EMB1499Q
- 60-V Maximum Stack Operating Voltage
- Bidirectional Balancing Current
- Fully Synchronous Operation
- Active Clamp Signal
- 250-kHz Switching Frequency
- Fault Detection Includes Two Separate UVLO Cells
(One for Each External Supply), Primary and
Secondary Side Current Limit, OVP/UVP Sense on
Cell Being Charged, Thermal Shutdown, and
Watchdog Timer - Balancing Current User-selectable Through
External Voltage - EMB1499Q is an Automotive Grade Product
that is AEC-Q100 Grade 1 Qualified
(–40°C to +125°C Operating Junction Temperature)
The EMB1499Q bidirectional current dc/dc controller IC works in conjunction with the EMB1428 switch matrix gate driver IC to support TI’s switch matrix based active cell balancing scheme for a battery management system. The EMB1499Q provides three PWM MOSFET gate signals to a bidirectional forward converter so that its output current, either positive or negative, is regulated around a user-defined magnitude. This inductor current is channeled by the EMB1428 through the switch matrix to the cell that needs to be charged or discharged. In a typical scheme, the EMB1499Q-based forward converter exchanges energy between a single cell and the battery stack to which it belongs, with a maximum stack voltage of up to 60 V. The switching frequency is fixed at 250 kHz. The EMB1499Q senses cell voltage, inductor current and stack current and provides protection from abnormal conditions during balancing.
The EMB1499Q also provides an active clamp timing signal to control an external FET driver for the primary-side active clamp FET. The EMB1499Q is enabled and disabled by the EMB1428. Fault conditions detected by the EMB1499Q are communicated to the EMB1428 through the DONE and FAULT pins.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | EMB1499Q Bidirectional Current DC-DC Controller datasheet (Rev. B) | 2013/09/23 | |
User guide | Active Chipset Reference Design Guide (Rev. A) | 2017/09/05 | ||
User guide | EM1402 Evaluation Module | PDF | HTML | 2017/02/01 | |
Technical article | How batteries may make travel on Mars easier | PDF | HTML | 2016/01/27 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
HTSSOP (PWP) | 28 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.