CD4555B-MIL
- Expandable with multiple packages
- Standard, symmetrical output characteristics
- 100% tested for quiescent current at 20 V
- Maximum input current of 1 µA at 18 V over full package temperature range; 100 na at 18 V and 25°C
- Noise margin (full package-temperature range):
1 V at VDD = 5 V
2 V at VDD = 10 V
2.5 V at VDD = 15 V - 5-V, 10-V, and 15-V parametric ratings
- Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of 'B' Series CMOS Devices"
- Applications:
- Decoding
- Code conversion
- Demultiplexing (using Enable input as a data input)
- Memory chip-enable selection
- Function selection
CD4555B and CD4556B are dual one-of-four decoders/demultiplexers. Each decoder has two select inputs (A and B), an Enable input (E\), and four mutually exclusive outputs. On the CD4555B the outputs are high on select; on the CD4556B the outputs are low on select.
When the enable input is high, the outputs of the CD4555B remain low and the outputs of the CD4556B remain high regardless of the state of the select inputs A and B. The CD4555B and CD4556B are similar to types MC14555 and MC14556, respectively.
The CD4555B and CD4556B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastics packages (E suffix), and 16-lead small-outline packages (M, M96, and MT suffixes). The CD4555B is also supplied in 16-lead small-outline packages (NSR suffix) and 16-lead thin shrink small-outline packages (PW and PWR suffixes.)
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | CD4555B, CD4556B TYPES datasheet (Rev. D) | 2003/10/13 | |
* | SMD | CD4555B-MIL SMD 7704701EA | 2016/06/21 | |
Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
User guide | Signal Switch Data Book (Rev. A) | 2003/11/14 | ||
Application note | Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics | 2001/12/03 |
설계 및 개발
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
CDIP (J) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치