제품 상세 정보

Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 2.5, 3.3 Protocols Analog, I2C, I2S, JTAG, RGMII, SPI, TDM, UART Ron (typ) (Ω) 5 ON-state leakage current (max) (µA) 1 Bandwidth (MHz) 200 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 128 Rating Catalog Drain supply voltage (max) (V) 3.6 Supply voltage (max) (V) 3.6
Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 2.5, 3.3 Protocols Analog, I2C, I2S, JTAG, RGMII, SPI, TDM, UART Ron (typ) (Ω) 5 ON-state leakage current (max) (µA) 1 Bandwidth (MHz) 200 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 128 Rating Catalog Drain supply voltage (max) (V) 3.6 Supply voltage (max) (V) 3.6
SOIC (D) 14 51.9 mm² 8.65 x 6 SSOP (DBQ) 16 29.4 mm² 4.9 x 6 TSSOP (PW) 14 32 mm² 5 x 6.4 TVSOP (DGV) 14 23.04 mm² 3.6 x 6.4 VQFN (RGY) 14 12.25 mm² 3.5 x 3.5
  • Standard ’125-Type Pinout
  • 5- Switch Connection Between Two Ports
  • Rail-to-Rail Switching on Data I/O Ports
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

  • Standard ’125-Type Pinout
  • 5- Switch Connection Between Two Ports
  • Rail-to-Rail Switching on Data I/O Ports
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

The SN74CBTLV3125 quadruple FET bus switch features independent line switches. Each switch is disabled when the associated output-enable (OE\) input is high.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74CBTLV3125 quadruple FET bus switch features independent line switches. Each switch is disabled when the associated output-enable (OE\) input is high.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치보다 업그레이드된 기능을 지원하는 드롭인 대체품
TMUX1511 활성 전원 차단 보호 및 1.8V 입력 로직을 지원하는 5V, 1:1(SPST), 4채널 아날로그 스위치 Upgraded 3-GHz bandwidth, 2-Ω RON, and 1.8-V logic support

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
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18개 모두 보기
유형 직함 날짜
* Data sheet SN74CBTLV3125 datasheet (Rev. J) 2003/10/10
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 2022/06/02
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 2021/12/01
Application brief Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) PDF | HTML 2021/01/06
Selection guide Little Logic Guide 2018 (Rev. G) 2018/07/06
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note How to Select Little Logic (Rev. A) 2016/07/26
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
More literature Digital Bus Switch Selection Guide (Rev. A) 2004/11/10
Product overview Design Summary for WCSP Little Logic (Rev. B) 2004/11/04
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
User guide Signal Switch Data Book (Rev. A) 2003/11/14
Application note Bus FET Switch Solutions for Live Insertion Applications 2003/02/07
Application note Texas Instruments Little Logic Application Report 2002/11/01
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
More literature Standard Linear & Logic for PCs, Servers & Motherboards 2002/06/13
User guide CBT (5-V) And CBTLV (3.3-V) Bus Switches Data Book (Rev. B) 1998/12/01

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

인터페이스 어댑터

LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

사용 설명서: PDF
TI.com에서 구매 불가
시뮬레이션 모델

HSPICE Model for SN74CBTLV3125

SCDM132.ZIP (111 KB) - HSpice Model
시뮬레이션 모델

SN74CBTLV3125 IBIS Model

SCDM027.ZIP (25 KB) - IBIS Model
패키지 CAD 기호, 풋프린트 및 3D 모델
SOIC (D) 14 Ultra Librarian
SSOP (DBQ) 16 Ultra Librarian
TSSOP (PW) 14 Ultra Librarian
TVSOP (DGV) 14 Ultra Librarian
VQFN (RGY) 14 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

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