TMUX1072
- Supply range 2.3 V to 5.5 V
- Powered off protection: I/O pins Hi-Z when
VCC = 0 V - 6-V Overvoltage and overtemperature detection with fault indicator pin
- 18-V Overvoltage protection (OVP) on common pins
- Support signals beyond VCC up to 5.5 V
- Low RON of 6 Ω
- BW of 1.2 GHz typical
- CON of 4.5 pF typical
- Low power disable mode
- 1.8-V Compatible logic inputs
- ESD protection exceeds JESD22
- 2000-V Human body model (HBM)
- Small 2.00 mm x 1.70 mm QFN package available
The TMUX1072 is a high-speed, 2-channel, 2:1, analog switch with integrated overvoltage detection and powered off protection. The device is bidirectional and can be used as a 2:1 or 1:2 switch while supporting signals beyond VCC up to 5.5 V.
The protection on the I/O pins of the TMUX1072 tolerates a maximum of 18 V with automatic shutoff circuitry to prevent damage to system components behind the switch. This protection is used for power sequencing. Some boards in the system may be powered up before others are ready to receive signals. The device detects overvoltage and overtemperature events, and provides an open drain output signal through the FLT pin.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | TMUX1072 2-Channel 2:1 Analog Multiplexer with Overvoltage Detection and Protection datasheet (Rev. C) | PDF | HTML | 2019/08/20 |
| Application brief | 1.8-V Logic for Multiplexers and Signal Switches (Rev. C) | PDF | HTML | 2022/07/26 | |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022/06/02 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021/12/01 | |
| Application brief | Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) | PDF | HTML | 2021/01/06 | |
| Technical article | Roll with the design punches and overcome power-sequencing challenges | PDF | HTML | 2019/07/29 | |
| Application brief | Improve Stability Issues with Low Con Multiplexers (Rev. A) | 2018/12/10 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
TMUX1072 TINA-TI Reference Design (Rev. A)
TIDA-010040 — 경보 톤 생성기 레퍼런스 설계
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| UQFN (RUT) | 12 | Ultra Librarian |
| VSSOP (DGS) | 10 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.