제품 상세 정보

Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Power supply voltage - dual (V) +/-2.5, +/-5 Protocols Analog Ron (typ) (Ω) 30 CON (typ) (pF) 5 ON-state leakage current (max) (µA) 1 Bandwidth (MHz) 200 Operating temperature range (°C) -55 to 125 Features Break-before-make Input/output continuous current (max) (mA) 25 Rating Catalog Drain supply voltage (max) (V) 6 Supply voltage (max) (V) 10 Negative rail supply voltage (max) (V) 0
Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Power supply voltage - dual (V) +/-2.5, +/-5 Protocols Analog Ron (typ) (Ω) 30 CON (typ) (pF) 5 ON-state leakage current (max) (µA) 1 Bandwidth (MHz) 200 Operating temperature range (°C) -55 to 125 Features Break-before-make Input/output continuous current (max) (mA) 25 Rating Catalog Drain supply voltage (max) (V) 6 Supply voltage (max) (V) 10 Negative rail supply voltage (max) (V) 0
PDIP (N) 16 181.42 mm² 19.3 x 9.4 SOIC (D) 16 59.4 mm² 9.9 x 6 SOP (NS) 16 79.56 mm² 10.2 x 7.8 TSSOP (PW) 16 32 mm² 5 x 6.4
  • Wide analog-input-voltage range:

    VCC - VEE: 0V to 10V

  • Low ON resistance:
    • 45Ω (typical): VCC = 4.5V
    • 35Ω (typical): VCC = 6V
    • 30Ω (typical): VCC – VEE = 9V
  • Fast switching and propagation delay times
  • Low OFF leakage current
  • Built-in break-before-make switching
  • Logic-level translation to enable 5V logic to accommodate ±5 V analog signals
  • Wide operating temperature range: -55°C to 125°C
  • HC types:
    • 2V to 10V operation
    • High noise immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V
  • HCT types:
    • Direct LSTTL input logic compatibility, VIL= 0.8V (maximum), VIH = 2V (minimum)
    • CMOS input compatibility, II ≤ 1 µA at VOL, VOH
  • Wide analog-input-voltage range:

    VCC - VEE: 0V to 10V

  • Low ON resistance:
    • 45Ω (typical): VCC = 4.5V
    • 35Ω (typical): VCC = 6V
    • 30Ω (typical): VCC – VEE = 9V
  • Fast switching and propagation delay times
  • Low OFF leakage current
  • Built-in break-before-make switching
  • Logic-level translation to enable 5V logic to accommodate ±5 V analog signals
  • Wide operating temperature range: -55°C to 125°C
  • HC types:
    • 2V to 10V operation
    • High noise immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V
  • HCT types:
    • Direct LSTTL input logic compatibility, VIL= 0.8V (maximum), VIH = 2V (minimum)
    • CMOS input compatibility, II ≤ 1 µA at VOL, VOH

The ’HC4316 and CD74HCT4316 contain four independent digitally controlled analog switches that use silicon-gate CMOS technology to achieve operating speeds similar to LSTTL with the low power consumption of standard CMOS integrated circuits.

In addition these devices contain logic-level translation circuits that provide for analog signal switching of voltages between ±5V via 5V logic. Each switch is turned on by a high-level voltage on its select input (S) when the common Enable (E) is Low. A High E disables all switches. The digital inputs can swing between VCC and GND; the analog inputs/outputs can swing between VCC as a positive limit and VEE as a negative limit. Voltage ranges are shown in Figure 13-1 and Figure 13-2.

The ’HC4316 and CD74HCT4316 contain four independent digitally controlled analog switches that use silicon-gate CMOS technology to achieve operating speeds similar to LSTTL with the low power consumption of standard CMOS integrated circuits.

In addition these devices contain logic-level translation circuits that provide for analog signal switching of voltages between ±5V via 5V logic. Each switch is turned on by a high-level voltage on its select input (S) when the common Enable (E) is Low. A High E disables all switches. The digital inputs can swing between VCC and GND; the analog inputs/outputs can swing between VCC as a positive limit and VEE as a negative limit. Voltage ranges are shown in Figure 13-1 and Figure 13-2.

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관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치와 유사한 기능
TMUX6111 활성 5pA, ±16.5V, 1:1(SPST), 4채널 정밀 아날로그 스위치(활성 로우) Lower leakage current

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
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16개 모두 보기
유형 직함 날짜
* Data sheet CDx4HCx4316 High-Speed CMOS Logic Quad Analog Switch with Level Translation datasheet (Rev. E) PDF | HTML 2024/07/16
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 2022/06/02
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 2021/12/01
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
User guide Signal Switch Data Book (Rev. A) 2003/11/14
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997/06/01
Application note Designing With Logic (Rev. C) 1997/06/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Application note SN54/74HCT CMOS Logic Family Applications and Restrictions 1996/05/01
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 1996/04/01

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

인터페이스 어댑터

LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

사용 설명서: PDF
TI.com에서 구매 불가
패키지 CAD 기호, 풋프린트 및 3D 모델
PDIP (N) 16 Ultra Librarian
SOIC (D) 16 Ultra Librarian
SOP (NS) 16 Ultra Librarian
TSSOP (PW) 16 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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