RES11A-Q1
- AEC-Q200 Qualified for automotive applications:
- Temperature: –40°C to +125°C
- High ratio matching precision: ±0.05 % (maximum)
-
Low drift: ±2 ppm/°C TCR (maximum)
The RES11A-Q1 is a matched pair of resistive dividers, implemented in thin-film SiCr with Texas Instruments’ modern, high-performance, analog CMOS process. The device has a nominal input resistance of 1 kΩ, for low thermal and current noise, and is available in several nominal ratios to meet a wide array of system needs. Use the RES11A-Q1 in an inverse gain configuration by simply rotating the device placement by 180°. This feature supports layout reuse and increases flexibility for applications such as discrete instrumentation or difference amplifier implementations.
The RES11A-Q1 series features high ratio-matching precision, with the measured ratio of each divider within ±120 ppm (typical) of the nominal. This precision is maintained over the temperature range, with a maximum ratio drift of only ±2 ppm/°C. Additionally, the biased long-term stability of the device has been proven through thorough characterization.
The RES11A-Q1 is automotive qualified under AEC-Q200 temperature grade 1. The temperature range is specified from –40°C to +125°C. The device is offered in an 8‑pin, SOT‑23-THIN package, with a body size of 2.9 mm × 1.6 mm (body size is a nominal value and does not include pins).
기술 자료
설계 및 개발
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SMALL-AMP-DIP-EVM — 소형 패키지를 갖춘 연산 증폭기용 평가 모듈
SMALL-AMP-DIP-EVM은 여러 업계 표준 소형 패키지와 빠르고 쉬운 인터페이스를 통해 소형 패키지 연산 증폭기 프로토타입 제작 속도를 높여줍니다. SMALL-AMP-DIP-EVM은 DPW-5(X2SON), DSG-8(WSON), DCN-8(SOT), DDF-8(SOT), RUG-10(X2QFN), RUC-14(X2QFN), RGY-14(VQFN) 및 RTE-16(WQFN)을 포함한 8가지 소형 패키지 옵션을 지원합니다.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
SOT-23-THN (DDF) | 8 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치