TPA3138D2
- Wide Supply Range 3.5-V to 14.4-V
- 2 × 10 W into 6-Ω, 1% THD+N, 12-V Supply
- 1 x 18.5 W into 4-Ω, 10% THD+N, 12-V Supply
- THD+N : 0.04% at 1 W, 1 kHz input, 6-Ω
- Longer Battery Life for Portable Applications:
- 20-mA (12-V) Idle Current in 1SPW Mode
- >90% Class-D Efficiency
- Reduced Solution Size and Cost:
- Inductor-Free Operation
- EN55013 and EN55022 EMC Compliant When No Inductors are Used
- No External Heatsink Required
- Flexible Audio Solution:
- Single-ended or Differential Analog Inputs
- Selectable Gain: 20 dB and 26 dB
- Pop and Click-Free Startup
- Integrated Protections and Auto Recovery:
- Pin-to-pin, Pin-to-Ground, and Pin-to-Power Short Circuit Protection
- Thermal Protection, Undervoltage Protection, and Overvoltage Protection
- Power Limiter and DC Speaker Protection
- Pin-to-Pin Compatible with TPA3110D2, TPA3136D2 and TPA3136AD2
The TPA3138D2 is a 10-W/ch, high-efficiency, low-idle-current Class-D stereo audio amplifier. It can drive stereo speakers with a load as low as 3.2-Ω. In the 1SPW mode, it consumes a low idle current of only 21-mA (12-V) and can operate down to 3.5-V, allowing for longer audio play and improved thermal performance in bluetooth speakers, battery-powered appliances and other power-sensitive applications.
Advanced EMI Suppression with Spread Spectrum Control enables the use of inexpensive ferrite bead filters while meeting EMC requirements for system cost reduction.
To further simplify the design, the TPA3138D2 integrates essential protection features including undervoltage, overvoltage, power limit, short circuit, overtemperature, as well as DC speaker protection. All of these protections come with automatic recovery.
Customers can leverage every TPA3138D2 feature in existing designs as it is fully pin-to-pin compatible to TI’s TPA3110D2, TPA3136D2 and TPA3136AD2.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | TPA3138D2 10-W, 3.5-V to 14.4-V, Inductor Free, Stereo Class-D Speaker Amplifier datasheet (Rev. A) | PDF | HTML | 2018/06/08 |
| Application note | TPA3136D2 Design Considerations for EMC (Rev. A) | 2018/07/27 | ||
| Application brief | TPA3138 Transition Guide – from TPA3110, TPA3113 | 2018/07/06 | ||
| EVM User's guide | TPA3138D2 Evaluation Module User's Guide | 2017/12/05 |
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| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| HTSSOP (PWP) | 28 | Ultra Librarian |
주문 및 품질
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- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
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