TS3DS10224

Name: TS3DS10224
Brand: TI
SKU: TS3DS10224
Price: 0.285 USD

활성

3.3V, 4:1 차동 1채널 또는 2:1 차동 2채널 아날로그 멀티플렉서

지금 주문

데이터 시트

document-pdfAcrobat TS3DS10224 High-Speed Differential Crosspoint, 1:4 Differential Multiplexer and Demultiplexer, 2 Channel Differential 1:2 Multiplexer and Demultiplexer, or Fan-Out Switch datasheet (Rev. E) (영어) PDF | HTML

TS3DS10224

활성

데이터 시트

지금 주문

제품 상세 정보

Protocols

USB 2.0

Configuration

Crosspoint/exchange

Number of channels

2

Bandwidth (MHz)

1200

Supply voltage (max) (V)

3.6

Supply voltage (min) (V)

3

Ron (typ) (mΩ)

13000

Input/output voltage (min) (V)

0

Input/output voltage (max) (V)

3.6

Supply current (typ) (µA)

50

ESD HBM (typ) (kV)

2.5

Operating temperature range (°C)

-40 to 85

Crosstalk (dB)

Yes

ESD CDM (kV)

1

Input/output continuous current (max) (mA)

100

COFF (typ) (pF)

6

CON (typ) (pF)

12

Off isolation (typ) (dB)

-30

OFF-state leakage current (max) (µA)

5

Propagation delay time (µs)

0.00005

Ron (max) (mΩ)

19000

Ron channel match (max) (Ω)

2.5

RON flatness (typ) (Ω)

4

Turnoff time (disable) (max) (ns)

100

Turnon time (enable) (max) (ns)

30

VIH (min) (V)

2.3

VIL (max) (V)

0.6

Protocols

USB 2.0

Configuration

Crosspoint/exchange

Number of channels

2

Bandwidth (MHz)

1200

Supply voltage (max) (V)

3.6

Supply voltage (min) (V)

3

Ron (typ) (mΩ)

13000

Input/output voltage (min) (V)

0

Input/output voltage (max) (V)

3.6

Supply current (typ) (µA)

50

ESD HBM (typ) (kV)

2.5

Operating temperature range (°C)

-40 to 85

Crosstalk (dB)

Yes

ESD CDM (kV)

1

Input/output continuous current (max) (mA)

100

COFF (typ) (pF)

6

CON (typ) (pF)

12

Off isolation (typ) (dB)

-30

OFF-state leakage current (max) (µA)

5

Propagation delay time (µs)

0.00005

Ron (max) (mΩ)

19000

Ron channel match (max) (Ω)

2.5

RON flatness (typ) (Ω)

4

Turnoff time (disable) (max) (ns)

100

Turnon time (enable) (max) (ns)

30

VIH (min) (V)

2.3

VIL (max) (V)

0.6

WQFN (RUK)

20

9 mm² 3 x 3

Can be configured for
- Differential Crosspoint Switching
- Differential Single Channel 1:4 Multiplexer and Demultiplexer
- Differential 2-Channel 1:2 Multiplexer and Demultiplexer
- Differential Fan-Out of Signal Pair to Two Ports Simultaneously
Bidirectional Operation
Fail-Safe Protection: I_OFF Protection Prevents Current Leakage in Powered-Down State
(V_CC = 0 V)
High BW (1.2 GHz Typical)
Low R_ON and C_ON:
- 13-Ω R_ON Typical
- 9-pF C_ON Typical
ESD Performance (I/O Pins)
- ±8-kV Contact Discharge (IEC61000-4-2)
- 2-kV Human-Body Model per JESD22-A114E (to GND)
ESD Performance (All Pins)
- 2-kV Human-Body Model per JESD22-A114E
Small WQFN package (3.00 mm × 3.00 mm,
0.4-mm pitch)

Can be configured for
- Differential Crosspoint Switching
- Differential Single Channel 1:4 Multiplexer and Demultiplexer
- Differential 2-Channel 1:2 Multiplexer and Demultiplexer
- Differential Fan-Out of Signal Pair to Two Ports Simultaneously
Bidirectional Operation
Fail-Safe Protection: I_OFF Protection Prevents Current Leakage in Powered-Down State
(V_CC = 0 V)
High BW (1.2 GHz Typical)
Low R_ON and C_ON:
- 13-Ω R_ON Typical
- 9-pF C_ON Typical
ESD Performance (I/O Pins)
- ±8-kV Contact Discharge (IEC61000-4-2)
- 2-kV Human-Body Model per JESD22-A114E (to GND)
ESD Performance (All Pins)
- 2-kV Human-Body Model per JESD22-A114E
Small WQFN package (3.00 mm × 3.00 mm,
0.4-mm pitch)

The TS3DS10224 device is a bidirectional differential crosspoint, 1:4, or 1:2 multiplexer and demultiplexer; or fan-out switch for high-speed differential signal applications (up to 720 Mbps). The TS3DS10224 logic table can route any input to any output creating a wide range of possible switching or multiplexing configurations. Common configurations include: differential crosspoint switching, differential 1:4 mux, or differential 2-channel 1:2 multiplexer and demultiplexer. The TS3DS10224 offers a high BW of 1.2 GHz with channel R_ON of 13 Ω (typical).

The TS3DS10224 can also be used to fan out a differential signal pair to two ports simultaneously (fan-out configuration). The BW performance is lower in this configuration.

The TS3DS10224 operates with a 3-V to 3.6-V power supply. It features ESD protection of up to ±8-kV contact discharge and 2-kV human-body model on its I/O pins.

The TS3DS10224 provides fail-safe protection by isolating the I/O pins with high impedance when the power supply (V_CC) is not present.

The TS3DS10224 device is a bidirectional differential crosspoint, 1:4, or 1:2 multiplexer and demultiplexer; or fan-out switch for high-speed differential signal applications (up to 720 Mbps). The TS3DS10224 logic table can route any input to any output creating a wide range of possible switching or multiplexing configurations. Common configurations include: differential crosspoint switching, differential 1:4 mux, or differential 2-channel 1:2 multiplexer and demultiplexer. The TS3DS10224 offers a high BW of 1.2 GHz with channel R_ON of 13 Ω (typical).

The TS3DS10224 can also be used to fan out a differential signal pair to two ports simultaneously (fan-out configuration). The BW performance is lower in this configuration.

The TS3DS10224 operates with a 3-V to 3.6-V power supply. It features ESD protection of up to ±8-kV contact discharge and 2-kV human-body model on its I/O pins.

The TS3DS10224 provides fail-safe protection by isolating the I/O pins with high impedance when the power supply (V_CC) is not present.

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3개 모두 보기

	유형	직함		날짜
*	Data sheet	TS3DS10224 High-Speed Differential Crosspoint, 1:4 Differential Multiplexer and Demultiplexer, 2 Channel Differential 1:2 Multiplexer and Demultiplexer, or Fan-Out Switch datasheet (Rev. E)	PDF \| HTML	2019/10/17
	Application note	Preventing Excess Power Consumption on Analog Switches		2008/07/03
	Application note	Semiconductor Packing Material Electrostatic Discharge (ESD) Protection		2004/07/08

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The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.

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