CSD87330Q3D
- Half-Bridge Power Block
- Up to 27-V VIN
- 90% System Efficiency at 15 A
- Up to 20-A Operation
- High-Frequency Operation (Up to 1.5 MHz)
- High-Density SON 3.3-mm × 3.3-mm Footprint
- Optimized for 5-V Gate Drive
- Low-Switching Losses
- Ultra-Low Inductance Package
- RoHS Compliant
- Halogen Free
- Lead-Free Terminal Plating
The CSD87330Q3D NexFET™ power block is an optimized design for synchronous buck applications offering high-current, high-efficiency, and high-frequency capability in a small 3.3-mm × 3.3-mm outline. Optimized for 5-V gate drive applications, this product offers a flexible solution capable of offering a high-density power supply when paired with any 5-V gate drive from an external controller/driver.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | CSD87330Q3D Synchronous Buck NexFET™ Power Block datasheet (Rev. D) | PDF | HTML | 2016年 12月 6日 |
Application note | MOSFET Support and Training Tools (Rev. F) | PDF | HTML | 2024年 6月 14日 | |
Application note | Semiconductor and IC Package Thermal Metrics (Rev. D) | PDF | HTML | 2024年 3月 25日 | |
Application note | QFN and SON PCB Attachment (Rev. C) | PDF | HTML | 2023年 12月 6日 | |
Application brief | Tips for Successfully Paralleling Power MOSFETs | PDF | HTML | 2022年 5月 31日 | |
Selection guide | Power Management Guide 2018 (Rev. R) | 2018年 6月 25日 | ||
Application note | Ringing Reduction Techniques for NexFET High Performance MOSFETs | 2011年 11月 16日 | ||
Application note | PowerStack™ Packaging Technology Overview | 2011年 7月 18日 |
設計與開發
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訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
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