TS3L501E
- Integrated power-down mode
- Wide bandwidth (BW = 600 MHz typical)
- Low crosstalk (XTALK = –37 dB typical at 250 MHz)
- Low bit-to-bit skew (tsk(o) = 100 ps maximum)
- Low and Flat ON-State Resistance (ron = 4 Ω typical, ron(flat) = 0.5 Ω typical)
- Low input and output capacitance (CON = 9 pF typical)
- Rail-to-rail switching on data I/O ports (0 V to 3.6 V)
- VCC operating range from: 3 V to 3.6 V
- Support power-down mode
- Latch-up performance exceeds 100 mA per JESD 78, class II
- ESD performance (A, B, C, and LED pins)
- ±4-kV IEC61000-4-2, Contact Discharge
- 6-kV Human Body Model per JESD22-A114E (switch I/O pins to GND)
- ESD performance (all pins)
- 2-kV Human Body Model per JESD22-A114E
The TS3L501E is a 11-channel SPDT analog switch or 22-bit to 11-bit multiplexer or demultiplexer LAN switch with a single select (SEL) input and Power-Down Mode input. The device provides additional I/Os for switching status indicating LED signals and includes high ESD protection. SEL input controls the data path of the multiplexer or demultiplexer. Power-down input can put the device into the standby mode for minimizing current consumption per mode selection.
The device provides a low and flat ON-state resistance (ron) and an excellent ON-state resistance match. Low input or output capacitance, high bandwidth, low skew, and low crosstalk among channels make this device suitable for various LAN applications, such as 10/100/1000 Base-T. This device can be used to replace mechanical relays in LAN applications. It also can be used to route signals from a 10/100 Base-T Ethernet transceiver to the RJ-45 LAN connectors in laptops or in docking stations.
It is characterized for operation over the free-air temperature range of –40°C to 85°C.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TS3L501E 11-Channel SPDT/22-Bit to 11-Bit Multiplexer and Demultiplexer Ethernet LAN Switch With Power-Down Mode datasheet (Rev. D) | PDF | HTML | 2022/10/18 |
Application note | Preventing Excess Power Consumption on Analog Switches | 2008/07/03 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 |
설계 및 개발
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
WQFN (RUA) | 42 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.