LM48861
- Ground Referenced Outputs – Eliminates Output Coupling Capacitors
- Common-Mode Sensing
- Advanced Click-and-Pop Suppression
- Low Supply Current
- Minimum External Components
- Micro-Power Shutdown
- ESD Protection of 8kV HBM Contact
- Available in Space-Saving 12-Bump DSBGA Package
Key Specifications
- Output Power/Channel at
VDD = 1.5V,THD+N = 1%- RL = 16Ω 12mW (typ)
- RL = 32Ω 13mW (typ)
- Output Power/Channel at
VDD = 1.8V, THD+N = 1%- RL = 16Ω 24mW (typ)
- RL = 32Ω 22mW (typ)
- Quiescent Power Supply Current at 1.5V
2mA (typ) - PSRR at 217Hz 83dB (typ)
- Shutdown Current 0.01μA (typ)
PowerWise is a trademark of Texas Instruments. All trademarks are the property of their respective owners.
The LM48861 is a single supply, ground-referenced stereo headphone amplifier. Part of TI's PowerWise product family, the LM48861 consumes only 3mW of power, yet still provides great audio performance. The ground-referenced architecture eliminates the larger DC blocking capacitors required by traditional headphone amplifier's saving board space and reducing cost.
The LM48861 features common-mode sensing that corrects for any differences between the amplifier ground and the potential at the headphone return terminal, minimizing noise created by any ground mismatches.
The LM48861 delivers 22mW/channel into a 32Ω load with <1% THD+N with a 1.8V supply. Power supply requirements allow operation from 1.2V to 2.8V. High power supply rejection ratio (PSRR), 83dB at 217Hz, allows the device to operate in noisy environments without additional power supply conditioning. A low power shutdown mode reduces supply current consumption to 0.01µA.
Superior click and pop suppression eliminates audible transients on power-up/down and during shutdown. The LM48861 is available in an ultra-small 12-bump, 0.4mm pitch, DSBGA package (1.215mm x 1.615mm).
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | LM48861 Ground-Referenced, Ultra Low Noise, Stereo Headphone Amplifier datasheet (Rev. B) | 2013/05/03 |
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
DSBGA (YFQ) | 12 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치