LMH6624-MIL
- VS = ±6 V, TA = 25°C, AV = 20 (Typical Values Unless Specified)
- Gain Bandwidth 1.5 GHz
- Input Voltage Noise 0.92 nV/√Hz
- Input Offset Voltage (Limit Over Temp) 700 µV
- Slew Rate 350 V/µs
- Slew Rate (AV = 10) 400 V/µs
- HD2 at f = 10 MHz, RL = 100 Ω –63 dBc
- HD3 at f = 10 MHz, RL = 100 Ω –80 dBc
- Supply Voltage Range 5 V to 12 V
- Improved Replacement for the CLC425
- Stable for Closed Loop |AV| ≥ 10
The LMH6624-MIL device offers wide bandwidth (1.5 GHz) with very-low-input noise (0.92 nV/√Hz, 2.3 pA/√Hz) and ultra-low DC errors (100-µV VOS, ±0.1-µV/°C drift) providing very precise operational amplifiers with wide dynamic range. This enables the user to achieve closed-loop gains of greater than 10, in both inverting and non-inverting configurations.
The LMH6624-MIL traditional voltage feedback topology provides the following benefits: balanced inputs, low-offset voltage and offset current, very-low-offset drift, 81-dB open loop gain, 95-dB common-mode rejection ratio, and 88-dB power supply rejection ratio.
The LMH6624-MIL device operates from 5 V to 12 V and is offered in SOT-23-5 and SOIC-8 packages.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | LMH6624-MIL Single Ultra-Low-Noise Wideband Operational Amplifier datasheet | PDF | HTML | 2017/06/23 |
| Application note | Transimpedance Amplifiers (TIA): Choosing the Best Amplifier for the job (Rev. A) | 2017/05/16 | ||
| E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017/03/28 | ||
| Application note | AN-1604 Decompensated Operational Amplifiers (Rev. B) | 2013/05/01 | ||
| User guide | AN-2095 LMH730316 SOT23-5 / SOT23-6 Hi Performance Amplifier Eval Board (Rev. B) | 2013/05/01 | ||
| Application note | OA-14 Improving Amplifier Noise for High 3rd Intercept Amplifiers (Rev. F) | 2013/05/01 | ||
| Application note | OA-15 Frequent Faux Pas in Applying Wideband Current Feedback Amplifiers (Rev. C) | 2013/04/17 | ||
| More literature | Die D/S LMH6624 MDC Ultra Low Noise Wideband Op Amp | 2012/09/28 |
설계 및 개발
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| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| DIESALE (Y) | — |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치