DRV8870
- H-Bridge Motor Driver
- Drives One DC Motor, One Winding of a Stepper Motor, or Other Loads
- Wide 6.5-V to 45-V Operating Voltage
- 565-mΩ Typical RDS(on) (HS + LS)
- 3.6-A Peak Current Drive
- PWM Control Interface
- Integrated Current Regulation
- Low-Power Sleep Mode
- Small Package and Footprint
- 8-Pin HSOP With PowerPAD™
- 4.9 × 6.0 mm
- Integrated Protection Features
- VM Undervoltage Lockout (UVLO)
- Overcurrent Protection (OCP)
- Thermal Shutdown (TSD)
- Automatic Fault Recovery
The DRV8870 device is a brushed-DC motor driver for printers, appliances, industrial equipment, and other small machines. Two logic inputs control the H-bridge driver, which consists of four N-channel MOSFETs that can control motors bidirectionally with up to 3.6-A peak current. The inputs can be pulse-width modulated (PWM) to control motor speed, using a choice of current-decay modes. Setting both inputs low enters a low-power sleep mode.
The DRV8870 device features integrated current regulation, based on the analog input VREF and the voltage on the ISEN pin, which is proportional to motor current through an external sense resistor. The ability to limit current to a known level can significantly reduce the system power requirements and bulk capacitance needed to maintain stable voltage, especially for motor startup and stall conditions.
The device is fully protected from faults and short circuits, including undervoltage (UVLO), overcurrent (OCP), and overtemperature (TSD). When the fault condition is removed, the device automatically resumes normal operation.
技術文件
設計與開發
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DRV8870EVM — DRV8870 H 橋 PWM 馬達驅動器評估模組
The DRV8870 evaluation module (EVM) demonstrates the capabilities and performance of the DRV8870 integrated circuit from Texas Instruments. The EVM includes a 5V regulator and PWM generator. A single power source is required to evaluate the DRV8870.
TIDA-01588 — 適用於有刷直流伺服驅動的 10.8-V/15-W、>90% 效率、2.4-cm2、功率級參考設計
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HSOIC (DDA) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。