SN54LS145
- Full Decoding of Input Logic
- SN54145, SN74145, and SN74LS145 Have
80-mS Sink-current Capability - All Outputs Are Off for Invalid
BCD Input Conditions - Low Power Dissipation of 'LS145 . . .
35 mW Typical
These monolithic BCD-to-decimal decoder/drivers consist of eight inverters and ten four-input NAND gates. The inverters are connected in pairs to make BCD input date available for decoding by the NAND gates. Full decoding of valid BCD input logic ensures that all outputs remain off for all invalid binary input conditions. These decoders feature high-performance,
n-p-n output transistors designed for use as indicator/relay drivers or as open-collector logic-circuit drivers. Each of the high-breakdown output transistors (15 volts) of the SN54145, SN74145, or SN74LS145 will sink up to 80 milliamperes of current. Each input is one Series 54/74 or Series 54LS/74LS standard load, respectively. Inputs and outputs are entirely compatible for use with TTL or DTL logic curciuts, and the outputs are compatible for interfacing with most MOS integrated circuits. Power dissipation is typically 215 milliwatts for the '145 and 35 milliwatts for the 'LS145.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | BCD to Decimal Decoders/Drivers datasheet (Rev. A) | 1974/03/01 | |
* | SMD | SN54LS145 SMD 85084012A | 2016/06/21 | |
Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
Application note | Designing with the SN54/74LS123 (Rev. A) | 1997/03/01 | ||
Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996/10/01 | ||
Application note | Live Insertion | 1996/10/01 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
CDIP (J) | 16 | Ultra Librarian |
CFP (W) | 16 | Ultra Librarian |
LCCC (FK) | 20 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치