TS3A27518E-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 2: –40°C to 105°C ambient operating temperature range
- Device HBM ESD classification level H2
- Device CDM ESD classification level C3B
- Functional Safety-Capable
- 1.65-V to 3.6-V single-supply operation
- Powered-off protection (isolation in powerdown mode, Hi-Z when V+ = 0)
- Low capacitance switches, 21.5 pF (typical)
- Bandwidth up to 240 MHz for high-speed rail-to-rail signal handling
- Crosstalk and off isolation of −62 dB
- 1.8-V logic threshold compatibility for control inputs
- 3.6-V tolerant control inputs
- ESD performance: NC/NO ports
- ±6-kV contact discharge (IEC 61000-4-2)
- 24-pin TSSOP (7.80 mm × 4.40 mm) and 24-pin QFN (4.00 mm × 4.00 mm) package
The TS3A27518E-Q1 is a 6-bit 1-of-2 multiplexer-demultiplexer designed to operate from 1.65 V to 3.6 V. This device can handle both digital and analog signals, and signals up to V+ can be transmitted in either direction. The TS3A27518E-Q1 has two control pins, each controlling three 1-of-2 muxes at the same time, and an enable pin that is used to put all outputs in high-impedance mode. The control pins are compatible with 1.8-V logic thresholds and are backward compatible with 2.5-V and 3.3-V logic thresholds as well.
The TS3A27518E-Q1 allows any SD, SDIO, and multimedia card host controllers to be expanded out to multiple cards or peripherals because the SDIO interface consists of 6-bits: CMD, CLK, and Data[0:3] signals. The TS3A27518E-Q1 has two control pins that give additional flexibility to the user, for example, the ability to mux two different audio-video signals in equipment such as an LCD television, an LCD monitor, or a notebook docking station.
기술 자료
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
TSSOP (PW) | 24 | Ultra Librarian |
WQFN (RTW) | 24 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.