TMUX7412F
- Wide supply voltage range:
- Single supply: 8 V to 44 V
- Dual supply: ±5 V to ±22 V
- Integrated fault protection:
- Overvoltage protection, source to supplies or source to drain: ±85 V
- Overvoltage protection: ±60 V
- Powered-off protection: ±60 V
- Interrupt flags to indicate fault status
- Output open circuited during fault
- Latch-up immunity by device construction
- Human Body Model (HBM) ESD rating: 6-kV
- Low on-resistance: 8.3 Ω typical
- Flat on-resistance: 10 mΩ typical
- Logic capable: 1.8-V
- Fail-safe logic: up to 44 V independent of supply
- Industry-standard TSSOP and smaller WQFN packages
The TMUX7411F, TMUX7412F, and TMUX7413F are complementary metal-oxide semiconductor (CMOS) analog switches in 1:1 (SPST), 4-channel configurations. The devices work well with dual supplies (±5 V to ±22 V), a single supply (8 V to 44 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). The overvoltage protection is available in powered and powered-off conditions, making the TMUX741xF devices suitable for applications where power supply sequencing cannot be precisely controlled.
The devices block fault voltages up to +60 V or −60 V relative to ground in powered and powered-off conditions. When no power supplies are present, the switch channels remain in the OFF state regardless of the switch input conditions, and any control signal present on the logic pins is ignored. If the signal path input voltage on any Sx pin exceeds the supply voltage (VDD or VSS) by a threshold voltage (VT), the channel turns OFF and the Sx pin becomes high impedance. The drain pin (Dx) of a selected channel under a fault condition is floating. The TMUX741xF devices provide an active-low interrupt flag (FF) to indicate if any of the source inputs are experiencing a fault condition to help system diagnostics.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | TMUX741xF ±60 V Fault-Protected, 1:1 (SPST), 4-Channel Switches With Latch-Up Immunity and 1.8-V Logic datasheet (Rev. B) | PDF | HTML | 2022/11/01 |
| Application brief | How to Protect a Multi-Channel RTD System using Fault Protected Multiplexers (Rev. A) | PDF | HTML | 2024/08/08 | |
| Application note | Protecting and Maintaining Signal Integrity in PLC Systems (Rev. A) | PDF | HTML | 2024/07/22 | |
| Application brief | Replace Discrete Protection and Optimize Your PLC System Protection | PDF | HTML | 2022/01/03 | |
| Application note | Protection Against Overvoltage Events, Miswiring, and Common Mode Voltages | PDF | HTML | 2021/10/07 | |
| Application note | Improving Analog Input Modules Reliability Using Fault Protected Multiplexers | PDF | HTML | 2021/09/28 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
TMUX741-746EVM — PW 및 RRP 패키지용 TMUX741xF 및 TMUX7462F 평가 모듈
TMUX741-746EVM은 TSSOP(PW) 및 WQFN(RRP) 패키지에서 TMUX741xF 및 TMUX746xF 장치 제품군의 평가를 지원합니다. 이 평가 모듈(EVM)은 DC 매개 변수 평가를 위한 TMUX741xF 및 TMUX746xF 장치 제품군의 빠른 프로토타이핑 및 테스트에 사용할 수 있습니다.
LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
LEADLESS-ADAPTER1 — TI의 6, 8, 10, 12, 14, 16 및 20핀 리드 없는 패키지의 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| WQFN (RRP) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.