TMUX1208
- Rail to Rail Operation
- Bidirectional Signal Path
- Low On-Resistance: 5 Ω
- Wide Supply Range: 1.08 V to 5.5 V
- -40°C to +125°C Operating Temperature
- 1.8 V Logic Compatible
- Fail-Safe Logic
- Low Supply Current: 10 nA
- Transition Time: 14 ns
- Break-Before-Make Switching
- ESD Protection HBM: 2000 V
- Industry-Standard TSSOP and QFN Packages
The TMUX1208 and TMUX1209 are general purpose complementary metal-oxide semiconductor (CMOS) multiplexers (MUX). The TMUX1208 offers 8:1 single-ended channels, while the TMUX1209 offers differential 4:1 or dual 4:1 single-ended channels. Wide operating supply of 1.08 V to 5.5 V allows for use in a broad array of applications from personal electronics to building automation applications. The device supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from GND to VDD.
All logic inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TMUX1208 5-V Bidirectional 8:1, 1-Channel Multiplexer TMUX1209 5-V Bidirectional 4:1, 2-Channel Multiplexer datasheet (Rev. C) | PDF | HTML | 2018/12/13 |
Application brief | 1.8-V Logic for Multiplexers and Signal Switches (Rev. C) | PDF | HTML | 2022/07/26 | |
Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022/06/02 | |
Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021/12/01 | |
Application note | I2C Dynamic Addressing | 2019/04/25 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
LEADLESS-ADAPTER1 — TI의 6, 8, 10, 12, 14, 16 및 20핀 리드 없는 패키지의 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
TSSOP (PW) | 16 | Ultra Librarian |
UQFN (RSV) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.