TMUX1109
- Single supply range: 1.08V to 5.5V
- Dual supply range: ±2.75V
- Low leakage current: 3pA
- Low charge injection: 1pC
- Low on-resistance: 1.8Ω
- -40°C to +125°C operating temperature
- 1.8V logic compatible
- Fail-safe logic
- Rail to rail operation
- Bidirectional signal path
- Break-before-make switching
- ESD protection HBM: 2000V
The TMUX1109 is a precision complementary metal-oxide semiconductor (CMOS) multiplexer (MUX). The TMUX1109 offers differential 4:1 or dual 4:1 single-ended channels. Wide operating supply of 1.08V to 5.5V allows for use in a broad array of applications from medical equipment to industrial systems. The device supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from GND to VDD. All logic inputs have 1.8V logic compatible thresholds, allowing for both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
The TMUX1109 is part of the precision switches and multiplexers family of devices. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications. A low supply current of 8nA and small package options enable use in portable applications.
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기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TMUX1109 5V, ±2.5V, Low-Leakage-Current, 4:1, 2-Channel Precision Multiplexer datasheet (Rev. A) | PDF | HTML | 2024/02/07 |
Circuit design | True differential, 4 × 2 MUX, analog front end, simultaneous-sampling ADC circui (Rev. B) | PDF | HTML | 2024/09/20 | |
Product overview | How to Multiplex Multiple Loads to Scale Voltage and Current Measurement Ranges | PDF | HTML | 2022/09/15 | |
Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022/06/02 | |
Application note | Guarding in Multiplexer Applications | PDF | HTML | 2022/05/13 | |
Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021/12/01 | |
Application note | Choosing the Right Multiplexer for MCU Expansion | PDF | HTML | 2020/11/19 |
설계 및 개발
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LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
LEADLESS-ADAPTER1 — TI의 6, 8, 10, 12, 14, 16 및 20핀 리드 없는 패키지의 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
TSSOP (PW) | 16 | Ultra Librarian |
UQFN (RSV) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
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