAN)
    • Eight priority level QOS support (802.1p)
    • IEEE 1588v2 (2008 Annex D, Annex E, and
      Annex F) to facilitate Audio Video Bridging 802.1AS Precision Time Protocol (PTP)
    • CPTS module with timestamping support for IEEE 1588v2
    • DSCP priority mapping (IPv4 and IPv6)
    • MDIO module for PHY management
    • Enhanced statistics collection
  • Navigator Subsystem (NAVSS)
    • Built-In packet DMA controller for optimized network processing
    • Built-In Queue Manager (QM) for optimized network processing
      • Supports up to 128 queues
      • 2048 buffers supported in internal queue RAM
  • Crypto Engine (SA) supports:
    • Crypto Function Library for AES, DES, 3DES, SHA1, MD5, SHA2-224 and SHA2-256 Operations
    • Block data encryption supported through hardware cores
      • AES with 128-, 192-, and 256-Bit Key supports
      • DES and 3DES with 1, 2, or 3 Different Key support
    • Programmable Mode Control Engine (MCE)
    • Public Key Accelerator (PKA) with elliptic curve cryptography
    • Elliptic Curve Diffie–Hellman (ECDH) based key exchange and digital signature (ECDSA) applications
    • Authentication for SHA1, MD5, SHA2-224 and SHA2-256
    • Keyed HMAC operation through hardware core
    • True Random Number Generator (TRNG)
  • Display Subsystem:
  • Supports one video pipe with in-loop scaling, color space
  • Conversion and background color overlay
  • Input data format: BITMAP, RGB16, RGB24, RGB32, ARGB16, ARGB32, YUV420, YUV422, and RGB565-A8
  • Supported display interfaces:
    • MIPI® DPI 2.0 parallel interface
    • RFBI (MIPI-DBI 2.0) up to QVGA at 30fps
    • BT.656 4:2:2
    • BT.1120 4:2:2 up to 1920 × 1080 at 30fps
  • In-loop scaling capability
  • LCD interface supports:
    • Active Matrix (TFT)
    • Passive Matrix (STN)
    • Grayscale
    • TDM
    • AC Bias Control
    • Dither
    • CPR
  • Asynchronous Audio Sample Rate Converter (ASRC)
  • High performance asynchronous sample rate converter with 140 dB Signal-to-Noise (SNR)
  • Up to 8 stereo streams (16 audio channels)
  • Automatically sensing / detection of input sample frequencies
  • Attenuation of sampling clock jitter
  • 16-, 18-, 20-, 24-Bit data input/output
  • Audio sample rates from 8 kHz to 216 kHz
  • Input/output sampling ratios from 16:1 to 1:16
  • Group mode, where multiple ASRC blocks use the same timing loop for input or output
  • Linear phase FIR filter
  • Controllable soft mute
  • Independent clock generator, and rate and stamp generator, for each input and output clock zone
  • Separate DMA events for input and output, for each channel and group
  • High-speed serial interfaces:
  • PCI Express® 2.0 port with integrated PHY:
    • Single lane Gen2-compliant port
    • Root Complex (RC) and End Point (EP) modes
  • Up to two USB 2.0 High-Speed dual-role ports with Integrated PHYs, support:
    • Dual-role-device (DRD) Capability with:
      • USB 2.0 peripheral (or device) at
        HS (480Mbps) and FS (12Mbps) speeds
      • USB 2.0 host at HS (480Mbps),
        FS (12Mbps), and LS (1.5Mbps) speeds
      • USB 2.0 static peripheral and static host operations
    • xHCI controller with the following features:
      • Compatible to the xHCI specification (revision 1.1) in host mode
      • All modes of transfer (control, bulk, interrupt, and isochronous)
      • 15 transmit (TX), 15 receive (RX) endpoints (EPs), and one bidirectional endpoint (EP0)
  • Flash media interfaces:
  • QSPI™ with XIP and up to four chip selects, supports:
    • Memory-mapped direct mode of operation for performing FLASH data transfers and executing code from FLASH memory (XIP)
    • Supports up to 96 MHz
    • Internal SRAM buffer with ECC
    • High speed read data capture mechanism
  • Two Multimedia Card (MMC) and Secure Digital (SD) ports
    • Supports JEDEC JESD84 v4.5-A441 and SD3.0 physical layer with SDA3.00 standards
    • MMC0 supports 3.3-V I/O for:
      • SD DS and HS mode
      • eMMC mode HS-SDR
        up to 48 MHz
    • MMC1 supports 1.8-V I/O modes for eMMC, including HS-SDR and DDR at up to 48 MHz with 4- and 8-Bit bus width
  • Audio peripherals:
  • Three Multichannel Audio Serial Port (McASP) peripherals
    • Transmit and receive clocks up to 50 MHz
    • Two independent clock zones and independent transmit and receive clocks per McASP
    • Up to 16-, 10-, 6-serial data pins for McASP0, McASP1, and McASP2, respectively
    • Supports TDM, I2S, and similar formats
    • Supports DIT mode
    • Built-In FIFO buffers for optimized system traffic
  • Multichannel Buffered Serial Port (McBSP)
    • Transmit and receive clocks up to 50 MHz
    • Two clock zones and two serial-data pins
    • Supports TDM, I2S, and similar formats
  • Real-time control interfaces:
  • Six Enhanced High Resolution Pulse Width Modulation (eHRPWM) Modules, Each Counter supports:
    • Dedicated 16-Bit Time-Base with Period and Frequency Control
    • Two independent PWM outputs with single edge operation
    • Two independent PWM outputs with dual-edge symmetric operation
    • One independent PWM output with dual-edge asymmetric operation
  • Two 32-Bit Enhanced Capture Modules (eCAP):
    • Supports one capture input or one auxiliary PWM output configuration options
    • 4-Event time-stamp registers (Each 32-Bits)
    • Interrupt on either of the four events
  • Three 32-Bit Enhanced Quadrature Pulse Encoder Modules (eQEP), each supports:
    • Quadrature decoding
    • Position counter and control unit for position measurement
    • Unit time base for speed and frequency measurement
  • General connectivity:
  • Two Controller Area Network (CAN) Ports
    • Supports CAN v2.0 Part A, B (ISO 11898-1) protocol
    • Bit rates up to 1 Mbps
    • Dual clock source
    • ECC protection for message RAM
  • One Media Local Bus (MLB)
    • Supports both 3-pin (up to MOST50, 1024 × Fs) and 6-pin (up to MOST150, 2048 × Fs) versions of MediaLB® Physical layer specification v4.2
    • Supports all types of data transfer over 64 logical channels (synchronous stream, isochronous, asynchronous packet, control message)
    • Supports 3-wire MOST 150 protocol
  • Three Inter-Integrated Circuit (I2C) interfaces, each supports:
    • Standard (up to 100 kHz) and
      Fast (up to 400 kHz) modes
    • 7-Bit addressing mode
    • Supports EEPROM size up to 4Mbit
  • Four Serial Peripheral Interfaces (SPI), each supports:
    • Operates at up to 50 MHz in master mode and 25 MHz in slave mode
    • Two chip selects
  • Three UART interfaces
    • All UARTs are 16C750-compatible and operate at up to 3M baud
    • UART0 supports 8 pins with full modem control, with DSR, DTR, DCD, and RI signals
    • UART1 and UART2 are 4-pin interfaces
  • General-Purpose I/O (GPIO)
    • Up to 212 GPIOs muxed with other interfaces
    • Can be configured as interrupt pins
  • Timers and miscellaneous modules:
  • Seven 64-Bit timers:
    • Two 64-Bit timers dedicated to Arm A15 and DSP cores (one timer per core)
      • Watchdog and General-Purpose (GP)
    • Four 64-Bit timers are shared for general purposes
    • Each 64-Bit timer can be configured as two individual 32-Bit timers
    • One 64-Bit timer dedicated for PMMC
    • Two timers input/output pin pairs
  • Interprocessor communication with:
    • Message manager to facilitate multiprocessor access to the PMMC:
      • Provides hardware acceleration for pushing and popping messages to/from logical queues
      • Supports up to 64 queues and 128 messages
    • Semaphore module with up to 64 independent semaphores and 16 masters (device cores)
  • EDMA with 128 (2 × 64) channels and
    1024 (2 × 512) PaRAM entries
  • Keystone II System on Chip (SoC) architecture:
  • Security
    • Supports General-Purpose (GP) and High-Secure (HS) devices
    • Supports secure boot
    • Supports customer secondary keys
    • 4KB of One-Time Programmable (OTP) ROM for customer keys
  • Power management
    • Integrated Power Management Microcontroller (PMMC) technology
  • Supports primary boot from UART, I2C, SPI, GPMC, SD or eMMC, USB device firmware upgrade v1.1, PCIe®, and Ethernet interfaces
  • Keystone II debug architecture with integrated Arm CoreSight™ support and trace capability
  • Operating Temperature (TJ):
  • –40°C to 125°C (Industrial Extended)
  • –40°C to 105°C (Extended)
  • 0°C to 90°C (Commercial)
  • Processor cores:
  • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz
    • Supports full Implementation of Armv7-A architecture instruction set
    • Integrated SIMDv2 (Arm® Neon™ Technology) and VFPv4 (Vector Floating Point)
    • 32KB of L1 program memory
    • 32KB of L1 data memory
    • 512KB of L2 memory
    • Error Correction Code (ECC) protection for L1 data memory ECC for L2 memory
    • Parity protection for L1 program memory
    • Global Timebase Counter (GTC)
      • 64-Bit free-running counter that provides timebase for Arm A15 internal timers
      • Compliant to Armv7 MPCore Architecture for Generic Timers
  • C66x fixed- and floating-point VLIW DSP subsystem at up to 1000 MHz
    • Fully object-code compatible With C67x+ and C64x+ cores
    • 32KB of L1 program memory
    • 32KB of L1 data memory
    • 1024KB of L2 configurable as L2 RAM or cache
    • Error detection for L1 program memory
    • ECC for L1 data memory
    • ECC for L2 data memory
  • Industrial subsystem:
  • Up to Two Programmable Real-Time Unit and Industrial Communication Subsystems (PRU-ICSS), each supports:
    • Two Programmable Real-Time Units (PRUs) with enhanced multiplier and accumulator, each PRU supports:
      • 16KB of program memory With ECC
      • 8KB of data memory With ECC
      • CRC32 and CRC16 hardware accelerator
      • 20 × enhanced GPIO
      • Serial Capture Unit (SCU), supporting direct connection, 16-bit parallel capture, 28-bit shift, MII_RT, EnDat 2.2 protocol and Sigma-Delta demodulation
      • Scratch pad and XFR direct connect
    • 64KB of general-purpose memory With ECC
    • One Ethernet MII_RT module with two MII ports configurable for connection with each PRU; supports multiple industrial communication protocols
    • Industrial Ethernet Peripheral (IEP) to manage and generate industrial Ethernet functions
    • Built-In Universal Asynchronous Receiver and Transmitter (UART) 16550, with a dedicated 192-MHz clock to support 12-Mbps PROFIBUS®
    • Built-In industrial Ethernet 64-Bit timer
    • Built-In enhanced capture module (eCAP)
  • Memory subsystem:
  • Multicore Shared Memory Controller (MSMC) with 1024KB of shared L2 RAM
    • Provides high-performance interconnect to internal shared SRAM and DDR EMIF for both Arm A15 and C66x Access
    • Supports Arm I/O coherency where Arm A15 is cache coherent to other system masters accessing the MSMC-SRAM or DDR EMIF
    • Supports ECC on SRAM
  • Up to 36-Bit DDR External Memory Interface (EMIF)
    • Supports DDR3L at up to 1066 MT/s
    • Supports 4-GB memory address range
    • Supports 32-Bit SDRAM data bus with 4-bit ECC
    • Supports 16-Bit and 32-Bit SDRAM data bus without ECC
  • General-Purpose Memory Controller (GPMC)
    • Flexible 8- and 16-Bit asynchronous memory interface with up to four chip selects
    • Supports NOR, Muxed-NOR, SRAM
    • Supports general-purpose memory-port expansion with the following modes:
      • Asynchronous read and write access
      • Asynchronous read page access (4-, 8-, 16-Word16)
      • Synchronous read and write access
      • Synchronous read burst access without wrap capability (4-, 8-, 16-Word16)
  • Network Subsystem (NSS):
  • Ethernet MAC (EMAC) subsystem
    • One-port Gigabit Ethernet: RMII, MII, RGMII
    • Supports 10-, 100-, 1000-Mbps full duplex
    • Supports 10-, 100-Mbps half duplex
    • Supports Ethernet Audio Video Bridging (eAVB)
    • Maximum frame size 2016 Bytes (2020 Bytes with VLAN)
    • Eight priority level QOS support (802.1p)
    • IEEE 1588v2 (2008 Annex D, Annex E, and
      Annex F) to facilitate Audio Video Bridging 802.1AS Precision Time Protocol (PTP)
    • CPTS module with timestamping support for IEEE 1588v2
    • DSCP priority mapping (IPv4 and IPv6)
    • MDIO module for PHY management
    • Enhanced statistics collection
  • Navigator Subsystem (NAVSS)
    • Built-In packet DMA controller for optimized network processing
    • Built-In Queue Manager (QM) for optimized network processing
      • Supports up to 128 queues
      • 2048 buffers supported in internal queue RAM
  • Crypto Engine (SA) supports:
    • Crypto Function Library for AES, DES, 3DES, SHA1, MD5, SHA2-224 and SHA2-256 Operations
    • Block data encryption supported through hardware cores
      • AES with 128-, 192-, and 256-Bit Key supports
      • DES and 3DES with 1, 2, or 3 Different Key support
    • Programmable Mode Control Engine (MCE)
    • Public Key Accelerator (PKA) with elliptic curve cryptography
    • Elliptic Curve Diffie–Hellman (ECDH) based key exchange and digital signature (ECDSA) applications
    • Authentication for SHA1, MD5, SHA2-224 and SHA2-256
    • Keyed HMAC operation through hardware core
    • True Random Number Generator (TRNG)
  • Display Subsystem:
  • Supports one video pipe with in-loop scaling, color space
  • Conversion and background color overlay
  • Input data format: BITMAP, RGB16, RGB24, RGB32, ARGB16, ARGB32, YUV420, YUV422, and RGB565-A8
  • Supported display interfaces:
    • MIPI® DPI 2.0 parallel interface
    • RFBI (MIPI-DBI 2.0) up to QVGA at 30fps
    • BT.656 4:2:2
    • BT.1120 4:2:2 up to 1920 × 1080 at 30fps
  • In-loop scaling capability
  • LCD interface supports:
    • Active Matrix (TFT)
    • Passive Matrix (STN)
    • Grayscale
    • TDM
    • AC Bias Control
    • Dither
    • CPR
  • Asynchronous Audio Sample Rate Converter (ASRC)
  • High performance asynchronous sample rate converter with 140 dB Signal-to-Noise (SNR)
  • Up to 8 stereo streams (16 audio channels)
  • Automatically sensing / detection of input sample frequencies
  • Attenuation of sampling clock jitter
  • 16-, 18-, 20-, 24-Bit data input/output
  • Audio sample rates from 8 kHz to 216 kHz
  • Input/output sampling ratios from 16:1 to 1:16
  • Group mode, where multiple ASRC blocks use the same timing loop for input or output
  • Linear phase FIR filter
  • Controllable soft mute
  • Independent clock generator, and rate and stamp generator, for each input and output clock zone
  • Separate DMA events for input and output, for each channel and group
  • High-speed serial interfaces:
  • PCI Express® 2.0 port with integrated PHY:
    • Single lane Gen2-compliant port
    • Root Complex (RC) and End Point (EP) modes
  • Up to two USB 2.0 High-Speed dual-role ports with Integrated PHYs, support:
    • Dual-role-device (DRD) Capability with:
      • USB 2.0 peripheral (or device) at
        HS (480Mbps) and FS (12Mbps) speeds
      • USB 2.0 host at HS (480Mbps),
        FS (12Mbps), and LS (1.5Mbps) speeds
      • USB 2.0 static peripheral and static host operations
    • xHCI controller with the following features:
      • Compatible to the xHCI specification (revision 1.1) in host mode
      • All modes of transfer (control, bulk, interrupt, and isochronous)
      • 15 transmit (TX), 15 receive (RX) endpoints (EPs), and one bidirectional endpoint (EP0)
  • Flash media interfaces:
  • QSPI™ with XIP and up to four chip selects, supports:
    • Memory-mapped direct mode of operation for performing FLASH data transfers and executing code from FLASH memory (XIP)
    • Supports up to 96 MHz
    • Internal SRAM buffer with ECC
    • High speed read data capture mechanism
  • Two Multimedia Card (MMC) and Secure Digital (SD) ports
    • Supports JEDEC JESD84 v4.5-A441 and SD3.0 physical layer with SDA3.00 standards
    • MMC0 supports 3.3-V I/O for:
      • SD DS and HS mode
      • eMMC mode HS-SDR
        up to 48 MHz
    • MMC1 supports 1.8-V I/O modes for eMMC, including HS-SDR and DDR at up to 48 MHz with 4- and 8-Bit bus width
  • Audio peripherals:
  • Three Multichannel Audio Serial Port (McASP) peripherals
    • Transmit and receive clocks up to 50 MHz
    • Two independent clock zones and independent transmit and receive clocks per McASP
    • Up to 16-, 10-, 6-serial data pins for McASP0, McASP1, and McASP2, respectively
    • Supports TDM, I2S, and similar formats
    • Supports DIT mode
    • Built-In FIFO buffers for optimized system traffic
  • Multichannel Buffered Serial Port (McBSP)
    • Transmit and receive clocks up to 50 MHz
    • Two clock zones and two serial-data pins
    • Supports TDM, I2S, and similar formats
  • Real-time control interfaces:
  • Six Enhanced High Resolution Pulse Width Modulation (eHRPWM) Modules, Each Counter supports:
    • Dedicated 16-Bit Time-Base with Period and Frequency Control
    • Two independent PWM outputs with single edge operation
    • Two independent PWM outputs with dual-edge symmetric operation
    • One independent PWM output with dual-edge asymmetric operation
  • Two 32-Bit Enhanced Capture Modules (eCAP):
    • Supports one capture input or one auxiliary PWM output configuration options
    • 4-Event time-stamp registers (Each 32-Bits)
    • Interrupt on either of the four events
  • Three 32-Bit Enhanced Quadrature Pulse Encoder Modules (eQEP), each supports:
    • Quadrature decoding
    • Position counter and control unit for position measurement
    • Unit time base for speed and frequency measurement
  • General connectivity:
  • Two Controller Area Network (CAN) Ports
    • Supports CAN v2.0 Part A, B (ISO 11898-1) protocol
    • Bit rates up to 1 Mbps
    • Dual clock source
    • ECC protection for message RAM
  • One Media Local Bus (MLB)
    • Supports both 3-pin (up to MOST50, 1024 × Fs) and 6-pin (up to MOST150, 2048 × Fs) versions of MediaLB® Physical layer specification v4.2
    • Supports all types of data transfer over 64 logical channels (synchronous stream, isochronous, asynchronous packet, control message)
    • Supports 3-wire MOST 150 protocol
  • Three Inter-Integrated Circuit (I2C) interfaces, each supports:
    • Standard (up to 100 kHz) and
      Fast (up to 400 kHz) modes
    • 7-Bit addressing mode
    • Supports EEPROM size up to 4Mbit
  • Four Serial Peripheral Interfaces (SPI), each supports:
    • Operates at up to 50 MHz in master mode and 25 MHz in slave mode
    • Two chip selects
  • Three UART interfaces
    • All UARTs are 16C750-compatible and operate at up to 3M baud
    • UART0 supports 8 pins with full modem control, with DSR, DTR, DCD, and RI signals
    • UART1 and UART2 are 4-pin interfaces
  • General-Purpose I/O (GPIO)
    • Up to 212 GPIOs muxed with other interfaces
    • Can be configured as interrupt pins
  • Timers and miscellaneous modules:
  • Seven 64-Bit timers:
    • Two 64-Bit timers dedicated to Arm A15 and DSP cores (one timer per core)
      • Watchdog and General-Purpose (GP)
    • Four 64-Bit timers are shared for general purposes
    • Each 64-Bit timer can be configured as two individual 32-Bit timers
    • One 64-Bit timer dedicated for PMMC
    • Two timers input/output pin pairs
  • Interprocessor communication with:
    • Message manager to facilitate multiprocessor access to the PMMC:
      • Provides hardware acceleration for pushing and popping messages to/from logical queues
      • Supports up to 64 queues and 128 messages
    • Semaphore module with up to 64 independent semaphores and 16 masters (device cores)
  • EDMA with 128 (2 × 64) channels and
    1024 (2 × 512) PaRAM entries
  • Keystone II System on Chip (SoC) architecture:
  • Security
    • Supports General-Purpose (GP) and High-Secure (HS) devices
    • Supports secure boot
    • Supports customer secondary keys
    • 4KB of One-Time Programmable (OTP) ROM for customer keys
  • Power management
    • Integrated Power Management Microcontroller (PMMC) technology
  • Supports primary boot from UART, I2C, SPI, GPMC, SD or eMMC, USB device firmware upgrade v1.1, PCIe®, and Ethernet interfaces
  • Keystone II debug architecture with integrated Arm CoreSight™ support and trace capability
  • Operating Temperature (TJ):
  • –40°C to 125°C (Industrial Extended)
  • –40°C to 105°C (Extended)
  • 0°C to 90°C (Commercial)

66AK2G1x is a family of heterogeneous multicore System-on-Chip (SoC) devices based on TI’s field-proven Keystone II (KS2) architecture. These devices address applications that require both DSP and Arm performance, with integration of high-speed peripheral and memory interfaces, hardware acceleration for network and cryptography functions, and high-level operating systems (HLOS) support.

Similar to existing KS2-based SoC devices, the 66AK2G1x enables both the DSP and Arm cores to master all memory and peripherals in the system. This architecture facilitates maximum software flexibility where either DSP- or Arm-centric system designs can be achieved.

The 66AK2G1x significantly improves device reliability by extensively implementing error correction code (ECC) in processor cores, shared memory, embedded memory in modules, and external memory interfaces. Full analysis of soft error rate (SER) and power-on-hours (POH) shows that the designated 66AK2G1x parts satisfy a wide range of industrial requirements.

Accompanied by the new Processor SDK, the 66AK2G1x development platform enables unprecedented ease-of-use with main line open source Linux, Code Composer Studio™ (CCS) - Integrated Development Environment (IDE), a wide range of OS-independent device drivers, as well as TI-RTOS that enables seamless task management across processor cores. The device also features advanced debug and trace technology with the latest innovations from TI and Arm, such as system trace and seamless integration of the Arm CoreSight components.

Secure boot can also be made available for anticloning and illegal software update protection. For more information about secure boot, contact your TI sales representative.

66AK2G1x is a family of heterogeneous multicore System-on-Chip (SoC) devices based on TI’s field-proven Keystone II (KS2) architecture. These devices address applications that require both DSP and Arm performance, with integration of high-speed peripheral and memory interfaces, hardware acceleration for network and cryptography functions, and high-level operating systems (HLOS) support.

Similar to existing KS2-based SoC devices, the 66AK2G1x enables both the DSP and Arm cores to master all memory and peripherals in the system. This architecture facilitates maximum software flexibility where either DSP- or Arm-centric system designs can be achieved.

The 66AK2G1x significantly improves device reliability by extensively implementing error correction code (ECC) in processor cores, shared memory, embedded memory in modules, and external memory interfaces. Full analysis of soft error rate (SER) and power-on-hours (POH) shows that the designated 66AK2G1x parts satisfy a wide range of industrial requirements.

Accompanied by the new Processor SDK, the 66AK2G1x development platform enables unprecedented ease-of-use with main line open source Linux, Code Composer Studio™ (CCS) - Integrated Development Environment (IDE), a wide range of OS-independent device drivers, as well as TI-RTOS that enables seamless task management across processor cores. The device also features advanced debug and trace technology with the latest innovations from TI and Arm, such as system trace and seamless integration of the Arm CoreSight components.

Secure boot can also be made available for anticloning and illegal software update protection. For more information about secure boot, contact your TI sales representative.
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기술 자료

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42개 모두 보기
유형 직함 날짜
* Data sheet 66AK2G1x Multicore DSP+Arm KeyStone II System-on-Chip (SoC) datasheet (Rev. F) PDF | HTML 2019/12/10
* Errata 66AK2G1x Errata (Rev. B) 2018/06/20
* User guide 66AK2Gx Multicore DSP + ARM Keystone II System-on-Chip (SOC) TRM (Rev. I) 2019/04/18
Application note Industrial Communication Protocols Supported on Sitara™ Processors (Rev. E) PDF | HTML 2024/05/10
Application note High-Speed Interface Layout Guidelines (Rev. J) PDF | HTML 2023/02/24
Application note PRU-ICSS Feature Comparison (Rev. G) PDF | HTML 2022/10/11
Application note DDR3 Design Requirements for KeyStone Devices (Rev. D) PDF | HTML 2022/07/07
Application note Keystone Error Detection and Correction EDC ECC (Rev. A) 2021/06/25
Application note How to Migrate CCS 3.x Projects to the Latest CCS (Rev. A) PDF | HTML 2021/05/19
Application note Using DSPLIB FFT Implementation for Real Input and Without Data Scaling PDF | HTML 2019/06/11
Application note KeyStone II DDR3 interface bring-up 2019/03/07
White paper Designing professional audio mixers for every scenario 2018/06/28
Design guide DDR ECC Reference Design to Improve Memory Reliability in 66AK2Gx-Based Systems (Rev. B) 2018/06/12
Application note 66AK2G1x: EVMK2GX General-Purpose EVM Power Distribution Network Analysis 2018/03/14
User guide PRU Assembly Instruction User Guide 2018/02/16
Application note 66AK2G12 Power Consumption Summary 2018/02/09
Application note 66AK2G12 Power Estimation Tool 2018/01/19
User guide TPS65911A User’s Guide for 66AK2G12 Processor (Rev. A) 2017/12/18
User guide 66AK2Gx Hardware Design Guide (Rev. A) 2017/11/14
User guide 66AK2Gx BGA Escape Routing Stackup (Rev. A) 2017/11/14
Application note 66AK2Gx Schematic Checklist (Rev. A) 2017/11/14
User guide K2G General Purpose Evaluation Module (EVMK2G) TRM (Rev. A) 2017/09/20
White paper Designing Embedded Systems for High Reliability With 66AK2Gx (Rev. A) 2017/08/28
White paper Getting personal with the 66AK2Gx SoC (Rev. A) 2017/08/02
More literature K2G General-Purpose (GP) EVM Quick Start Guide (Rev. A) 2017/07/27
White paper Voice as the user interface – a new era in speech processing white Paper 2017/05/09
Application note Processor SDK RTOS Audio Benchmark Starter Kit 2017/04/12
User guide K2G Industrial Communications Engine (K2G ICE) 2017/02/28
More literature K2G Industrial Communications Engine (ICE) Quick Start Guide 2017/02/02
User guide TPS659118 User’s Guide for 66AK2G02 Processor 2016/05/02
Application note SERDES Link Commissioning on KeyStone I and II Devices 2016/04/13
More literature K2G Audio Daughter Card Quick Start Guide 2016/03/14
White paper Multicore SoCs stay a step ahead of SoC FPGAs 2016/02/23
Application note TI DSP Benchmarking 2016/01/13
Application note Keystone II DDR3 Debug Guide 2015/10/16
Application note Keystone II DDR3 Initialization 2015/01/26
Application note Hardware Design Guide for KeyStone II Devices 2014/03/24
User guide C66x CorePac User's Guide (Rev. C) 2013/06/28
Application note Introduction to TMS320C6000 DSP Optimization 2011/10/06
White paper Software and Hardware Design Challenges Due to Dynamic Raw NAND Market 2011/05/19
User guide C66x CPU and Instruction Set Reference Guide 2010/11/09
User guide C66x DSP Cache User's Guide 2010/11/09

설계 및 개발

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도터 카드

AUDK2G — 66AK2Gx(K2G) 오디오 부속 카드

The K2G audio daughter card is designed to work in conjunction with the K2G general-purpose EVM (EVMK2G) or EVMK2GX and the EVMK2G or EVMK2GX is required for audio daughter card operation.  The daughter card allows users to develop multichannel audio applications such as A/V receivers, (...)

사용 설명서: PDF
TI.com에서 구매 불가
개발 키트

EVMK2GX — 66AK2Gx 1GHz 평가 모듈

The EVMK2GX (also known as "K2G") 1GHz evaluation module (EVM) enables developers to immediately start evaluating the 66AK2Gx processor family, and to accelerate the development of audio, industrial motor control, smart grid protection and other high reliability, real-time compute intensive (...)

사용 설명서: PDF
TI.com에서 구매 불가
개발 키트

EVMK2GXS — 66AK2Gx(K2G) 1GHz 높은 보안 평가 모듈

The K2G 1GHz High Secure Evaluation Module (EVM) enables developers to start  evaluating and testing the programming of the  high secure developmental version of the  66AK2Gx processor, and to accelerate the next stage of secure boot product development of audio and industrial real (...)

사용 설명서: PDF
요청
소프트웨어 개발 키트(SDK)

PROCESSOR-SDK-LINUX-K2G — Linux Processor SDK for K2Gx

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos. All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly reuse and (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
66AK2G12 — 고성능 멀티코어 DSP+Arm -1x Arm A15 코어, 1x C66x DSP 코어
다운로드 옵션
소프트웨어 개발 키트(SDK)

PROCESSOR-SDK-LINUX-RT-K2G — Linux-RT Processor SDK for K2G

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos. All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly reuse and (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
66AK2G12 — 고성능 멀티코어 DSP+Arm -1x Arm A15 코어, 1x C66x DSP 코어
다운로드 옵션
소프트웨어 개발 키트(SDK)

PROCESSOR-SDK-RTOS-K2G — TI-RTOS Processor SDK for K2Gx (No design support from TI available. Refer to Overview- RTOS Highlights for details.)

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos. All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly reuse and (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
66AK2G12 — 고성능 멀티코어 DSP+Arm -1x Arm A15 코어, 1x C66x DSP 코어
다운로드 옵션
드라이버 또는 라이브러리

AEC-AER — Acoustic echo cancellation/removal for TI C64x+, C674x, C55x and Cortex®-A8 processors

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
66AK2G12 — 고성능 멀티코어 DSP+Arm -1x Arm A15 코어, 1x C66x DSP 코어
DSP(디지털 신호 프로세서)
DM505 — 비전 분석용 SoC 15mm 패키지 SM320C6201-EP — 향상된 제품 C6201 고정 소수점 DSP SM320C6415-EP — 향상된 제품 C6415 고정 소수점 DSP SM320C6424-EP — EP(Enhanced Product) C6424 고정 소수점 DSP SM320C6455-EP — EP(Enhanced Product) C6455 고정 소수점 DSP SM320C6472-HIREL — 높은 안정성 제품 6 코어 C6472 고정 소수점 DSP SM320C6678-HIREL — 고신뢰성 제품 고성능 8코어 C6678 고정 및 부동 소수점 DSP SM320C6701 — 군사용 애플리케이션을 위한 단일 코어 C67x 부동 소수점 DSP - 최대 167MHz SM320C6701-EP — 향상된 제품 C6701 부동 소수점 DSP SM320C6711D-EP — 향상된 제품 C6711D 부동 소수점 DSP SM320C6712D-EP — 향상된 제품 C6712D DSP SM320C6713B-EP — 향상된 제품 C6713 부동 소수점 DSP SM320C6727B — 군사용 등급 C6727B 부동 소수점 DSP SM320C6727B-EP — 향상된 제품 C6727 부동 소수점 DSP SMJ320C6201B — 고정 소수점 디지털 신호 프로세서, 군사용 SMJ320C6203 — 군사용 등급 C62x 고정 소수점 DSP - 세라믹 패키지 SMJ320C6701 — 군사용 등급 C67x 부동 소수점 DSP - 세라믹 패키지 SMJ320C6701-SP — 우주 항공 등급 C6701 부동 소수점 DSP - 세라믹 패키지를 지원하는 방사능 내성 클래스 V SMV320C6727B-SP — 우주 항공 등급 C6727B 부동 소수점 DSP - 세라믹 패키지를 지원하는 방사능 내성 클래스 V TMS320C5517 — 저전력 C55x 고정 소수점 DSP - 최대 200MHz, USB, LCD 인터페이스, FFT HWA, SAR ADC TMS320C5532 — 저전력 C55x 고정 소수점 DSP - 최대 100MHz TMS320C5533 — 저전력 C55x 고정 소수점 DSP - 최대 100MHz, USB TMS320C5534 — 저전력 C55x 고정 소수점 DSP - 최대 100MHz, USB, LCD 인터페이스 TMS320C5535 — 저전력 C55x 고정 소수점 DSP - 최대 100MHz, USB, LCD 인터페이스, FFT HWA, SAR ADC TMS320C6202B — C62x 고정 소수점 DSP - 최대 300MHz, 384KB TMS320C6203B — C62x 고정 소수점 DSP - 최대 300MHz, 896KB TMS320C6204 — 고정소수점 디지털 신호 프로세서 TMS320C6205 — 고정소수점 디지털 신호 프로세서 TMS320C6211B — C62x 고정 소수점 DSP - 최대 167MHz TMS320C6414 — C64x 고정 소수점 DSP - 최대 720MHz, McBSP TMS320C6415 — C64x 고정 소수점 DSP - 최대 720MHz, McBSP, PCI TMS320C6416 — C64x 고정 소수점 DSP - 최대 720MHz, McBSP, PCI, VCP/TCP TMS320C6421Q — C64x+ 고정 소수점 DSP - 최대 600MHz, 8비트 EMIFA, 16비트 DDR2 TMS320C6424Q — C64x+ 고정 소수점 DSP - 최대 600MHz, 16/8비트 EMIFA, 32/16비트 DDR2 TMS320C6454 — C64x+ 고정 소수점 DSP - 최대 1GHz, 64비트 EMIFA, 32/16비트 DDR2, 1Gbps 이더넷 TMS320C6457 — 통신 인프라 디지털 신호 프로세서 TMS320C6701 — C67x 부동 소수점 DSP - 최대 167MHz, McBSP TMS320C6711D — C67x 부동 소수점 DSP - 최대 250MHz, McBSP, 32비트 EMIFA TMS320C6712D — C67x 부동 소수점 DSP - 최대 150MHz, McBSP, 16비트 EMIFA TMS320C6720 — C67x 부동 소수점 DSP - 200MHz, McASP, 16비트 EMIFA TMS320C6722B — C67x 부동 소수점 DSP - 최대 250MHz, McASP, 16비트 EMIFA TMS320C6726B — C67x 부동 소수점 DSP - 최대 266MHz, McASP, 16비트 EMIFA TMS320C6727 — C67x 부동 소수점 DSP - 최대 250MHz, McASP, 32비트 EMIFA TMS320C6727B — C67x 부동 소수점 DSP - 최대 350MHz, McASP, 32비트 EMIFA TMS320C6743 — 저전력 C674x 부동 소수점 DSP - 375MHz TMS320C6745 — 저전력 C674x 부동 소수점 DSP - 456MHz, QFP TMS320C6747 — 저전력 C674x 부동 소수점 DSP - 456MHz, PBGA TMS320DM642Q — 비디오/이미징 고정 소수점 디지털 신호 프로세서 TMS320DM6431Q — 디지털 미디어 프로세서, 최대 2400MIPS, 300MHz 클럭 속도 TMS320DM6435Q — 디지털 미디어 프로세서, 최대 4800MIPS, 600MHz 클록 속도, McASP 1개, McBSP 1개 TMS320DM6437Q — 디지털 미디어 프로세서, 최대 4800MIPS, 600MHz 클록 속도, MCASP 1개, McBSP 2개 TMS320DM6441 — DaVinci 디지털 미디어 시스템 온 칩 TMS320DM6467T — 디지털 미디어 시스템 온 칩 TMS320DM647 — 디지털 미디어 프로세서
다운로드 옵션
드라이버 또는 라이브러리

FAXLIB — FAX library (FAXLIB) for C66x, C64x+ and C55x processors

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
66AK2G12 — 고성능 멀티코어 DSP+Arm -1x Arm A15 코어, 1x C66x DSP 코어
DSP(디지털 신호 프로세서)
DM505 — 비전 분석용 SoC 15mm 패키지 SM320C6201-EP — 향상된 제품 C6201 고정 소수점 DSP SM320C6415-EP — 향상된 제품 C6415 고정 소수점 DSP SM320C6424-EP — EP(Enhanced Product) C6424 고정 소수점 DSP SM320C6455-EP — EP(Enhanced Product) C6455 고정 소수점 DSP SM320C6472-HIREL — 높은 안정성 제품 6 코어 C6472 고정 소수점 DSP SM320C6678-HIREL — 고신뢰성 제품 고성능 8코어 C6678 고정 및 부동 소수점 DSP SM320C6701 — 군사용 애플리케이션을 위한 단일 코어 C67x 부동 소수점 DSP - 최대 167MHz SM320C6701-EP — 향상된 제품 C6701 부동 소수점 DSP SM320C6711D-EP — 향상된 제품 C6711D 부동 소수점 DSP SM320C6712D-EP — 향상된 제품 C6712D DSP SM320C6713B-EP — 향상된 제품 C6713 부동 소수점 DSP SM320C6727B — 군사용 등급 C6727B 부동 소수점 DSP SM320C6727B-EP — 향상된 제품 C6727 부동 소수점 DSP SMJ320C6201B — 고정 소수점 디지털 신호 프로세서, 군사용 SMJ320C6203 — 군사용 등급 C62x 고정 소수점 DSP - 세라믹 패키지 SMJ320C6701 — 군사용 등급 C67x 부동 소수점 DSP - 세라믹 패키지 SMJ320C6701-SP — 우주 항공 등급 C6701 부동 소수점 DSP - 세라믹 패키지를 지원하는 방사능 내성 클래스 V SMV320C6727B-SP — 우주 항공 등급 C6727B 부동 소수점 DSP - 세라믹 패키지를 지원하는 방사능 내성 클래스 V TMS320C5517 — 저전력 C55x 고정 소수점 DSP - 최대 200MHz, USB, LCD 인터페이스, FFT HWA, SAR ADC TMS320C5532 — 저전력 C55x 고정 소수점 DSP - 최대 100MHz TMS320C5533 — 저전력 C55x 고정 소수점 DSP - 최대 100MHz, USB TMS320C5534 — 저전력 C55x 고정 소수점 DSP - 최대 100MHz, USB, LCD 인터페이스 TMS320C5535 — 저전력 C55x 고정 소수점 DSP - 최대 100MHz, USB, LCD 인터페이스, FFT HWA, SAR ADC TMS320C6202B — C62x 고정 소수점 DSP - 최대 300MHz, 384KB TMS320C6203B — C62x 고정 소수점 DSP - 최대 300MHz, 896KB TMS320C6204 — 고정소수점 디지털 신호 프로세서 TMS320C6205 — 고정소수점 디지털 신호 프로세서 TMS320C6211B — C62x 고정 소수점 DSP - 최대 167MHz TMS320C6414 — C64x 고정 소수점 DSP - 최대 720MHz, McBSP TMS320C6415 — C64x 고정 소수점 DSP - 최대 720MHz, McBSP, PCI TMS320C6416 — C64x 고정 소수점 DSP - 최대 720MHz, McBSP, PCI, VCP/TCP TMS320C6421Q — C64x+ 고정 소수점 DSP - 최대 600MHz, 8비트 EMIFA, 16비트 DDR2 TMS320C6424Q — C64x+ 고정 소수점 DSP - 최대 600MHz, 16/8비트 EMIFA, 32/16비트 DDR2 TMS320C6454 — C64x+ 고정 소수점 DSP - 최대 1GHz, 64비트 EMIFA, 32/16비트 DDR2, 1Gbps 이더넷 TMS320C6457 — 통신 인프라 디지털 신호 프로세서 TMS320C6701 — C67x 부동 소수점 DSP - 최대 167MHz, McBSP TMS320C6711D — C67x 부동 소수점 DSP - 최대 250MHz, McBSP, 32비트 EMIFA TMS320C6712D — C67x 부동 소수점 DSP - 최대 150MHz, McBSP, 16비트 EMIFA TMS320C6720 — C67x 부동 소수점 DSP - 200MHz, McASP, 16비트 EMIFA TMS320C6722B — C67x 부동 소수점 DSP - 최대 250MHz, McASP, 16비트 EMIFA TMS320C6726B — C67x 부동 소수점 DSP - 최대 266MHz, McASP, 16비트 EMIFA TMS320C6727 — C67x 부동 소수점 DSP - 최대 250MHz, McASP, 32비트 EMIFA TMS320C6727B — C67x 부동 소수점 DSP - 최대 350MHz, McASP, 32비트 EMIFA TMS320C6743 — 저전력 C674x 부동 소수점 DSP - 375MHz TMS320C6745 — 저전력 C674x 부동 소수점 DSP - 456MHz, QFP TMS320C6747 — 저전력 C674x 부동 소수점 DSP - 456MHz, PBGA TMS320DM642Q — 비디오/이미징 고정 소수점 디지털 신호 프로세서 TMS320DM6431Q — 디지털 미디어 프로세서, 최대 2400MIPS, 300MHz 클럭 속도 TMS320DM6435Q — 디지털 미디어 프로세서, 최대 4800MIPS, 600MHz 클록 속도, McASP 1개, McBSP 1개 TMS320DM6437Q — 디지털 미디어 프로세서, 최대 4800MIPS, 600MHz 클록 속도, MCASP 1개, McBSP 2개 TMS320DM6441 — DaVinci 디지털 미디어 시스템 온 칩 TMS320DM6467T — 디지털 미디어 시스템 온 칩 TMS320DM647 — 디지털 미디어 프로세서
다운로드 옵션
드라이버 또는 라이브러리

PRU-ICSS-INDUSTRIAL-SW — Sitara™ 프로세서용 PRU-ICSS 산업용 소프트웨어

PRU-ICSS 프로토콜은 TI Sitara 프로세서를 위한 실시간 산업용 통신을 지원합니다. PRU-ICSS 프로토콜은 TI의 통합 소프트웨어 개발 플랫폼인 Processor-SDK-RTOS를 기반으로 사용하도록 구축되었으며 최적화된 PRU-ICSS 펌웨어, ARM 프로세서에 해당하는 PRU-ICSS 드라이버 및 예제 애플리케이션을 포함하고 있습니다. PRU-ICSS 펌웨어는 PRU 코어에서 실행되며 기본 ARM 프로세서에서 시간이 중요한 링크 계층 프로세싱을 오프로드하고 TI-RTOS를 실행합니다. PRU-ICSS 드라이버는 (...)
사용 설명서: PDF
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드라이버 또는 라이브러리

VOLIB — Voice library (VoLIB) for C66x, C64x+ and C55x processors

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
66AK2G12 — 고성능 멀티코어 DSP+Arm -1x Arm A15 코어, 1x C66x DSP 코어
DSP(디지털 신호 프로세서)
DM505 — 비전 분석용 SoC 15mm 패키지 SM320C6201-EP — 향상된 제품 C6201 고정 소수점 DSP SM320C6415-EP — 향상된 제품 C6415 고정 소수점 DSP SM320C6424-EP — EP(Enhanced Product) C6424 고정 소수점 DSP SM320C6455-EP — EP(Enhanced Product) C6455 고정 소수점 DSP SM320C6472-HIREL — 높은 안정성 제품 6 코어 C6472 고정 소수점 DSP SM320C6678-HIREL — 고신뢰성 제품 고성능 8코어 C6678 고정 및 부동 소수점 DSP SM320C6701 — 군사용 애플리케이션을 위한 단일 코어 C67x 부동 소수점 DSP - 최대 167MHz SM320C6701-EP — 향상된 제품 C6701 부동 소수점 DSP SM320C6711D-EP — 향상된 제품 C6711D 부동 소수점 DSP SM320C6712D-EP — 향상된 제품 C6712D DSP SM320C6713B-EP — 향상된 제품 C6713 부동 소수점 DSP SM320C6727B — 군사용 등급 C6727B 부동 소수점 DSP SM320C6727B-EP — 향상된 제품 C6727 부동 소수점 DSP SMJ320C6201B — 고정 소수점 디지털 신호 프로세서, 군사용 SMJ320C6203 — 군사용 등급 C62x 고정 소수점 DSP - 세라믹 패키지 SMJ320C6701 — 군사용 등급 C67x 부동 소수점 DSP - 세라믹 패키지 SMJ320C6701-SP — 우주 항공 등급 C6701 부동 소수점 DSP - 세라믹 패키지를 지원하는 방사능 내성 클래스 V SMV320C6727B-SP — 우주 항공 등급 C6727B 부동 소수점 DSP - 세라믹 패키지를 지원하는 방사능 내성 클래스 V TMS320C5517 — 저전력 C55x 고정 소수점 DSP - 최대 200MHz, USB, LCD 인터페이스, FFT HWA, SAR ADC TMS320C5532 — 저전력 C55x 고정 소수점 DSP - 최대 100MHz TMS320C5533 — 저전력 C55x 고정 소수점 DSP - 최대 100MHz, USB TMS320C5534 — 저전력 C55x 고정 소수점 DSP - 최대 100MHz, USB, LCD 인터페이스 TMS320C5535 — 저전력 C55x 고정 소수점 DSP - 최대 100MHz, USB, LCD 인터페이스, FFT HWA, SAR ADC TMS320C6202B — C62x 고정 소수점 DSP - 최대 300MHz, 384KB TMS320C6203B — C62x 고정 소수점 DSP - 최대 300MHz, 896KB TMS320C6204 — 고정소수점 디지털 신호 프로세서 TMS320C6205 — 고정소수점 디지털 신호 프로세서 TMS320C6211B — C62x 고정 소수점 DSP - 최대 167MHz TMS320C6414 — C64x 고정 소수점 DSP - 최대 720MHz, McBSP TMS320C6415 — C64x 고정 소수점 DSP - 최대 720MHz, McBSP, PCI TMS320C6416 — C64x 고정 소수점 DSP - 최대 720MHz, McBSP, PCI, VCP/TCP TMS320C6421Q — C64x+ 고정 소수점 DSP - 최대 600MHz, 8비트 EMIFA, 16비트 DDR2 TMS320C6424Q — C64x+ 고정 소수점 DSP - 최대 600MHz, 16/8비트 EMIFA, 32/16비트 DDR2 TMS320C6454 — C64x+ 고정 소수점 DSP - 최대 1GHz, 64비트 EMIFA, 32/16비트 DDR2, 1Gbps 이더넷 TMS320C6457 — 통신 인프라 디지털 신호 프로세서 TMS320C6701 — C67x 부동 소수점 DSP - 최대 167MHz, McBSP TMS320C6711D — C67x 부동 소수점 DSP - 최대 250MHz, McBSP, 32비트 EMIFA TMS320C6712D — C67x 부동 소수점 DSP - 최대 150MHz, McBSP, 16비트 EMIFA TMS320C6720 — C67x 부동 소수점 DSP - 200MHz, McASP, 16비트 EMIFA TMS320C6722B — C67x 부동 소수점 DSP - 최대 250MHz, McASP, 16비트 EMIFA TMS320C6726B — C67x 부동 소수점 DSP - 최대 266MHz, McASP, 16비트 EMIFA TMS320C6727 — C67x 부동 소수점 DSP - 최대 250MHz, McASP, 32비트 EMIFA TMS320C6727B — C67x 부동 소수점 DSP - 최대 350MHz, McASP, 32비트 EMIFA TMS320C6743 — 저전력 C674x 부동 소수점 DSP - 375MHz TMS320C6745 — 저전력 C674x 부동 소수점 DSP - 456MHz, QFP TMS320C6747 — 저전력 C674x 부동 소수점 DSP - 456MHz, PBGA TMS320DM642Q — 비디오/이미징 고정 소수점 디지털 신호 프로세서 TMS320DM6431Q — 디지털 미디어 프로세서, 최대 2400MIPS, 300MHz 클럭 속도 TMS320DM6435Q — 디지털 미디어 프로세서, 최대 4800MIPS, 600MHz 클록 속도, McASP 1개, McBSP 1개 TMS320DM6437Q — 디지털 미디어 프로세서, 최대 4800MIPS, 600MHz 클록 속도, MCASP 1개, McBSP 2개 TMS320DM6441 — DaVinci 디지털 미디어 시스템 온 칩 TMS320DM6467T — 디지털 미디어 시스템 온 칩 TMS320DM647 — 디지털 미디어 프로세서
다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

CCSTUDIO — Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® desktops. It can also (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

이 설계 리소스는 이러한 범주의 제품 대부분을 지원합니다.

제품 세부 정보 페이지에서 지원을 확인하십시오.
시작 다운로드 옵션
소프트웨어 코덱

AURO-3P-3DENGINE — Auro Technologies Auro-CODEC 및 Auro-Matic 소프트웨어

Auro Technologies’ Auro-Engine includes their Auro-Codec and Auro-Matic elements for real time audio stream encoding and up mixing affording 3D audio user experiences. The Auro-Codec and Auro-Matic algorithms have been ported to select TI C6x DSPs.
발송: Auro Technologies N.V.
파트너 사이트 방문
시뮬레이션 모델

66AK2G12 BSDL Model

SPRM715.ZIP (24 KB) - BSDL Model
다운로드
시뮬레이션 모델

66AK2G12 IBIS Model

SPRM705.ZIP (1918 KB) - IBIS Model
다운로드
시뮬레이션 모델

66AK2G12 Thermal Model

SPRM716.ZIP (3 KB) - Thermal Model
다운로드
시뮬레이션 모델

KeyStone II IBIS AMI Models

SPRM743.ZIP (265889 KB) - IBIS-AMI Model
lock = 수출 승인 필요(1분)
lock 다운로드
계산 툴

CLOCKTREETOOL — Sitara, 오토모티브, 비전 분석 및 디지털 신호 프로세서용 클록 트리 툴

The Clock Tree Tool (CTT) for Sitara™ ARM®, Automotive, and Digital Signal Processors is an interactive clock tree configuration software that provides information about the clocks and modules in these TI devices. It allows the user to:
  • Visualize the device clock tree
  • Interact with clock tree (...)
사용 설명서: PDF
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레퍼런스 디자인

TIDEP-0088 — 음성 기반 애플리케이션을 위한 오디오 전처리 시스템 레퍼런스 디자인

This reference design uses multiple microphones, a beamforming algorithm, and other processes to extract clear speech and audio amidst noise and other clutter.  The rapid increase in applications that are used in noise-prone environments for voice activated digital assitants creates demand (...)
Design guide: PDF
회로도: PDF
레퍼런스 디자인

TIDEP0069 — 66AK2Gx DSP + ARM 프로세서 오디오 프로세싱 레퍼런스 디자인

This reference design is a reference platform based on the 66AK2Gx DSP + ARM processor  System-On-Chip (SoC) and companion AIC3106 Audio codec and enables a quick path to audio processing algorithm design and demonstration. This audio solution design includes real time application software (...)
Design guide: PDF
회로도: PDF
레퍼런스 디자인

TIDEP0067 — 66AK2Gx DSP + ARM 프로세서 전원 솔루션 레퍼런스 디자인

This reference design is  based on the 66AK2Gx multicore System-on-Chip (SoC) processor and companion TPS65911 power management integrated circuit (PMIC) which includes power supplies and power sequencing for the 66AK2Gx processor in a single device. This power solution design also includes (...)
Design guide: PDF
회로도: PDF
레퍼런스 디자인

TIDEP0068 — K2G 범용 EVM(GP EVM)을 위한 PCI Express PCB 설계 고려 사항 레퍼런스 디자인

PCI-Express provides for low pin-count, high reliability, and high-speed with data transfer at rates of up to 5.0 Gbps per lane, per direction, and an PCIe module is included on the TI 66AK2Gx DSP + ARM Processor system on chip (SoC).  This PCIe PCB design considerations reference design  (...)
Design guide: PDF
회로도: PDF
레퍼런스 디자인

TIDEP0070 — 66AK2Gx 기반 시스템의 메모리 안정성 향상을 위한 DDR ECC 레퍼런스 디자인

This reference design describes system considerations for Dual Data Rate (DDR) memory interface with Error Correcting Code (ECC) support in high-reliability applications, based on the 66AK2Gx Multicore DSP + ARM processor System-on-Chip (SoC).  It enables developers to implement a high (...)
Design guide: PDF
회로도: PDF
패키지 핀 CAD 기호, 풋프린트 및 3D 모델
FCCSP (ABY) 625 Ultra Librarian
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

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