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비교 대상 장치보다 업그레이드된 기능을 지원하는 드롭인 대체품
TS3USB30E 활성 단일 활성화 및 ESD 보호를 지원하는 고속 USB 2.0 1:2 Mux/Demux 스위치 Improved ESD protection

제품 상세 정보

Protocols USB 2.0 Configuration 2:1 SPDT Number of channels 2 Bandwidth (MHz) 955 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 6000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 4.3 Supply current (typ) (µA) 1 ESD HBM (typ) (kV) 6 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -56 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 64 COFF (typ) (pF) 2 CON (typ) (pF) 7 Off isolation (typ) (dB) -39 OFF-state leakage current (max) (µA) 2 Propagation delay time (µs) 0.00025 Ron (max) (mΩ) 10000 Ron channel match (max) (Ω) 0.35 RON flatness (typ) (Ω) 2 Turnoff time (disable) (max) (ns) 25 Turnon time (enable) (max) (ns) 30 VIH (min) (V) 1.3 VIL (max) (V) 0.7
Protocols USB 2.0 Configuration 2:1 SPDT Number of channels 2 Bandwidth (MHz) 955 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 6000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 4.3 Supply current (typ) (µA) 1 ESD HBM (typ) (kV) 6 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -56 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 64 COFF (typ) (pF) 2 CON (typ) (pF) 7 Off isolation (typ) (dB) -39 OFF-state leakage current (max) (µA) 2 Propagation delay time (µs) 0.00025 Ron (max) (mΩ) 10000 Ron channel match (max) (Ω) 0.35 RON flatness (typ) (Ω) 2 Turnoff time (disable) (max) (ns) 25 Turnon time (enable) (max) (ns) 30 VIH (min) (V) 1.3 VIL (max) (V) 0.7
UQFN (RSW) 10 2.52 mm² 1.8 x 1.4
  • VCC Operation at 3 V and 4.3 V
  • 1.8-V Compatible Control-Pin Inputs
  • IOFF Supports Partial Power-Down-Mode
    Operation
  • Ron = 10 Ω Maximum
  • ΔRon <0.35 Ω Typical
  • Cio(ON) = 7 pF Typical
  • Low Power Consumption (1 µA Maximum)
  • ESD Performance Tested Per JESD 22
    • 6000-V Human Body Model (HBM)
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
    • 250-V Machine Model (A115-A)
  • –3-dB Bandwidth = 955 MHz Typical
  • Packaged in 10-pin UQFN (1.4 mm × 1.8 mm)
  • VCC Operation at 3 V and 4.3 V
  • 1.8-V Compatible Control-Pin Inputs
  • IOFF Supports Partial Power-Down-Mode
    Operation
  • Ron = 10 Ω Maximum
  • ΔRon <0.35 Ω Typical
  • Cio(ON) = 7 pF Typical
  • Low Power Consumption (1 µA Maximum)
  • ESD Performance Tested Per JESD 22
    • 6000-V Human Body Model (HBM)
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
    • 250-V Machine Model (A115-A)
  • –3-dB Bandwidth = 955 MHz Typical
  • Packaged in 10-pin UQFN (1.4 mm × 1.8 mm)

The TS3USB30 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (955 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

The TS3USB30 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (955 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

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기술 자료

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6개 모두 보기
유형 직함 날짜
* Data sheet High-Speed USB 2.0 1:2 Multiplexer/Demultiplexer Switch With Single Enable* datasheet (Rev. F) 2015/08/14
Application note Passive Mux Selection Based On Bandwidth (Rev. A) PDF | HTML 2024/07/31
Application note Crosspoint Switch with TS3USB30 Device 2018/08/02
Application note High-Speed Layout Guidelines for Signal Conditioners and USB Hubs 2018/06/14
Application note Preventing Excess Power Consumption on Analog Switches 2008/07/03
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08

설계 및 개발

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패키지 CAD 기호, 풋프린트 및 3D 모델
UQFN (RSW) 10 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

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