홈 오디오 오디오 증폭기 스피커 증폭기
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TPA751

활성

BGA 패키지의 700mW, 모노, 아날로그 입력 클래스 AB 오디오 증폭기

지금 주문
데이터 시트

TPA751

활성
데이터 시트 지금 주문

제품 상세 정보

Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Rating Catalog Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 Load (min) (Ω) 8 Output power (W) 0.7 THD + N at 1 kHz (%) 0.5 Iq (typ) (mA) 1.45 Control interface Hardware Closed/open loop Closed Analog supply (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 PSRR (dB) 85 Operating temperature range (°C) -40 to 85
Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Rating Catalog Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 Load (min) (Ω) 8 Output power (W) 0.7 THD + N at 1 kHz (%) 0.5 Iq (typ) (mA) 1.45 Control interface Hardware Closed/open loop Closed Analog supply (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 PSRR (dB) 85 Operating temperature range (°C) -40 to 85
HVSSOP (DGN) 8 14.7 mm² 3 x 4.9 SOIC (D) 8 29.4 mm² 4.9 x 6
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V – 5.5 V
  • Power Supply Rejection at 217 Hz
    • 84 dB at VDD = 5 V
    • 81 dB at VDD = 3.3 V
  • Output Power for RL = 8
    • 700 mW at VDD = 5 V
    • 250 mW at VDD = 3.3 V
  • Ultralow Supply Current in Shutdown Mode . . . 1.5 nA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP
    • MicroStar Junior™ (BGA)

PowerPAD and MicroStar Junior are trademarks of Texas Instruments.
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V – 5.5 V
  • Power Supply Rejection at 217 Hz
    • 84 dB at VDD = 5 V
    • 81 dB at VDD = 3.3 V
  • Output Power for RL = 8
    • 700 mW at VDD = 5 V
    • 250 mW at VDD = 3.3 V
  • Ultralow Supply Current in Shutdown Mode . . . 1.5 nA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP
    • MicroStar Junior™ (BGA)

PowerPAD and MicroStar Junior are trademarks of Texas Instruments.

The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA751 is available in a 3.0 × 3.0 mm MicroStar Junior™ (BGA), 8-pin SOIC surface-mount package and a surface-mount PowerPAD™ MSOP.

The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA751 is available in a 3.0 × 3.0 mm MicroStar Junior™ (BGA), 8-pin SOIC surface-mount package and a surface-mount PowerPAD™ MSOP.
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LM4890 활성 1와트 오디오 전원 증폭기 Higher output power, improved noise elimination

기술 자료

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* Data sheet 700-mW Mono Low-Voltage Audio Power Amplifier with Differential Inputs datasheet (Rev. C) 2002/10/18

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

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