CD74HC4316
- Wide analog-input-voltage range:
VCC - VEE: 0V to 10V
- Low ON resistance:
- 45Ω (typical): VCC = 4.5V
- 35Ω (typical): VCC = 6V
- 30Ω (typical): VCC – VEE = 9V
- Fast switching and propagation delay times
- Low OFF leakage current
- Built-in break-before-make switching
- Logic-level translation to enable 5V logic to accommodate ±5 V analog signals
- Wide operating temperature range: -55°C to 125°C
- HC types:
- 2V to 10V operation
- High noise immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V
- HCT types:
- Direct LSTTL input logic compatibility, VIL= 0.8V (maximum), VIH = 2V (minimum)
- CMOS input compatibility, II ≤ 1 µA at VOL, VOH
The ’HC4316 and CD74HCT4316 contain four independent digitally controlled analog switches that use silicon-gate CMOS technology to achieve operating speeds similar to LSTTL with the low power consumption of standard CMOS integrated circuits.
In addition these devices contain logic-level translation circuits that provide for analog signal switching of voltages between ±5V via 5V logic. Each switch is turned on by a high-level voltage on its select input (S) when the common Enable (E) is Low. A High E disables all switches. The digital inputs can swing between VCC and GND; the analog inputs/outputs can swing between VCC as a positive limit and VEE as a negative limit. Voltage ranges are shown in Figure 13-1 and Figure 13-2.
기술 자료
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
PDIP (N) | 16 | Ultra Librarian |
SOIC (D) | 16 | Ultra Librarian |
SOP (NS) | 16 | Ultra Librarian |
TSSOP (PW) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.