SN74LVC2G66-Q1

Name: SN74LVC2G66-Q1
Brand: TI
SKU: SN74LVC2G66-Q1
Price: 0.135 USD

활성

차량용 5V, 1:1(SPST), 2채널 아날로그 스위치

지금 주문

데이터 시트

document-pdfAcrobat SN74LVC2G66-Q1 Automotive Dual Bilateral Analog Switch datasheet (Rev. B) (영어) PDF | HTML

SN74LVC2G66-Q1

활성

데이터 시트

지금 주문

제품 상세 정보

Configuration

1:1 SPST

Number of channels

2

Power supply voltage - single (V)

1.8, 2.5, 3.3, 5

Protocols

Analog

Ron (typ) (Ω)

7.5

CON (typ) (pF)

14

ON-state leakage current (max) (µA)

2

Supply current (typ) (µA)

1

Bandwidth (MHz)

300

Operating temperature range (°C)

-40 to 125

Input/output continuous current (max) (mA)

50

Rating

Automotive

Drain supply voltage (max) (V)

5.5

Supply voltage (max) (V)

5.5

Configuration

1:1 SPST

Number of channels

2

Power supply voltage - single (V)

1.8, 2.5, 3.3, 5

Protocols

Analog

Ron (typ) (Ω)

7.5

CON (typ) (pF)

14

ON-state leakage current (max) (µA)

2

Supply current (typ) (µA)

1

Bandwidth (MHz)

300

Operating temperature range (°C)

-40 to 125

Input/output continuous current (max) (mA)

50

Rating

Automotive

Drain supply voltage (max) (V)

5.5

Supply voltage (max) (V)

5.5

VSSOP (DCU)

8

6.2 mm² 2 x 3.1

Functional safety-capable
- Documentation available to aid functional safety system design
Qualified for automotive applications
AEC-Q100 qualified with the following results:
- Device temperature grade 1: –40°C to +125°C ambient operating temperature range
- Device HBM ESD classification level H2
- Device CDM ESD classification level C3B
1.65 V to 5.5 V V_CC operation
Inputs accept voltages to 5.5 V
High on-off output voltage ratio
High degree of linearity
High speed, typically 0.5 ns (V_CC = 3 V, C_L = 50 pF)
Rail-to-rail input output
Low on-state resistance, typically ≉6 Ω (V_CC = 4.5 V)

Functional safety-capable
- Documentation available to aid functional safety system design
Qualified for automotive applications
AEC-Q100 qualified with the following results:
- Device temperature grade 1: –40°C to +125°C ambient operating temperature range
- Device HBM ESD classification level H2
- Device CDM ESD classification level C3B
1.65 V to 5.5 V V_CC operation
Inputs accept voltages to 5.5 V
High on-off output voltage ratio
High degree of linearity
High speed, typically 0.5 ns (V_CC = 3 V, C_L = 50 pF)
Rail-to-rail input output
Low on-state resistance, typically ≉6 Ω (V_CC = 4.5 V)

The design of this dual bilateral analog switch is for 1.65 V to 5.5 V V_CC operation. The SN74LVC2G66-Q1 can handle both analog and digital signals. The device permits signals with amplitudes of up to 5.5 V (peak) to be transmitted in either direction. Each switch section has its own enable-input control (C). A high-level voltage applied to C turns on the associated switch section.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

The design of this dual bilateral analog switch is for 1.65 V to 5.5 V V_CC operation. The SN74LVC2G66-Q1 can handle both analog and digital signals. The device permits signals with amplitudes of up to 5.5 V (peak) to be transmitted in either direction. Each switch section has its own enable-input control (C). A high-level voltage applied to C turns on the associated switch section.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

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기타 아날로그 스위치 및 멀티플렉서 찾기

다운로드 스크립트와 함께 비디오 보기 동영상

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31개 모두 보기

	유형	직함		날짜
*	Data sheet	SN74LVC2G66-Q1 Automotive Dual Bilateral Analog Switch datasheet (Rev. B)	PDF \| HTML	2021/10/27
	Application note	Selecting the Correct Texas Instruments Signal Switch (Rev. E)	PDF \| HTML	2022/06/02
	Application note	Multiplexers and Signal Switches Glossary (Rev. B)	PDF \| HTML	2021/12/01
	Functional safety information	SN74LVC2G66-Q1 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FM	PDF \| HTML	2021/10/15
	Application note	Implications of Slow or Floating CMOS Inputs (Rev. E)		2021/07/26
	Selection guide	Little Logic Guide 2018 (Rev. G)		2018/07/06
	Selection guide	Logic Guide (Rev. AB)		2017/06/12
	Application note	How to Select Little Logic (Rev. A)		2016/07/26
	Application note	Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)		2015/12/02
	More literature	Automotive Logic Devices Brochure		2014/08/27
	User guide	LOGIC Pocket Data Book (Rev. B)		2007/01/16
	Product overview	Design Summary for WCSP Little Logic (Rev. B)		2004/11/04
	Application note	Semiconductor Packing Material Electrostatic Discharge (ESD) Protection		2004/07/08
	Application note	Selecting the Right Level Translation Solution (Rev. A)		2004/06/22
	User guide	Signal Switch Data Book (Rev. A)		2003/11/14
	Application note	Use of the CMOS Unbuffered Inverter in Oscillator Circuits		2003/11/06
	User guide	LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B)		2002/12/18
	Application note	Texas Instruments Little Logic Application Report		2002/11/01
	Application note	TI IBIS File Creation, Validation, and Distribution Processes		2002/08/29
	More literature	Standard Linear & Logic for PCs, Servers & Motherboards		2002/06/13
	Application note	16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)		2002/05/22
	Application note	Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices		2002/05/10
	More literature	STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS		2002/03/27
	Application note	Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices		1997/12/01
	Application note	Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)		1997/08/01
	Application note	CMOS Power Consumption and CPD Calculation (Rev. B)		1997/06/01
	Application note	LVC Characterization Information		1996/12/01
	Application note	Input and Output Characteristics of Digital Integrated Circuits		1996/10/01
	Application note	Live Insertion		1996/10/01
	Design guide	Low-Voltage Logic (LVC) Designer's Guide		1996/09/01
	Application note	Understanding Advanced Bus-Interface Products Design Guide		1996/05/01

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DIP-ADAPTER-EVM — DIP 어댑터 평가 모듈

소형 표면 실장 IC(집적 회로)와 쉽고 빠르며 경제적인 방식으로 인터페이싱하는 방법을 제공하는 DIP 어댑터 평가 모듈(DIP-ADAPTER-EVM)로 연산 증폭기 프로토타이핑 및 테스트 속도를 높이세요. 제품에 포함된 Samtec 터미널 스트립을 사용하여 지원되는 연산 증폭기를 연결하거나 기존 회로에 직접 연결할 수 있습니다.

DIP 어댑터 EVM 키트는 다음을 포함해 가장 널리 사용되는 6개의 업계 표준 패키지를 지원합니다.

D 및 U(SOIC-8)
PW(TSSOP-8)
DGK(MSOP-8, VSSOP-8)
(...)

사용 설명서: PDF

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인터페이스 어댑터

LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.

사용 설명서: PDF