TPA711
- Fully Specified for 3.3-V and 5-V Operation
- Wide Power Supply Compatibility 2.5 V – 5.5 V
- Output Power
- 700 mW at VDD = 5 V, BTL, RL = 8
- 85 mW at VDD = 5 V, SE, RL = 32
- 250 mW at VDD = 3.3 V, BTL, RL = 8
- 37 mW at VDD = 3.3 V, SE, RL = 32
- Shutdown Control
- IDD = 7 uA at 3.3 V
- IDD = 50 uA at 5 V
- BTL to SE Mode Control
- Integrated Depop Circuitry
- Thermal and Short-Circuit Protection
- Surface-Mount Packaging
- SOIC
- PowerPAD™ MSOP
PowerPAD is a trademark of Texas Instruments.
The TPA711 is a bridge-tied load (BTL) or single-ended (SE) audio power amplifier developed especially for low-voltage applications where internal speakers and external earphone operation are required. Operating with a 3.3-V supply, the TPA711 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. A unique feature of the TPA711 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode for power-sensitive applications with special depop circuitry to eliminate speaker noise when exiting shutdown mode. The TPA711 is available in an 8-pin SOIC and the surface-mount PowerPAD MSOP package, which reduces board space by 50% and height by 40%.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | 700-mW Mono Low-Voltage Audio Power Amplifier datasheet (Rev. D) | 2002/10/18 | |
Application note | Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) | 2019/08/26 | ||
Application note | PowerPAD™ Thermally Enhanced Package (Rev. H) | 2018/07/06 | ||
EVM User's guide | TPA711MSOPEVM - User Guide (Rev. B) | 2001/04/17 |
설계 및 개발
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TPA711MSOPEVM — TPA711MSOP EVM(평가 모듈)
A 700-mW mono amplifier that will operate in both bridge-tied load (BTL) and single-ended (SE) modes. This makes the TPA711 ideal for applications that require a mono earphone and speaker. In addition, integrated DEPOP circuitry eliminates speaker noise when the amplifier turns on, off, or exits (...)
PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®
TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
HVSSOP (DGN) | 8 | Ultra Librarian |
SOIC (D) | 8 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.