DS90UB913A-Q1

現行

25 至 100 MHz、10 位元和 12 位元 FPD-Link III 串聯器

產品詳細資料

Applications Advanced Driver Assistance Systems (ADAS) Input compatibility LVCMOS Function Serializer Output compatibility FPD-Link III LVDS Color depth (bpp) 12 Features Low-EMI Point-to-Point Communication Signal conditioning Adaptive Equalizer EMI reduction LVDS Diagnostics BIST Rating Automotive Operating temperature range (°C) -40 to 105
Applications Advanced Driver Assistance Systems (ADAS) Input compatibility LVCMOS Function Serializer Output compatibility FPD-Link III LVDS Color depth (bpp) 12 Features Low-EMI Point-to-Point Communication Signal conditioning Adaptive Equalizer EMI reduction LVDS Diagnostics BIST Rating Automotive Operating temperature range (°C) -40 to 105
WQFN (RTV) 32 25 mm² 5 x 5
  • AEC-Q100 qualified for automotive applications
    • Device temperature grade 2: –40℃ to +105℃ ambient operating temperature
  • 25-MHz to 100-MHz input pixel clock support
  • Programmable data payload:
    • 10-Bit payload up to 100 MHz
    • 12-Bit payload up to 75 MHz
  • Continuous low latency bidirectional control interface channel with I2C support at 400 kHz
  • Embedded clock with DC-balanced coding to support AC-coupled interconnects
  • Capable of driving up to 15m coaxial or 20m shielded twisted-pair cables
  • Robust Power-Over-Coaxial (PoC) operation
  • 4 Dedicated general purpose input/output
  • 1.8-V, 2.8-V, or 3.3-V-compatible parallel inputs on serializer
  • Single power supply at 1.8 V
  • ISO 10605 and IEC 61000-4-2 ESD compliant
  • Small serializer footprint (5 mm × 5 mm)
  • AEC-Q100 qualified for automotive applications
    • Device temperature grade 2: –40℃ to +105℃ ambient operating temperature
  • 25-MHz to 100-MHz input pixel clock support
  • Programmable data payload:
    • 10-Bit payload up to 100 MHz
    • 12-Bit payload up to 75 MHz
  • Continuous low latency bidirectional control interface channel with I2C support at 400 kHz
  • Embedded clock with DC-balanced coding to support AC-coupled interconnects
  • Capable of driving up to 15m coaxial or 20m shielded twisted-pair cables
  • Robust Power-Over-Coaxial (PoC) operation
  • 4 Dedicated general purpose input/output
  • 1.8-V, 2.8-V, or 3.3-V-compatible parallel inputs on serializer
  • Single power supply at 1.8 V
  • ISO 10605 and IEC 61000-4-2 ESD compliant
  • Small serializer footprint (5 mm × 5 mm)

The DS90UB913A-Q1 device offers an FPD-Link III interface with a high-speed forward channel and a bidirectional control channel for data transmission over a single coaxial cable or differential pair. The DS90UB913A-Q1 device incorporates differential signaling on both the high-speed forward channel and bidirectional control channel data paths. The serializer/deserializer pair is targeted for connections between imagers and video processors in an ECU (Electronic Control Unit). This device is ideally suited for driving video data requiring up to 12-bit pixel depth plus two synchronization signals along with bidirectional control channel bus.

Using TI’s embedded clock technology allows transparent full-duplex communication over a single differential pair, carrying asymmetrical-bidirectional control channel information. This single serial stream simplifies transferring a wide data bus over PCB traces and cable by eliminating the skew problems between parallel data and clock paths. This significantly saves system cost by narrowing data paths that in turn reduce PCB layers, cable width, and connector size and pins. Internal DC-balanced encoding/decoding is used to support AC-coupled interconnects.

The DS90UB913A-Q1 device offers an FPD-Link III interface with a high-speed forward channel and a bidirectional control channel for data transmission over a single coaxial cable or differential pair. The DS90UB913A-Q1 device incorporates differential signaling on both the high-speed forward channel and bidirectional control channel data paths. The serializer/deserializer pair is targeted for connections between imagers and video processors in an ECU (Electronic Control Unit). This device is ideally suited for driving video data requiring up to 12-bit pixel depth plus two synchronization signals along with bidirectional control channel bus.

Using TI’s embedded clock technology allows transparent full-duplex communication over a single differential pair, carrying asymmetrical-bidirectional control channel information. This single serial stream simplifies transferring a wide data bus over PCB traces and cable by eliminating the skew problems between parallel data and clock paths. This significantly saves system cost by narrowing data paths that in turn reduce PCB layers, cable width, and connector size and pins. Internal DC-balanced encoding/decoding is used to support AC-coupled interconnects.

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技術文件

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重要文件 類型 標題 格式選項 日期
* Data sheet DS90UB913A-Q1 25-MHz to 100-MHz 10/12-Bit FPD-Link III Serializer datasheet (Rev. G) 2020年 11月 4日
Application note FPD-Link ADAS Power-Over-Coax Design Guidelines (Rev. B) PDF | HTML 2025年 10月 24日
Analog Design Journal Analog Applications Journal 3Q 2015 2015年 7月 24日
Analog Design Journal Ten tips for successfully designing with automotive EMC/EMI requirements 2015年 7月 24日
Application note Cable Requirements for the DS90UB913A and DS90UB914A 2014年 10月 14日
Application note I2C Communication over DS90UB913/4 FPD Link-III with BCC 2013年 4月 22日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

DS90UB913A-CXEVM — FPD-Link III 串聯器評估模組

DS90UB913A_CXEVM 評估模組 (EVM) 可協助您評估 DS90UB913A-Q1 25MHz 至 100MHz FPD-Link III 串聯器 (SER) 的運作及性能。此裝置將 10 和 12 位元的 LVCMOS 資料轉換為高速序列化 FPD-Link III 介面,並透過一根 50Ω 的同軸纜線進行傳輸。

DS90UB913A_CXEVM 板卡配備一個 0.1 吋的 IDC 連接器介面,並在 FPD-Link III 輸出端設有一個 SMB 同軸連接器。

此 EVM 搭載一個串聯器裝置。

使用指南: PDF
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應用軟體及架構

ALP Analog LaunchPad Framework Utility

Analog LaunchPad (ALP) software is an interactive graphical user interface (GUI) software platform to evaluate TI FPD-Link™ serializers and deserializers (SerDes). ALP software enables device- and system-level evaluation with powerful built-in features, including:

  • Local and remote device access
  • (...)
支援產品和硬體

支援產品和硬體

支援軟體

ALP-PROFILE-UPDATE Analog LaunchPad Profile Update Software

Analog LaunchPad (ALP) software is an interactive graphical user interface (GUI) software platform to evaluate TI FPD-Link™ serializers and deserializers (SerDes). ALP software enables device- and system-level evaluation with powerful built-in features, including:

  • Local and remote device access
  • (...)
支援產品和硬體

支援產品和硬體

模擬型號

DS90UB913AQ1 IBIS Model (Rev. A)

SNLM158A.ZIP (93 KB) - IBIS Model
模擬工具

PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI 是有助於評估類比電路功能的設計和模擬環境。這款全功能設計和模擬套件使用 Cadence® 的類比分析引擎。PSpice for TI 包括業界最大的模型庫之一,涵蓋我們的類比和電源產品組合,以及特定類比行為模型,且使用無需支付費用。

PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前,建立完整的終端設備設計和解決方案原型,進而縮短上市時間並降低開發成本。 

在 PSpice for TI 設計與模擬工具中,您可以搜尋 TI (...)
模擬工具

TINA-TI — 基於 SPICE 的類比模擬程式

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
使用指南: PDF
參考設計

TIDA-00535 — 適用於汽車 CMOS 成像元件和數據串聯器的電源管理解決方案參考設計

The TIDA-00535 reference design provides a power management solution for automotive imaging system using the voltage regulators LP5907-Q1, LP5907 and LM436002-Q1 to provide low noise  voltage rails of 1.5V , 1.8 V and 3.3 V to CMOS high dynamic range camera, DS90UB913A-Q1 FPD-Link Serializer (...)
Design guide: PDF
電路圖: PDF
參考設計

TIDA-01002 — 採用 YUV422 輸出、FPD-Link III 和同軸電纜供電技術的車用 100 萬像素攝影機模組參考設計

TIDA-01002 參考設計提供未壓縮的 1 百萬像素、HDR、YUV422 視訊,以用於 ADAS 和資訊娛樂系統。此參考設計使用 TI 的 FPD-Link III SerDes 技術和 ON Semiconductor® AS0140AT CMOS 成像元件,透過單一同軸纜線同時傳輸視訊資料、雙向控制訊號及電源。此設計可用於環景系統與後視攝影機,或取代類比或乙太網路攝影機。
Design guide: PDF
電路圖: PDF
參考設計

TIDA-01003 — 採用 YUV422、FPD-Link III 和 4V-36V 同軸電纜供電技術的車用 100 萬像素攝影機模組參考設計

此款車用 100 萬畫素攝影模組參考設計採用 CMOS 成像元件,透過 FPD-Link III 輸出多種未經壓縮的視訊格式。支援的影片格式為 8 位元和 10 位元的 YUV422。TI 的 FPD-Link III SerDes 技術可透過單一同軸纜線同時傳輸視訊資料、雙向控制訊號及電源。此設計的輸入電壓範圍為 4V 至 36V,具備「電池短路」防護功能,適用於先進駕駛輔助與資訊娛樂系統,例如環景顯示系統、後視攝影機、駕駛監控、智慧後視鏡,也可以取代類比或乙太網路攝影機。
Design guide: PDF
電路圖: PDF
參考設計

TIDA-00421 — 採用 OV10640、DS90UB913A 和同軸電纜供電技術的車用 130 萬像素攝影機模組參考設計

This camera design demonstrates a very small solution size for 1.3 Megapixel automotive cameras. Only a single coax connection is required to provide digital video, power, camera control and diagnostics. Output video format is 10-bit up to 100MHz or 12-bit up to 75MHz.
Design guide: PDF
電路圖: PDF
參考設計

TIDA-00262 — 適用於同軸未壓縮數位視訊的最佳化汽車 1 百萬像素攝影機模組設計

The TIDA-00262 Reference Design is a high speed serial video interface to connect a remote automotive camera module to a display or machine vision processing system. It uses TIs FPD-Link III SerDes technology to transmit uncompressed MegaPixel video data, bidirectional control signals and power (...)
Design guide: PDF
電路圖: PDF
參考設計

TIDA-00162 — 適用於車用環景顯示系統的多攝影機、視訊介面及控制解決方案

TIDA-00162 incorporates the  complete  camera module, video interface  and control functionality for surround view systems for automotive applications. The reference design includes four 1 Mp cameras (OmniVision OV10635), four Serializer+Power boards and a daughter board with 6 (...)
Design guide: PDF
電路圖: PDF
參考設計

TIDA-00133 — 適用於車用百萬像素 CMOS 攝影機的未壓縮數位視訊 SerDes (透過同軸電纜傳輸) 參考設計

The TIDA-00133 reference design is a high speed serial video interface to connect a remote automotive camera module to a display or machine vision processing system. It uses TIs FPD-Link III SerDes technology to transmit uncompressed MegaPixel video data, bidirectional control signals and power (...)
Design guide: PDF
電路圖: PDF
參考設計

TIDA-00098 — Aptina™ 車用攝影機模組參考設計

The reference design is an automotive camera module solution with Aptina image sensor and processor, and TI FPD-Link III serializer. The module features the AR0132AT 1.2Mp image sensor, the AP0101AT image signal processor (ISP) from Aptina, and the LM34919C, TPS62231 buck regulator and (...)
Test report: PDF
電路圖: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
WQFN (RTV) 32 Ultra Librarian

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  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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